Abstract: A semiconductor arrangement including a substrate, a dielectric layer, and a semiconductor layer disposed between the substrate and the dielectric layer. The arrangement further includes an ohmic contact including a plurality of metal contact fragments located in a plurality of trenches formed in the dielectric layer, and a metallic connector layer electrically connecting the metal contact fragments. The ohmic contact electrically connects the metallic connector layer to the semiconductor layer.

Abstract: A semiconductor structure suitable for micro-transfer printing includes a semiconductor substrate and a patterned insulation layer disposed on or over the semiconductor substrate. The insulation layer pattern forms one or more etch vias in contact with the semiconductor substrate. Each etch via is exposed. A semiconductor device is disposed on the patterned insulation layer and is surrounded by an isolation material in one or more isolation vias that are adjacent to the etch via. The etch via can be at least partially filled with a semiconductor material that is etchable with a common etchant as the semiconductor substrate. Alternatively, the etch via is empty and the semiconductor substrate is patterned to form a gap that separates at least a part of the semiconductor device from the semiconductor substrate and forms a tether physically connecting the semiconductor device to an anchor portion of the semiconductor substrate or the patterned insulation layer.

Abstract: A method is provided for producing at least one electrical via in a substrate, the method comprising: producing a protective layer over a component structure which has been produced or is present on a front side of the substrate; forming at least one contact hole which extends from a surface of a backside of the substrate to a contact surface of the component structure; forming a metal-containing and thus conductive lining in the at least one contact hole creating a hollow electrically conductive structure in the at least one contact hole; and applying a passivation layer over the backside of the substrate, the passivation layer spanning over the hollow electrically conductive structure for forming the at least one electrical via. Also provided is a micro-technical component comprising at least one electrical via.

Abstract: A component to be transferred to a receiving substrate is to be coupled both electrically and thermally. This is achieved by an integrated circuit comprising a substrate and a plurality of first components formed in or on the substrate. A plurality of metallization layers are provided. A second component applied by transfer printing is provided which is positioned, at least in part, on a level with and laterally adjacent to at least one of the plurality of metallization layers.

Abstract: The present invention relates to a method for forming an electronic device intended to accommodate at least one fully depleted transistor of the FDSOI type and at least one partially depleted transistor of the PDSOI type, from a stack of layers (10) comprising at least one insulating layer (100) topped with at least one active layer (200) made of a semiconductor material, the method comprising at least one step of dry etching and one step of height adjustment between at least two etched elements.

Abstract: Invention achieves reduced amount of terminals to control a test mode, test function and test results of a given standard for at least one “wrapped core” (40,100) (a core 100 surrounded by a wrapper boundary register (40) as “wrapper chain”). Test flexibility and speed of testing the core (100) are also improved. Suggested serial test interface comprises a state machine (210) and an instruction register (213) for wrapper-instructions, supplied through a single physical data input terminal (1a). The state machine (210) reads wrapper-instructions held by the instruction register (213) and generates on-chip wrapper control signals (30) of the given standard for the wrapper boundary register (40) of the core (100). At least one wrapper-instruction read from the Instruction Register (213) provides at least one wrapper control signal (30). The single input terminal (1a) also supplies an input test signal SDI for coupling to the wrapper boundary register (40) as on chip logical input test signal WSI.

Abstract: A light shield for shielding a light sensitive element in an image sensor comprising a primary plate located such as to shield the light sensitive element from incident light, the primary plate comprising at least one aperture and the or each aperture being associated with a light blocking structure, wherein the light blocking structure comprises a secondary plate and a wall; the wall is arranged between the primary plate and the secondary plate, and is configured to act as a light barrier to light passing between the primary plate and the secondary plate.

Abstract: A CMOS image sensor pixel (200) comprising a photosensitive element (101) for generating a charge in response to incident light; a plurality of charge storage elements (103); a plurality of transfer gates (102) for enabling the transfer of charge between the photosensitive element and an associated one of the charge storage elements; and one or more first electrical connections (201) for placing at least two of the plurality of charge storage elements in mutual electrical contact.

Abstract: A method for manufacturing a system in a wafer for measuring an absolute and a relative pressure includes etching a shallow and a deep cavity in the wafer. A top wafer is applied and the top wafer is thinned for forming a first respectively second membrane over the shallow respectively deep cavity, and for forming in the top wafer first respectively second bondpads at the first respectively second membrane resulting in a first respectively second sensor. Back grinding the wafer results in an opened deep cavity and a still closed shallow cavity. The first bondpads of the first sensor measure an absolute pressure and the second bondpads of the second sensor measure a relative pressure. The etching in the first step defines the edges of the first membrane and of the second membrane in respectively the sensors formed from the shallow and the deep cavity.

Abstract: A MOS device assembly having at least two transistors, each transistor having a gate region. The dimensions of the gate region of the first transistor are different from the dimensions of the gate region of the second transistor. The transconductance of the MOS device assembly is substantially uniform when the gate regions of the first and second transistors are biased using the same voltage.

