Abstract: Disclosed in this specification is a process for refurbishing a spent sputtering target. The process includes the step of applying sufficient heat and axial force to the filled sputtering target to hot press the filled sputtering target such that the powdered metal fuses with the un-sputtered metal, producing a refurbished target. The process may be used to refurbish precious metal targets, such as ruthenium targets.
Type:
Grant
Filed:
July 15, 2008
Date of Patent:
January 18, 2011
Assignee:
Williams Advanced Materials, Inc.
Inventors:
Robert Acker, Adrish Ganguly, Matthew T. Willson
Abstract: An optical data recording and storage medium that includes a reflective layer formed from a silver alloy that contains, in addition to silver, about 0.2 to about 1.0 wt. %, based on the total weight of alloy, of samarium (Sm), about 0.2 to about 2.0 wt. % of copper (Cu), about 0.1 to about 0.3 wt. % of titanium (Ti), and about 0.2 to about 0.8 wt .% of manganese (Mn).
Type:
Grant
Filed:
June 26, 2003
Date of Patent:
April 25, 2006
Assignee:
Williams Advanced Materials, Inc.
Inventors:
Heiner Lichtenberger, Derrick L. Brown, Scott Haluska
Abstract: An ion beam deposition target source consisting of a removable, centrally located inner insert surrounded by an outer region. The insert can be removed and replaced when eroded, while the outer region of the target source not eroded by the ion beam remains in place attached to a backing plate. The inner insert and the outer region are joined to each other by an interface comprising an interlocking lip or grove structure located on opposing mating surfaces on the inner insert and outer region, thereby forming the deposition target source when these components are united. The deposition target source can be attached by a bonding layer to a backing plate which is installed into an ion beam deposition machine.
Type:
Grant
Filed:
November 2, 2001
Date of Patent:
June 29, 2004
Assignee:
Williams Advanced Materials, Inc.
Inventors:
Henry L. Grohman, Robert Acker, Matthew T. Wilson
Abstract: A method of making an integral plated and solder clad cover lid for electronic packages is disclosed. The cover lid is plated and or clad with a first corrosion resistant and solderable material and is clad with a solder material on one side. The cladded substrate is stamped and then plated with a second corrosion resistant and solderable material. The second material is subsequently sintered and preferentially diffused into the solder material resulting in a visual distinction between the solder side of the cover lid and the backing side.