Abstract: An ultrasonic technique for remotely inspecting a body is described. A transducer (14), capable of generating and detecting ultrasonic signals, is coupled to the body. An ultrasonic signal (A.sub.o) is launched by the transducer (14) into the body (e.g. 10, 11) and is reflected by any imperfection (e.g. 12) therein. The effects of variations of the transmission coefficient between the transducer and the body are substantially eliminated by intentionally cutting a predetermined calibration notch (22) into the body under test. The analysis of the reflected ultrasonic signals at the notch (22) and at any imperfection (e.g. 12) within the body gives an indication of the quality of the body independently of the transducer/body transmission coefficient.

Abstract: A method of forming adherent metallized coatings on a substrate which is useful for the manufacture of printed circuit boards as well as other metal coated articles involves providing the substrate with a rubber-modified epoxy surface or coating, sputter etching at least 50 A. from the surface followed by vacuum depositing an adherent thin metal film of Cr, Ni, Ni-V alloy, Pt, Pd or Ti onto the substrate. Another metal layer is then provided over the adherent thin film.

Abstract: An electronic device assembly (11) includes a heat dissipating substrate (18) having a seat (16). A device (14) is uniformly spaced from a base surface of the seat (16), and a layer of solder of uniform thickness occupies a gap between the surface of the seat and the device. Leads (31) and (33) extend at a shallow, acute angle from the device. A lead (32) is mounted to a support (28) extending from the substrate (18). Inner portions of the leads (31, 32, 33), the device (14) and portions of the substrate (18), are encased by an envelope (22), while outer portions (67) of the leads and a mounting tab (19) of the substrate extend from the envelope.

Abstract: A cable which is capable of being made in a large pair size and yet which has excellent mechanical properties that maintain its integrity notwithstanding extremes in temperature during installation and shipping as well as during the rigors of installation includes a sheath system having a corrugated steel outer shield that is adhesively bonded to a plastic jacket. The corrugated steel shield which is formed to have a longitudinal overlapped seam that is preferably unsealed encloses an aluminum inner shield that in turn encloses a multiconductor core. Advantageously, the sheath system includes a plastic jacketing material which is capable of resisting biaxial stresses which are aggravated in a bonded sheath system. This results in jacket integrity about the longitudinal seam of the outer shield notwithstanding a notched cross-section and an unsupported bridged portion of the plastic jacket adjacent to the seam.

Abstract: A tool (10) for handling a magnetic article (50) includes a member (12) having a jaw (18) which is movable toward and away from a member (14) having a corresponding jaw (14). A holder (34) is associated with jaw (20) of member (14) for releasably holding an article (50) in cooperation with a magnetic field. A magnet (42) is associated with and removably applied by jaw (18) of member (12) in stages. To pick up an article (50), magnet (42) is moved by member (12) to establish a magnetic field at holder (34). To release an article (50), magnet (42) is withdrawn by member (12) to withdraw the magnetic field from holder (34). The article (50) is restrained at holder (34) until gravitational force overcomes the attraction of the withdrawing field and the article separates from tool (10).

Abstract: The formation of dross in a molten solder bath (28) by surface agitation of the bath, and the adverse effects of dross on a solder pumping operation, are essentially eliminated by suspending a pump shaft (36) and an impeller (38) thereon for free rotation within a housing (96) in the molten solder bath so that solder in the solder bath is precluded from making any significant contact with the rotating shaft. To insure against binding between the impeller (38) and an opposed horizontal inner surface (132) of the housing (96), a small amount of solder is permitted to flow continuously between the impeller and the surface into contact with the rotating shaft (36) adjacent the impeller. The small solder flow then is exposed to the atmosphere to form a correspondingly small amount of light powdery solder dross (134).

Abstract: The cost and energy efficiency of a power supply are optimized in a semi-regulated circuit wherein regulation occurs only under a high voltage, low current condition when peak output voltage would otherwise exceed a maximum specified voltage. The circuit includes a full wave rectifier (21-24) driving a modified pi filter (33-35). A transistor (62) in series with the filter is biased by a resistor (65) to normally operate in a fully saturated, low power dissipating mode. When the output (31-32) voltage approaches the specified maximum, the breakdown voltage of a zener diode (71) is exceeded, and the output voltage is clamped to the specified maximum through the zener diode and the base-emitter junction of the transistor.

Abstract: An assembly is provided for selecting at least one vertically oriented planate article such as a disc-shaped wafer (10) from an array of such wafers. A carrier (20) holds the wafers (10) in a mutually spaced, substantially parallel relationship along a single horizontal file. Peripheral portions of each wafer (10) are supported in opposing guides (26) formed generally vertically along opposing first and second sidewalls (22) and (24), respectively, of the carrier (20). A frame (42) positions the carrier (20) so the file of wafers (10) extends substantially along a vertical plane (44) passing generally centrally of each wafer and of the frame (32). A rotatable shaft (62) extends parallel to the file and subjacent of the wafers (10). For selecting a singular wafer (10), at least one cam (64) is mounted to and rotates with the shaft (62) for engaging and displacing a randomly selected wafer (10) a desired distance upwardly along the guides (26) of the carrier (20).

Abstract: A method is described for recovering palladium from spent catalytic colloidal palladium baths by dissolving the palladium to form a true solution followed by electrodeposition employing a nickel anode and a nickel or copper cathode.

Abstract: An exhaust system (3) for a vapor-phase axial deposition (VAD) system (5) is comprised of the serial combination of an exhaust tube (26), an outlet pipe (27), a soot collection chamber (32) and a discharge line (34). The exhaust tube (26) has a constricted central portion (48) and a flared intake (44) with a gradually turned back end (46).