Abstract: The invention provides a method for use in forming a semiconductor device, the semiconductor device comprising a primary area and a periphery area, the method comprising: providing a substrate on which is situated: a stack in the primary area, the stack comprising a first oxide layer on the substrate, an oxynitride layer on the first oxide layer and a second oxide layer on the oxynitride layer; and a third oxide layer in the periphery area, the method further comprising: substantially removing the second oxide layer from the primary area and the third oxide layer from the periphery area; forming a fourth oxide layer in at least the primary area by an in situ steam generation (ISSG) process; and thereafter forming a polycrystalline semiconductor layer on the fourth oxide layer without any intervening oxidation process steps.

Abstract: A method of manufacturing a photodiode device comprises providing a stacked photodiode device. The stacked photodiode device comprises a substrate having a first conductivity type, a first well having a second conductivity type, within the substrate, and a second well having the first conductivity type, within the first well. The stacked photodiode device is modified by implanting a multiplication implant within the first well, so as to manufacture an avalanche photodiode device. A photodiode device comprising one or more stacked photodiodes and one or more avalanche photodiodes may be manufactured by providing two or more stacked photodiodes and modifying at least one of the stacked photodiodes by implanting a multiplication implant.

Abstract: A method of manufacturing an Organic Light Emitting Diode (OLED). The method comprises using a solution or a solvent for removing a photo-resist used for patterning, which photo-resist is at least partly covered with a material other than photo-resist. The method of manufacturing the OLED thus comprises a lift-off process. The new method provides the benefits of low cost manufacturing and high OLED performance.

Abstract: A CMOS circuit comprises CMOS MOSFETs having n-type and p-type gates on the same substrate, wherein the substrate is divided into regions of n-type and p-type diffusions, and those diffusions are contained within a deeper n-type diffusion, used to junction isolate components within the deeper n-type diffusion from components outside of the deeper n-type diffusion.

Abstract: A method of fabricating a tunnel oxide layer for a semiconductor memory device, the method comprising: fabricating on a substrate a first oxide layer by an in-situ-steam-generation process; and fabricating at least one further oxide layer by a furnace oxidation process, wherein during fabrication of the at least one further oxide layer, reactive gases penetrate the first oxide layer and react with the silicon substrate to form at least a first portion of the at least one further oxide layer beneath the first oxide layer.

Abstract: A semiconductor device comprising a semiconductor substrate and a composite capacitor structure on the semiconductor substrate, wherein the composite capacitor structure comprises a capacitor stack comprising a lower and an upper capacitor, respectively comprising first and second dielectric materials, wherein the first and second dielectric materials are different materials and/or have different thicknesses from each other. This can minimize the voltage dependence of the capacitance of the composite capacitor structure. It is also possible to provide a composite capacitor structure on the semiconductor substrate, wherein the composite capacitor structure comprises at least a first and a second capacitor stack, each comprising a lower and an upper capacitor. The capacitors can be MIM capacitors.

Abstract: A Metal Oxide Semiconductor (MOS) transistor comprising: a source; a gate; and a drain, the source, gate and drain being located in or on a well structure of a first doping polarity located in or on a substrate; wherein at least one of the source and the drain comprises a first structure comprising: a first region forming a first drift region, the first region being of a second doping polarity opposite the first doping polarity; a second region of the second doping polarity in or on the first region, the second region being a well region and having a doping concentration which is higher than the doping concentration of the first region; and a third region of the second doping polarity in or on the second region. Due to the presence of the second region the transistor may have a lower ON resistance when compared with a similar transistor which does not have the second region. The breakdown voltage may be influenced only to a small extent.

Abstract: Invention achieves reduced amount of terminals to control a test mode, test function and test results of a given standard for at least one “wrapped core” (40,100) (a core 100 surrounded by a wrapper boundary register (40) as “wrapper chain”). Test flexibility and speed of testing the core (100) are also improved. Suggested serial test interface comprises a state machine (210) and an instruction register (213) for wrapper-instructions, supplied through a single physical data input terminal (1a). The state machine (210) reads wrapper-instructions held by the instruction register (213) and generates on-chip wrapper control signals (30) of the given standard for the wrapper boundary register (40) of the core (100). At least one wrapper-instruction read from the Instruction Register (213) provides at least one wrapper control signal (30). The single input terminal (1a) also supplies an input test signal SDI for coupling to the wrapper boundary register (40) as on chip logical input test signal WSI.

Abstract: A semiconductor device including a p or p+ doped portion and an n or n+ doped portion separated from the p or p+ doped portion by a semiconductor drift portion. The device further includes an insulating portion provided adjacent the drift portion and at least one of the doped portions in a region where the drift portion and the at least one doped portion meet. The device further includes at least one additional portion, wherein the at least one additional portion is located such that, when the doped portions and the at least one additional portion are biased, the electrical potential lines leave the semiconductor drift portion homogeneously.

Abstract: A method of fabricating a tunnel oxide layer for a semiconductor memory device, the method comprising: fabricating on a substrate a first oxide layer by an in-situ-steam-generation process; and fabricating at least one further oxide layer by a furnace oxidation process, wherein during fabrication of the at least one further oxide layer, reactive gases penetrate the first oxide layer and react with the silicon substrate to form at least a first portion of the at least one further oxide layer beneath the first oxide layer.