Abstract: Methods and devices for integrating antennas fabricated using planar laminate processes. The method includes laminating one or more conductive layers to a first dielectric material layer, forming one or more holes through at least the first dielectric material layer, forming a monopole antenna through at least a first of the holes, attaching one or more integrated circuit dies to one of the conductive layer, and connecting the integrated circuit dies to the monopole antenna. The device can include a planar laminate integrated circuit module including one or more dielectric material layers, one or more integrated circuit die on a surface of or attached to the planar laminate integrated circuit module, and an integrated monopole antenna interfaced with the integrated circuit dies. The integrated monopole antenna is formed in a through hole of the planar laminate integrated circuit module, the through hole being formed through at least one of the dielectric material layers.

Abstract: Systems and implementations for inductance tuning systems that are configured to operate in a wide range of frequencies are provided herein. The subject matter described herein can in some embodiments include an inductance tuning system including at least one inductor connected to a first terminal, the at least one inductor comprising of a plurality of inductive elements that are substantially magnetically coupled to each other, wherein spacing between the inductive elements are substantially less than diameters of the windings. At least one capacitor can be connected between one or more of the plurality of inductive elements and a second terminal.

Abstract: Systems, devices, and methods for adjusting tuning settings of tunable components, such as tunable capacitors, can be configured for calibrating a tunable component. Specifically, the systems, devices and methods can measure a device response for one or more inputs to a tunable component, store a calibration code in a non-volatile memory that characterizes the device response of the tunable component, and adjust a tuning setting of the tunable component based on the calibration code to achieve a desired response of the tunable component.

Abstract: Devices, systems, and methods in which antenna elements are positioned together as an array at a corner of a mobile device, at least two of the antenna elements being oriented to provide beams in different directions with respect to the corner of the mobile device.

Abstract: Devices and methods of operating partitioned actuator plates to obtain a desirable shape of a movable component of a micro-electro-mechanical system (MEMS) device. The subject matter described herein can in some embodiments include a micro-electro-mechanical system (MEMS) device including a plurality of actuation electrodes attached to a first surface, where each of the one or more actuation electrode being independently controllable, and a movable component spaced apart from the first surface and movable with respect to the first surface. Where the movable component further includes one or more movable actuation electrodes spaced apart from the plurality of fixed actuation electrodes.

Abstract: The present subject matter relates to charge pump devices, systems, and methods in which a plurality of series-connected charge-pump stages are connected between a supply voltage node and a primary circuit node, and a discharge circuit is connected to the plurality of charge-pump stages, wherein the discharge circuit is configured to selectively remove charge from the primary circuit node.

Abstract: Wideband phased mobile antenna array devices, systems, and methods include antenna elements arranged in a substantially linear array and positioned and adjusted on a substrate to achieve an aggregate radiation pattern in an end-fire direction. In some embodiments, each antenna element includes two pairs of antenna arms, a pair on either side of the substrate. In some embodiments, each pair of antenna arms are configured to be adjusted and positioned symmetrically to generate the end-fire radiation pattern. In some embodiments, each of the antenna elements in the linear array is spaced apart from each other by a distance that is equal to approximately ?/2, where ? is a wavelength associated with a frequency within a desired operating frequency range of the antenna system.

Abstract: Antenna systems, devices, and methods for providing both end-fire mm-wave high-frequency signals and low-frequency RF signals from a collocated antenna array in which at least one high-frequency antenna element and a low-frequency antenna element are spaced apart from one another. Grating strips are positioned between the high-frequency antenna elements and the low-frequency antenna element, the grating strips being spaced apart from one another by a defined spacing. The grating strips are configured such that a signal wave from the high-frequency antenna element propagates through the low-frequency antenna element.

Abstract: Systems, devices, and methods for tunable filters that are configured to support multiple frequency bands, such as within the field of cellular radio communication, can include a first resonator and a second resonator configured to block signals within one or more frequency ranges, and one or more coupling element connected to both the first resonator and the second resonator. The one or more coupling element can be configured to provide low insertion loss within a pass band.

Abstract: The present subject matter relates to charge pump devices, systems, and methods in which a first plurality of series-connected charge-pump stages is connected between a supply voltage node and a first circuit node, wherein the first plurality of charge-pump stages are operable to produce a first electrical charge at the first circuit node, the first electrical charge having a first polarity; and a second plurality of series-connected charge-pump stages is connected between the supply voltage node and a second circuit node, wherein the second plurality of charge-pump stages are operable to produce a second electrical charge at the second circuit node, the second electrical charge having a second polarity.

