Abstract: A method of forming a colloidal wetting sensitizer is disclosed. The method comprises combining a stannous species and a cupric species in an aqueous medium maintained at a pH of between 0.4 and 1.5.

Abstract: A strip 20 has a drive margin 36 and a latent image of a pattern in a light sensitive coating 73 of a pattern portion 22 thereon. To avoid disturbing the pattern, the strip 20 is gripped by the drive margin 36 using a set 43 of pinch-drive rollers which drive the strip without disturbing the latent image. The strip 20 is driven through pattern development, cleaning and etching solution spray chambers 64, 66 and 108, respectively. One or more adjustable shields 78 are used to vary the time interval during which the strip 20 is sprayed by these solutions. By adjusting one or more shields 78 to suit changes in solution condition the time intervals for proper developing, cleaning and etching are coordinated for a speed at which the strip 20 is driven.

Abstract: A lead frame for mounting semiconductor chips includes laminated chip-mounting portions. These portions are comprised of a high thermal conductivity lead-frame material laminated with upper and lower surfaces of a material which matches the expansivity of the semiconductor. These upper and lower surfaces prevent warping of the mounting portions and this, coupled with the matching of the expansivity of the chip, greatly reduces the likelihood of chip damage.

Abstract: A method of recovering gold and palladium from a spent aqueous potassium iodide-iodine etching solution, and regenerating the etching solution for reuse, involves adjusting the spent solution to a strongly basic pH (e.g., 12.5) by the addition of an alkaline compound (e.g., potassium hydroxide) to precipitate metallic gold from the solution. Metallic palladium is precipitated from the resulting alkaline solution by the addition of a borohydride, (e.g., potassium borohydride). Following removal of the precipitated gold and palladium, the spent alkaline solution is made acidic-to-neutral in pH to change potassium hypoiodite and some potassium iodide in the solution to iodine. The solution then is adjusted back upward to a slightly alkaline pH value (e.g., 9.0), and precipitate is removed at room temperature. Potassium iodide and iodine crystals then are added to the solution, as necessary, to regenerate the solution to substantially its original composition and strength for reuse.

Abstract: A method for removing lead and other basic impurities from copper during refining of the copper comprises treating molten copper to be refined with a slag having a final composition including iron oxide, calculated as Fe.sub.2 O.sub.3 and silica (SiO.sub.2) wherein the weight ratio of iron oxide to silica is from 0.4 to 0.8. The novel slag preferably contains less than 10% boric oxide and up to 30% phosphorus pentoxide.

Abstract: A method of stabilizing a mixture of an organopolysiloxane and an organo-metallic curing catalyst against gelation comprises adding a sufficient amount of methanol to the catalyst to deactivate the catalyst prior to adding the catalyst to the polysiloxane.

Abstract: A lightguide starting tube or rod (12) passes through opposed lateral openings (51--51) in a chamber (31) which contains an oxy-hydrogen torch (14) used to deposit particulate glass on the rod. Frusto-conical, laminar flow, gas shields (71 and 72) are formed about the rod (12) on both sides of said openings (51--51) to permit the rod to pass therethrough in spaced relation to the openings while sealing said openings to prevent gas or undeposited particulate from passing therethrough and preventing contaminants from entering the chamber (31).

Abstract: Tin and antimony impurities can be removed from copper scrap by melting the scrap in the presence of a flux comprising a mixture of calcium and solution oxides in a weight ratio of calcium oxide to sodium oxide of from 1:1 to 4:1.

Abstract: End portions of a plurality of articles (12) are simultaneously treated in an electrolytic bath. End portions of the articles are inserted into an array of apertures (17) extending between major surfaces of a planar holder (11). Inserting the articles (12) into the apertures guides them into an interfering contact with coil springs (28). Coils of the springs (28) are urged aside and provide an urging force to retain the articles in the holder (11). The contact of the springs (28) with the articles (12) also establishes electrical continuity between the articles (12) through the springs (28) to external ends (43) of anchoring rods (37) for the springs, such that when the ends (43) are coupled into a treating circuit and protruding ends of the articles depend into a treating bath such ends become treated. A frame located relative to the surface of the treating bath receives the holder (11) and establishes a reference for the depth of insertion of the articles into the bath.

Abstract: A surge protector is tested by injecting a current spike with an exponentially decaying waveshape (12) through the surge protector. The current is generated by connecting a voltage source (16) to the surge protector and controlling the current through the surge protector by a Darlington array amplifier (20) connected between the surge protector and ground. The Darlington array amplifier (20) is in turn controlled by first generating a reference pulse having a voltage waveform corresponding to the desired current waveform and comparing this reference voltage with a voltage feedback from the Darlington array amplifier (20) to in turn generate an error voltage which is coupled into the amplifier (20). Additionally, differential amplifier circuits (44 and 46) monitor the voltage impressed on the amplifier (20) and reduce the input voltage to the amplifier (20) significantly if the voltage impressed on the amplifier (20) is greater than a predetermined fraction of the voltage source (16).

Abstract: A lightguide preform (13) is fabricated by depositing and consolidating a plurality of doped silica layers (12), containing volatile germania, on the inside surface of a silica glass tube (11). The tube (11) is rotated while repeatedly traversing a hot zone therealong to shrink and collapse the tube in a final heat zone traversal. A gas mixture containing oxygen and germanium tetrachloride flow from an input gas line (23) and through the tube (11) during the shrinking traversals. The gas mixture continues to flow through at least a portion of the input gas line (23) during the final heat zone traversal.