Abstract: Articles such as substantially flat, electronic chips (10) are positioned in an array with surfaces (11) to be treated facing upward along a succession of specially selected tiers. Such tiers may preferably be horizontal rows (20-24) of top rims (19) of vertical suction tubes (18). A leading row (20) of such top rims (19) is at a first elevation and each succeeding row is parallel to, elevated above and offset horizontally from a preceding row in stepwise fashion. At least one nozzle (40) is provided for propelling a stream (52) of a treating medium upon and at an angle "H" to the surfaces (11) to be treated. Angle "H" is selected so the medium and any dislodged matter is deflected from the respective surfaces (11) without contacting other such surfaces (11) of chips (10) positioned for treatment in the array.

Abstract: This disclosure is directed to an oxy-hydrogen torch (10) comprised of a nozzle plate (16) captured between first and second outer members (12 and 14). Each outer member has a plenum (18) which open towards, and is separated by, the plate (16). The nozzle plate (16) has a plurality of spaced grooves (32--32) in one major surface (34) which are arranged in an interleaved relationship with the spaced grooves (36--36) on the opposite surface (38). The grooves (32 and 36) extend from an edge of the plate (16) to the respective plenums (18--18) in the outer members (12 and 14). Oxygen is directed into one plenum (18) and hydrogen urged into the other plenum. The gases pass through the respective grooves (32 and 36) to the surface (46) of the torch (10) for surface mixing and ignition.

Abstract: A vacuum-type holder (10) for retaining fragile articles such as semiconductor wafers (16) during a manufacturing operation, such as an electrolytic treatment includes a vacuum-operated support (36) at each of the seats (23) which exerts a supporting force against the underside (32) of the wafer (16) which is opposite to and proportional to a vacuum generated holding force which urges the wafer against the seat. The supporting force, consequently, minimizes bending stresses to which the wafer (16) could otherwise be subjected.

Abstract: A bar-type film resistor (40) is adjusted to a high degree of precision by longitudinally offset plunge cuts (41, 42 and 43) extending from alternately opposite edges (29, 49) into the resistive layer (13), by a trim cut (46) which extends from the most recently made plunge cut (43) longitudinally through the resistor (40), and by a shave cut (47) which is coextensive with the trim cut and preferably overlapping therewith. The trim cut (46) and any shave cut (47) are located at a predetermined distance from a reference edge (29). The most recently completed plunge cut extends from its starting edge (29) into the resistive layer (13) to distances greater than those at which the trim cut and the shave cut are to be located.

Abstract: A tinned conductor is advanced through each of a plurality of successively smaller die openings in a drawing apparatus to reduce the diameter of the tinned conductor after which it is annealed. After the tinned conductor has been annealed, it is moved through the opening of a die which is slightly smaller than the final die opening in the drawing apparatus. This reconfigures any of the tin coating that may have reflowed during annealing and formed protrusions to remove any such protrusions and form an essentially smooth surface. As a result, the adhesion of a subsequently extruded plastic covering to the tinned conductor is controlled to be within a predetermined range and to be substantially uniform along the length of the conductor.

Abstract: Articles (18) are transferred from a first position, such as a feed track (37) on which they are located closely spaced, to a second position such as a heat seal apparatus. At the heat seal apparatus the spacing of the articles is to coincide with the spacing of frame members (32) to which the articles are to be joined. The change in the spacing occurs during the transfer of the articles from the first to the second positions by means of a transfer mechanism (41). A plurality of pickup members (43) are slideably mounted to an arm (44) of the mechanism (41). The pickup members (42) which are resiliently urged apart with respect to each other are forced together at one end of the travel of the arm (44) to assume the close spacing established by the width of the pickup members. At the other end of the travel of the arm (44) the resilient urging force drives the pickup members (43) against predetermined stop positions.

Abstract: The invention is for an instrument carrying case comprising an open-topped box, a lid having a substantially planar panel for covering the top of the box, and a flexible hinge joining the rear edge of the lid to the top edge of the rear wall of the box such that the lid is movable through an angle of about 270.degree. from a position at which its panel covers the box to an "inside-out" position for the lid at which such panel is adjacent and substantially parallel to the outside of the rear wall of the box, and in which the normally forward part of the lid projects laterally beyond the bottom of the box. The case further comprises a fastening means for securing the box and the lid together when the latter is in such inside-out position.

Abstract: Workpieces (11), such as semiconductor wafers, are treated in a plasma reaction apparatus (10). The wafers are loaded onto a workholder (18), where they become seated in contact with facing surfaces of a plurality of spaced, parallel plates (19, 21). Plasma is generated in each of the spaces (23) between two adjacent ones of the plates by coupling such adjacent plates to opposite terminals (31, 32) of an R-F generator (29). Each of the plates is comprised of a base structure (41) of a thermally stable, conductive material, such as graphite. The base structure is covered with a first layer (43) of a hard material, such as silicon carbide to impart wear resistance to the graphite. The layer (43), in turn, is covered by an outer, conductive layer (44) which, in the described embodiment is a layer of aluminum.

Abstract: Apparatus is provided for releasably retaining an article such as an optical cable (10) for rotation of the article. A chuck body (31) is provided along with components (24, 26 and 46-48) for rotating the body (31) and the cable (10) about a common central axis (33). A jaw (34) is affixed to the body (31) and disposed generally laterally of the axis (33). A movable jaw (35) is provided having at least mating surfaces which are complementary to the fixed jaw (34) for mounting thereto and grasping therebetween the cable (10) disposed about the axis (33). Magnetic devices are associated with the jaws (34 and 35) for releasably mounting the movable jaw to the fixed jaw for releasably retaining a cable (10) therebetween. For example, first and second magnets (36 and 37), respectively, may be made a part of a jaw such as movable jaw (35) and be disposed astride the central axis (33).