Abstract: A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced.

Abstract: A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced.

Abstract: A space-minimized flash drive has a USB connector and a body, where the flash drive comprises a printed circuit board, a plurality of contact fingers, one or more memory devices, and a controller. The printed circuit board has a component section located inside the body and an insertion section extending into and located inside the USB connector. The memory device is disposed on the component section. The contact fingers are disposed on the top surface of the insertion section. The controller is disposed on the bottom surface of the insertion section located inside the USB connector. The footprint occupied by the controller and the corresponding empty footprint are saved to effectively reduce the length of the flash drive to miniaturize flash drives without interfering with the electrical connections of the contact fingers when plugging in the flash drive.

Abstract: A modular linking assembly of memory module packages primarily comprises a plurality of memory module components and at least a flexible connector. A plurality of USB contact fingers and a plurality of expanding fingers are formed on two opposing sides of the outer surface on each memory module component. The flexible connector has a first casing, a second casing and a plastic elastomer connecting the first casing to the second casing. The first casing has a plurality of first connecting terminals for electrically contacting the expanding fingers. The second casing has a plurality of second connecting terminals for electrically contacting the USB contact fingers. The plastic elastomer has a plurality of conductive wiring electrically connecting the first terminals to the second terminals so that the connected memory module components are electrically connected to each other to increase readable memory capacities with only one USB slot.

Abstract: A digital storage device mounted in a pen shaped housing has a barrel, a reservoir tube assembly and a memory device with a USB plug. The memory device is held in the barrel and the USB plug can be extended from the barrel to insert into a USB socket of a computer to access digital data from the computer. In addition, the memory device uses a flash memory IC for storing data so that the memory device does not use a battery. Therefore, the digital storage device can be used to store data and to perform other functions such as writing.

Abstract: A high-density storage device has a housing and a memory and controller assembly. The housing has a plug part and a socket part receiving the plug part of other high-density storage device. The memory and controller assembly is mounted in the housing and has a circuit board, a source controller integrated circuit and a memory integrated circuit. The circuit board has an upper surface and a bottom surface. The source controller integrated circuit is mounted on the bottom surface. The memory integrated circuit is mounted on the bottom surface of the circuit board. Because the source controller integrated circuit and the memory integrated circuit are mounted on the same side of the circuit board, so high-density storage device has a reduced size. Furthermore, the socket part may connect with another high-density storage devices.

Abstract: A portable USB memory device has a housing, a memory and driver board and a USB plug. The memory and driver board has a memory IC, a driver IC and some electronic components so that the thickness of the memory device is decreased and the memory device is only 3 times larger than the USB plug. The memory device is small enough small to adapt to mount in an external housing, which further is adapted to attach to other devices like key chains, belts, etc.