Abstract: In an improved method for depositing a metal on a substrate of the type in which a dielectric coated substrate is coated with a sensitizing solution containing a reductible metal salt, a primary reducing agent comprising 2,7 anthraquinone disulfonic acid and a secondary reducing agent, the substrate is exposed to ultraviolet light in an atmosphere having a temperature of at least 117.degree. F. (42.degree. C.) and a mass of water vapor of at least 3.8 mg of water per liter of dry air for at least 15 seconds. In an embodiment of the method the substrate is aerated in a moisture controlled atmosphere at room temperature for at least 30 minutes prior to exposing the substrate to ultraviolet light.

Abstract: A mechanism 30 ejects an article 12 in an ascending path from a position 10 on a carrier wheel 20. An inverted "V" shaped trough 43 is located to face the ascendent path of the article 12, and to be oriented substantially parallel thereto. The article 12 is captured and removably held in an apex portion 49 of the trough 43 by an elongated magnet 56 which establishes a force field parallel to such trough 43, concentrating in the apex portion 49. The article 12 is also oriented by magnet 56 and the apex portion 49 of trough 43 in a desired direction. An air nozzle 60 has a needle-like tube 64 disposed in the apex portion 49 ending adjacent to a body 16 of an article 12. A hose fitting 66 is attached to tube 64 for introducing an air stream therein which impinges upon body 16 and propels article 12 in the desired direction.

Abstract: The walls 41 (FIG. 4) of thru holes 11 in a printed wiring board substrate 12 are coated with a liquid 24 by inserting fingers 22 into the thru holes. Each of the fingers has a diameter slightly less than the diameter of the associated thru hole and has a length no greater than the thickness of the substrate 12. After ink 24 has been applied to the top surface of the substrate, the inserted fingers 22 are withdrawn, thereby drawing the ink down into the thru holes and coating the walls 41. In another embodiment, fingers 62 are aligned with selected portions 52 of an edge 55 of the substrate 50 to coat the portions of the edge as the fingers are moved by the edge after the heads of the fingers have been coated with the ink 24.

Abstract: An X-ray transparent mask (51) is comprised of a support ring (42) with a planar substrate stabilizer (41) thereon, the stabilizer having a plurality of apertures (43) therethrough, arranged in a "checkerboard" fashion. A thin X-ray transparent mask substrate (52) is placed over the stabilizer. (41), the substrate having X-ray absorptive metallized patterns (53) thereon which are aligned with the apertures (43). The mask (51) is positioned proximate a semiconductor wafer (56) having a photoresist coating (30) thereon. X-rays (14) are directed at the photoresist coating (30) through the apertures (43) to selectively expose the coating. The mask (51) is then indexed one aperture position and the remaining portion of coating (30) is exposed to the X-rays (14).

Abstract: Disclosed are methods of controlling the adjustment of a machine-adjustable component in a circuit wherein a feedback factor relates a change in a monitor parameter to a compensating change in the value of the adjustable component; and wherein, by machine means, a value for the change in the monitor parameter is determined, a target value for the adjustable component is calculated from the monitor parameter change and the feedback factor, and the adjustable component is adjusted to substantially its target value.

Abstract: A workpiece (16), for example a magnetic bubble memory wafer, is held in place, and heat is removed from it by an expandable heat pipe (22) during a process performed in a vacuum as, for example, a sputter etch process. The expandable heat pipe (22) includes two plates (24, 26) joined by a bellows (28) to form a sealed chamber containing a vaporizable liquid such as water. During loading of the wafers the heat pipe (22) is compressed by atmospheric pressure and thereby facilitates easy assembly of the wafer (16) and heat pipe (22) into a holding fixture (10) which in turn is bolted to a cooling plate (30) situated inside a vacuum chamber. When the chamber is evacuated, the heat pipe (22) expands to hold the wafer (16) in place and form a good thermal path from the wafer (16) to the cooling plate (30).

Abstract: A radiation absorbing cone (34) affixed to an infrared pyrometer (31) has a pair of lateral apertures (36--36) therein through which a continuously moving heated wire (11) passes. The cone (34) blocks stray ambient radiation while substantially eliminating any reflected radiation from the wire (11) from impinging on the pyrometer (31) to provide an accurate and repeatable measurement of the wire temperature.

Abstract: A method of depositing a uniform dielectric film on a silicon substrate comprising flowing a plasma comprising an RF-excited mixture of an inert gas such as argon and silane over the substrate to form a film of porous a-Si.sub.x H.sub.y over the surface of the substrate. The flow of plasma is then discontinued and a flow of a nitrogen or oxygen plasma is substituted therefor. The temperature of the substrate is increased to at least 360.degree. C. to diffuse-out hydrogen from the Si.sub.x H.sub.y film on the substrate, each departing hydrogen atom leaving a dangling Si bond behind which combines with the activated oxygen or nitrogen thereby to form the desired dielectric film of formula Si.sub.x N.sub.y or Si.sub.x O.sub.y.

Abstract: A temperature controller senses whether the temperature of a body (30) is higher or lower than a desired temperature, and then heats or cools the body (30) in either a high power mode or a low power mode. The controller operates in the low power mode if the elapsed time from the last change from heating to cooling or cooling to heating is less than a predetermined time interval. This condition typically occurs when the temperature of the body (30) is near the desired temperature, i.e., the controller is switching back and forth from heating to cooling in fairly short time intervals. If the elapsed time is longer than the predetermined time interval, as typically occurs when the temperature of the body (30) is being changed to a new desired temperature, the controller operates in the high power mode.