Abstract: The present subject matter relates to devices, systems, and methods for beam steering in which a configurable antenna assembly includes a first antenna element configured to radiate in a first broadside direction and a second antenna element configured to radiate in an endfire direction. In some embodiments, the configurable antenna assembly further includes a third antenna element configured to radiate in a second broadside direction substantially opposite to the first broadside direction. Such devices, systems, and methods can further be configured such that one of the antenna elements is selectively connected to a common signal feed.

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are disclosed. The method includes forming at least one Micro-Electro-Mechanical System (MEMS) cavity. The method for forming the cavity further includes forming at least one first vent hole of a first dimension which is sized to avoid or minimize material deposition on a beam structure during sealing processes. The method for forming the cavity further includes forming at least one second vent hole of a second dimension, larger than the first dimension.

Abstract: Devices, systems, and methods for a hybrid high gain antenna in which a plurality of antennas are mounted substantially symmetrically such that the antennas collectively provide 180° of antenna coverage for a surface above the antennas. In some embodiments, the hybrid high gain antenna system can be mounted on a mobile device with sufficient inclinations such that the antennas collectively provide approximately 180° of antenna coverage. In some embodiments, the hybrid high gain antenna system is configured to reach a gain of between about 10 dBi and 12 dBi at a target frequency of between about 26 GHz and 30 GHz.

Abstract: Systems, devices, and methods for micro-electro-mechanical system (MEMS) tunable capacitors can include a fixed actuation electrode attached to a substrate, a fixed capacitive electrode attached to the substrate, and a movable component positioned above the substrate and movable with respect to the fixed actuation electrode and the fixed capacitive electrode. The movable component can include a movable actuation electrode positioned above the fixed actuation electrode and a movable capacitive electrode positioned above the fixed capacitive electrode. At least a portion of the movable capacitive electrode can be spaced apart from the fixed capacitive electrode by a first gap, and the movable actuation electrode can be spaced apart from the fixed actuation electrode by a second gap that is larger than the first gap.

Abstract: Systems and implementations for inductance tuning systems that are configured to operate in a wide range of frequencies are provided herein. The subject matter described herein can in some embodiments include an inductance tuning system including at least one inductor connected to a first terminal, the at least one inductor comprising of a plurality of inductive elements that are substantially magnetically coupled to each other, wherein spacing between the inductive elements are substantially less than diameters of the windings. At least one capacitor can be connected between one or more of the plurality of inductive elements and a second terminal.

Abstract: Methods and devices for solderless integration of multiple semiconductor dies on flexible substrates. In some embodiments, a method for solderless integration of multiple semiconductor dies on flexible substrates includes arranging one or a plurality of semiconductor dies on a first carrier, active side down, and then depositing a sacrificial material over them. In some embodiments, the method further includes removing the first carrier and then building a wafer-level redistribution layer (RDL) over the active side of the one or plurality of semiconductor dies and the sacrificial material. In some embodiments, the method includes patterning the wafer-level RDL to form an outline of a final module footprint and then applying a second carrier to the wafer-level RDL. In some embodiments, the method can also include removing the sacrificial material from the one or plurality of semiconductor dies and the wafer-level RDL to achieve an integration of the one or plurality of semiconductor dies.

Abstract: The present subject matter relates to charge pump devices, systems, and methods in which a plurality of series-connected charge-pump stages are connected between a supply voltage node and a primary circuit node, and a discharge circuit is connected to the plurality of charge-pump stages, wherein the discharge circuit is configured to selectively remove charge from the primary circuit node.

Abstract: The present subject matter relates to systems, devices, and methods for reducing surface dielectric charging in a RF MEMS actuator element. In particular, a micro-electro-mechanical systems (MEMS) can comprise a fixed electrode positioned on a substrate, a moveable electrode positioned substantially above the fixed electrode and separated from the fixed electrode by a gap, and at least one standoff bump positioned between the fixed electrode and the moveable electrode, wherein the at least one standoff bump extends into the gap. In this configuration, one or both of the fixed electrode or the moveable electrode can be patterned to define one or more hole that is substantially aligned with the one or more of the at least one standoff bump. The bump and the hole can both help to reduce the rate of surface dielectric charging and the total amount of charge generated.

Abstract: The present subject matter relates to charge pump devices, systems, and methods in which a plurality of series-connected charge-pump stages are connected between a supply voltage node and a primary circuit node, and a discharge circuit is connected to the plurality of charge-pump stages, wherein the discharge circuit is configured to selectively remove charge from the primary circuit node.

Abstract: Systems, devices, and methods for adjusting tuning settings of tunable components, such as tunable capacitors, can be configured for calibrating a tunable component. Specifically, the systems, devices and methods can measure a device response for one or more inputs to a tunable component, store a calibration code in a non-volatile memory that characterizes the device response of the tunable component, and adjust a tuning setting of the tunable component based on the calibration code to achieve a desired response of the tunable component.