Patents Assigned to Xcelsis Corporation
  • Wafer testing without direct probing
    Patent number: 10295588
    Abstract: The invention pertains to in-wafer testing of integrated circuits. In particular, it pertains to apparatuses and methods for testing small integrated circuits that have pad sizes and pitches that are too small for using conventional wafer probing technology.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: May 21, 2019
    Assignee: Xcelsis Corporation
    Inventors: Javier A. Delacruz, William C. Plants