Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: A manufacturing technique for constructing passive electronic components in vertical configurations is disclosed. Electrically passive components are constructed in a structure that is substantially perpendicular to target platform including a first plane to provide a larger electrode contact area and a smaller physical dimension. Passive components structured to be substantially perpendicular to a plane associated with a target platform can be directly connected to pad contacts of an integrated circuit or substrate or can be embedded in a package to reduce the area overhead of a passive component while improving the effectiveness of the passive components in their applications.

Abstract: A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device.

Abstract: The invention is a compact embedded modem that meets global telephone standards with its interface constructed in a single-in-line form factor. The modem in single-in-line form factor, namely SIP modem, can be integrated into a host system through a single-in-line header socket. The SIP interface includes TIP and RING signals for connecting to a phone line, isolation spacers, ground pin, power pin, and digital signals for transferring data to and from the host. The digital interface can be configured to operate in serial connection or in parallel connection to the host, selectable by user.

Abstract: A dual-in-line adaptor for mounting an electronic assembly that requires validation includes a pair of substantially parallel pin strips mounted to a first side of a dual-in-line adaptor circuit board and a first land pattern on at least one of the first side and a second side of the dual-in-line adaptor circuit board. The second side opposing the first side and the first land pattern corresponding to a second land pattern on the electronic assembly that requires validation. A method for testing an electronic assembly that requires validation using a dual-in-line adaptor is also described.

Abstract: The present invention relates generally to assembly techniques. According to the present invention, the alignment and probing techniques to improve the accuracy of component placement in assembly are described. More particularly, the invention includes methods and structures to detect and improve the component placement accuracy on a target platform by incorporating alignment marks on component and reference marks on target platform under various probing techniques. A set of sensors grouped in any array to form a multiple-sensor probe can detect the deviation of displaced components in assembly.

Abstract: A memory module contains a plurality of memory devices and receives control signals over a memory bus for accessing the memory devices. An adaptive buffering mechanism includes unregistered logic to electrically isolate the received control signals from one or more control drive signals. Register logic substantially synchronizes the control drive signals to a system clock to produce clocked control drive signals. A mode selection mechanism selectively outputs either the control drive signals or the clocked control drive signals to access the memory devices in accordance with a mode selection signal.