Abstract: An article, such as a beam-lead semiconductor device, is precisely oriented by placing it on the end of a tubular member which is centered in a cavity having the form of inverted, truncated, pyramid. The smallest cross section of the cavity is smaller than the smallest article to be positioned. The member slides vertically within the cavity and is resiliently supported by a vacuum chamber for movement therewith. The chamber is lowered with a vertical oscillatory motion, while a slight vacuum is applied, to lower the article into the cavity and engage it intermittently with the walls of the cavity. This orients and centers the article in the cavity.

Abstract: A high pressure apparatus for reducing metal rod to wire in one pass through a die by surrounding the rod with a medium under high hydrostatic pressure to maintain ductility of the metal to be formed; the die is supported against a frame member by a die stem having a central opening through which the wire passes to a winding reel. To prevent clogging of the die stem with pressure medium that passes through the die in small quantities, the die stem is heated to a temperature substantially above the softening temperature of the pressure medium.

Abstract: A pressure vessel for containing fluid at very high pressures is formed from an axially aligned array or stack of like, flexible, relatively thin, dished discs, i.e., Belleville springs. The discs are clamped together axially, so as to flatten them into a pressure vessel wall structure which is pre-stressed in hoop compression along a bore formed by the aligned inner peripheries of the discs, and in hoop tension along the aligned outer peripheries of the discs. Such pre-stress pattern is particularly well adapted to permit the pressure vessel to support very high fluid pressures within the pressure vessel bore. A liner tube may be located within the bore formed by the aligned inner peripheries of the discs, while any suitable end closing mechanisms, e.g., a die assembly and a piston, may be employed to close the axially opposite ends of the pressure vessel bore.

Abstract: Two hydraulic pressure intensifiers are coupled in parallel between a source of hydraulic fluid at relatively low pressure and an output path. Each intensifier provides a pressurizing stroke in only one direction of linear reciprocation. The intensifiers are so operated, under the control of a hydraulic circuit, as to create a tendency for an initial portion of the pressurizing stroke of each of the intensifiers to overlap a final portion of a preceding pressurizing stroke of the other intensifier, and thereby to deliver high pressure hydraulic fluid to the output path simultaneously with continuing delivery from such other intensifier. Such simultaneous delivery does not actually occur, however, since the hydraulic circuit is so arranged that the delivery of high pressure hydraulic fluid from each intensifier to the output line can begin only upon a falling off in the pressure provided by the other intensifier.

Abstract: A chlorinated naphthalene and a paraterphenyl are mixed to provide an adhesive for adhering a semiconductor wafer to a support for processing.The adhesive so formed may be evaporated at the end of processing the wafer, without leaving a residue, to release the devices which have been formed from the wafer.

Abstract: Wafer-like articles are inserted through an input port into one of a plurality of slots in a rotatable disc having a slotted periphery. The disc is disposed in a vertical plane between a pair of closely-spaced parallel plates which laterally retain the articles in the slots. The slots advantageously are inclined toward the direction of rotation so that the wafers tend to remain therein as rotation and treating proceeds. The rotating disc urges each article between the plates to an aperture in one of the plates through which one side of the article is exposed to a treating medium, such as a scrubbing brush and detergent solution. Further rotation of the disc brings each article to an aperture in the opposing plate through which another side of the article is exposed to another treating medium of like or different kind.

Abstract: In transfer molding thermosetting polymeric materials, a first preform of first thermosetting polymeric material having a volume substantially equal to the volume of the die cavities is placed in the transfer chamber adjacent the runners. A second preform of second thermosetting polymeric material cheaper than the first polymeric material is placed in the transfer chamber above the first preform. The transfer chamber is pressurized and the second preform is deformed and pressurizes and deforms the first preform and causes the first thermosetting polymeric material to flow through the runners into the die cavities. After curing, the molded articles consisting of first thermosetting polymeric material are removed from the die cavity, and scrap cull and runner consisting substantially of cheap second thermosetting polymeric material are removed from the mold runners and the bottom of the transfer chamber. Thus, considerable economies are effected.

Abstract: A solid state amplifier includes at least one junction field effect transistor and an impedance network coupled between a signal input terminal of the amplifier and a gate terminal of the transistor. The network includes a p-n junction device having a region of conductivity opposite to that of the gate of the transistor coupled to the gate terminal, the p-n junction being shunted by a resistor coupled in parallel therewith. The network minimizes signal distortion which would otherwise be introduced to the signal output of the amplifier when an inductive load is present in the output circuit of the amplifier.

Abstract: Apparatus for measuring deviation from straightness, or wall curvature or axial curvature, of an elongated member by ultrasonic pulse-echo techniques comprises at least three ultrasonic transducer means and an associated processing system.In operation, each of the transducer means transmits ultrasonic search signals towards the elongated member and detects signals reflected from diametrically opposed points on a reference surface of the member. From the transmitted search and the received echo signals, a signal is generated in the associated processing system indicating the distance between the face of each transducer means and the associated reference points on the wall surface of the elongated member. The generated distance signals can then be processed to generate signals indicating wall curvature and axial curvature in the plane formed by the diametrically opposed points.

Abstract: To avoid damaging photolithographic masks and photoresist coatings on articles during selective exposure of the photoresist coatings, the mask is held very near to, but not in contact with, the photoresist coating during the selective exposure. Because of the close spacing involved, such a technique is commonly termed "proximity printing." To provide suitable spacers for holding a mask in uniform proximity with a photoresist coating, a plurality of droplets of a liquid acrylic resin are dispensed onto the mask and cured in air to harden them. For proximity printing, the mask is simply pressed against the photoresist coating with the droplets therebetween and light of sufficient wavelength and intensity is directed selectively onto the coating through the mask for a sufficient time.

Abstract: In making a target for a television camera tube, it is necessary to thin the backside of a semiconductive substrate, which is opposite a face having a diode array thereon. To thin the substrate, it is positioned face down on a fluid nondeleterious to the substrate and diode array. The fluid is contained in a cavity of a holding device. The positioning is such that there is no space between the fluid and the substrate. An apertured top member is then mounted on the substrate and the holding device to retain the substrate on the fluid. The assembly of the holding device and top member with the substrate therebetween is immersed and rotated in an etchant to thin the backside of the substrate through the aperture of the top member. The fluid provides a tight seal on the face of the substrate to prevent the etchant from damaging such face and the diode array thereon. A vent extending from the cavity of the holding device to its outer edge assists in the subsequent removal of the substrate from the cavity.

Abstract: Bonding machines have transparent elements on their bonding axes. Magnified optical means are positioned to view bonding tips and integrated-circuit chips simultaneously through the transparent elements thereby facilitating alignment of the chips to the tips. In one embodiment a bonding tip is transparent and a transparent compliant bonding member is utilized in conjunction with the tip to produce compliant bonds. Another embodiment utilizes a transparent tip in a "hard tip" type of bonding operation. A third embodiment utilizes a transparent tray closely positionable to the bonding tip. After alignment of the tip to one of the chips is achieved the tray is removed and bonding proceeds on an accurately positioned substrate.