Abstract: An electronic assembly including a substrate, an electronic component, a fixture, and a housing. The substrate includes a first contact array. The electronic component includes a second contact array. The fixture includes an opening adapted to position the electronic component on the substrate and to connect the second contact array to the first contact array when the fixture is aligned at a first position on the substrate. The housing is adapted to hold the substrate populated with the electronic component. The housing includes a first conductive pathway adapted to connect from an external surface at the housing to the substrate in a serial continuous conductive path when the fixture is aligned at the first position on the substrate. The electronic assembly includes a sensing device connected to the continuous conductive path to detect the integrity of the electronic assembly.

Abstract: An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.

Abstract: An electrical apparatus includes a printed circuit board (PCB) and a socket to electrically interface with the PCB. The PCB includes conductive traces formed in a layer of the PCB and one or more recess. Each of the recess includes an inner surface. A portion of the inner surface forms a first electrical contact connected to one of the conductive traces. The socket includes a multitude of conductive pins and one or more mechanical support matching the position of the recesses. Each of the mechanical support includes an outer surface. A portion of the outer surface forms a second electrical contact connected to an interface pin. The first electrical contact at the PCB and the second electrical contact at the socket form a conduction path from one of the conductive traces on the PCB to the interface pin at the socket when the PCB is inserted into the socket.

Abstract: An electric apparatus is adapted to be electrically coupled to a target platform. The electric apparatus includes a first printed circuit including a first surface parallel to a first plane and a second surface parallel to a second plane perpendicular to the first plane. The first surface has a first area and the second surface has a second area smaller than the first area. A multitude of conductive traces are formed in a layer of the first printed circuit parallel to the first plane. First and second contact regions respectively overlay first and second portions of the second surface. The first and second contact regions are electrically connected to first and second ones of the multitude of conductive traces respectively. The first printed circuit is coupled to the target platform at the first and second contact regions when the first printed circuit is electrically coupled to the target platform.

Abstract: A method for placing a component on a target platform includes providing component alignment marks, target platform reference marks, a first multiple-sensor probe including first sensors, and a second multiple-sensor probe including third sensors. The method further includes determining second sensors included in the first sensors, and sensing a first signal from a first one of the alignment marks by at least one of the second sensors. The method further includes determining fourth sensors included in the third sensors. The method further includes sensing a second signal from a second one of the alignment marks by at least one of the fourth sensors, and detecting a deviation of the component from the target platform associated with a first position of one of the second sensors that sense the first signal and a second position of one of the fourth sensors that sense the second signal.

Abstract: An electric apparatus for connecting to a first printed circuit includes a second printed circuit, which includes a first surface substantially parallel to a first plane and a second surface substantially parallel to a second plane perpendicular to the first plane. The first surface includes a first area and the second surface includes a smaller second area. The second printed circuit includes conductive traces in a layer of the second printed circuit. The electric apparatus further includes first and second conductive pins including first and second longitudinal axes, respectively. First and second notches in the second printed circuit include respective first and second openings through the second surface adapted to receive portions of the first and second pins and adapted to electrically connect the pins to first and second respective ones of the conductive traces. The first and second longitudinal axes are installed substantially parallel to the first plane.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Abstract: An electronic device is disclosed for coupling to a target platform, which includes a multitude of pad contacts. The electronic device includes a substrate, a multitude of pad contacts on the substrate, and a multitude of contact regions in one of the of pad contacts on the substrate. Each of the multitude of pad contacts on the substrate electrically couples to a corresponding one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled. The multitude of contact regions corresponds to one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: A method for aligning an assembled multi-component electronic apparatus including providing a first component with first and second surfaces, an alignment mark at the second surface, and interface contacts on the second surface. The alignment mark has sensors and a spatial relationship to the interface contacts. The method further includes providing a second component including a first surface, a reference mark at the first surface, and interface contacts on the first surface. The reference mark has a spatial relationship to the interface contacts of the second component. The method further includes creating a conduction path through the sensors and reference mark when each of the sensors is terminated by an external probe when the reference mark is in a first position with respect to the sensors. Then the interface contacts of the first and second components are aligned.

Abstract: Method for aligning electrical contacts of first and second electronic circuits or assemblies, the first and second electronic circuits or assemblies each being provided with alignment features. The method includes placing electrical contacts of the second electronic circuit or assembly in contact or near contact with electrical contacts of the first electronic circuit or assembly. An alignment condition of alignment features of the first and second electronic circuits or assemblies are electrically sensed during the contact or near contact to obtain sensing information. The sensing information is stored and analyzed to determine a movement to be caused between the first and second electronic circuits or assemblies to achieve an improved alignment condition. Each of the alignment features comprises a plurality of alignment elements. The electrically sensing step electrically senses an alignment condition of alignment elements of alignment features of the first and second electronic circuits or assemblies.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: An electronic device is disclosed for coupling to a target platform, which includes a multitude of pad contacts. The electronic device includes a substrate, a multitude of pad contacts on the substrate, and a multitude of contact regions in one of the of pad contacts on the substrate. Each of the multitude of pad contacts on the substrate electrically couples to a corresponding one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled. The multitude of contact regions corresponds to one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled.

Abstract: A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device.

Abstract: An apparatus for placement of a component onto a target platform includes a multiple-sensor probe adapted to sense a relative position of one or more reference marks or one or more alignment marks with respect to the multiple-sensor probe. The component includes one or more alignment marks, the target platform includes one or more reference marks, and the multiple-sensor probe includes a multitude of sensors. A first multitude of latches is adapted to record a size of the reference mark, and a relative position of the reference mark with respect to the probe to facilitate alignment of the probe to the reference mark. A second multitude of latches is adapted to record an instantaneous positional relationship between the alignment mark and the aligned probe to facilitate alignment of the component to the aligned probe. The first and second multitude of latches is coupled to the multitude of sensors.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.