Patents Assigned to XYZprinting, Inc.
  • Patent number: 9718239
    Abstract: A three dimensional printing (3D) apparatus and a three dimensional (3D) printing method are used for forming and stacking a plurality of modeling layers into a 3D object. The 3D printing apparatus includes a body having a modeling platform, a transmission module disposed on the body, a printing module, a curing module and a laser module. The printing module, the curing module and the laser module are disposed at and controlled by the transmission module to move relative to the body, respectively. A liquid modeling material is jetted from the printing module to the modeling platform and cured by the curing module to form the modeling layers. The laser module moves along a normal direction of the modeling platform according to a condition parameter and provides a laser beam along at least one plane parallel to the modeling platform to cut and trim at least one modeling layer.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: August 1, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventor: Yao-Te Huang
  • Patent number: 9709207
    Abstract: A chassis assembly structure includes a surrounding plate assembly, first abutting elements, second abutting elements and a third board. The first and second boards are coupled to form the surrounding plate assembly. Each first abutting element has a slider and a first stop plate extended from the first (or second) board, and each second abutting element has first and second convex plates extended from the second (or first) board. Each first convex plate has a first positioning groove at an end and a second stop plate at the other end. Each second convex plate has a second positioning groove, and both ends of each slider are slidably coupled to and limited in each of the first and second positioning grooves, and each first stop plate is stopped and limited by each second stop plate, and the third board covers a side of the surrounding plate assembly.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: July 18, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Chen-Fu Huang, An-Hsiu Lee, Tsai-Yi Lin
  • Patent number: 9707720
    Abstract: A method for controlling a three-dimensional printing apparatus and a three-dimensional printing system are provided. The method is applicable to controlling a tank of the three-dimensional printing apparatus and includes the following steps. A plurality of layer objects of a three-dimensional object are obtained according to a three-dimensional model, and the layer objects include a first layer object. A structural friability level of the first layer object is obtained according to cross-section information and a printing sequence of the first layer object. A swing velocity of the tank is determined according to the structural friability level. The tank is controlled to swing according to the swing velocity corresponding to the first layer object, such that the cured first layer object is separated from a bottom of the tank.
    Type: Grant
    Filed: September 1, 2014
    Date of Patent: July 18, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Peng-Yang Chen, Wen-Ten Lin
  • Patent number: 9691302
    Abstract: A recording apparatus comprises a plurality of supporting materials, a plurality of labels, and an unpacking recordation form. The supporting materials supports and fixes components of a specific device. The amount of the labels is at least the amount of the supporting materials plus two, wherein the labels comprises a starting-label and an ending-label pasted on the unpacking recordation form. The unpacking recordation form comprises several recording columns between the starting-label and the ending-label, wherein the amount of the recording columns is corresponding to that of the supporting materials. When unpacking the supporting materials from the device, the labels is removed from the supporting materials to paste to the recording columns. Therefore, user can determine if all supporting materials in the device are unpacked completely by checking if all of the recording columns are pasted by the labels.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 27, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC., CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED
    Inventor: Sin-In Ho
  • Patent number: 9688026
    Abstract: A heating platform including a substrate, a heating plate, a conducting plate and a temperature sensing element is provided. The substrate has a first surface for forming a three dimensional (3D) object and an opposite second surface. The heating plate is attached to the second surface of the substrate to heat the substrate. The conducting plate is attached to the heating plate, and the heating plate is coved between the substrate and the conducting plate, wherein the area of the conducting plate is smaller than the area of the substrate, and an end of the conducting plate extends to the outer of the heating plate. The temperature sensing element is disposed at the end of the conducting plate extending to the outer of the heating plate to sense the temperature of the substrate through the conducting plate. A 3D printing apparatus including the heating platform aforementioned is also provided.
    Type: Grant
    Filed: February 12, 2014
    Date of Patent: June 27, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Kwan Ho, Chih-Ming Chang
  • Patent number: 9662835
    Abstract: A printing head module and a three dimensional (3-D) printing apparatus using the same are provided. The 3-D printing apparatus includes a base and the printing head module. The printing head module is disposed above the base and includes a printing head and at least one material spool. The printing head includes a plurality of assembling pieces assembled with each other to form the printing head and define a nozzle of the printing head. Each of the assembling pieces includes at least one material-supply groove. The material-supply grooves of any two adjacent assembling pieces are located corresponding to each other to form at least one material-supply channel together. Each material spool is connected to the material-supply channel for providing at least one fluid material to the material-supply channel. The fluid material is transmitted via the material-supply channel to be dispensed on the base.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: May 30, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventor: Kwan Ho
  • Patent number: 9656425
    Abstract: A three-dimensional printing apparatus including a housing, a platform disposed in the housing and having a printing region, a frame disposed on an inner side of the housing and an operating module is provided. At least one cylinder disposed on the frame has a body and a pair of wings extended therefrom. The cylinder is carried on the frame by the wings, and a first gap is provided below each of the wings and between the body and the frame. The operating module is disposed in the housing to move relative to the printing region and the frame, and the operating module includes a pair of catching arms. After the catching arms are inserted into the first gaps, the operating module moves in a first direction to carry the cylinder on the catching arms, and then moves in a second direction to move the cylinder out from the frame.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: May 23, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Shih-Jer Din, Jui-Feng Chang
  • Patent number: 9630364
    Abstract: A three-dimensional (3-D) printing apparatus and a nozzle temperature adjustment method thereof are provided, and the nozzle temperature adjustment method includes the following. A first melting point temperature of a first feed material and a second melting point temperature of a second feed material are read when a feed material switch procedure is executed. The first melting point temperature and the second melting point temperature are compared, and the higher one is selected to serve as an initial conversion temperature. After executing a slag processing procedure according to the initial conversion temperature, the initial conversion temperature is adjusted to the second melting point temperature.
    Type: Grant
    Filed: February 13, 2014
    Date of Patent: April 25, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Kwan Ho, Chien-Ying Huang
  • Patent number: 9630362
    Abstract: A printing head module includes a driving gear, a bi-directional motor, a first feeding module and a second feeding module. The bi-directional motor selectively drives the driving gear to rotate along a first direction and a second direction. The first feeding module disposed at a first side of the driving gear includes a first unidirectional gear and a first idler gear. The driving gear is engaged with the first unidirectional gear, and the first unidirectional gear unidirectionally drives the first idler gear to rotate. The second feeding module is disposed at a second side of the driving gear opposite to the first side, and includes a second unidirectional gear and a second idler gear, the driving gear is engaged with the second unidirectional gear to drive the second unidirectional gear to rotate, and the second unidirectional gear unidirectionally drive the second idler gear to rotate.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: April 25, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Clyde Ventolina Cordero, Cher-Lek Toh, Wei-De Toh, Shy-Huey Yee
  • Patent number: 9610616
    Abstract: A cleaning apparatus is used for a carrier and a model is fixed on the carrier. The cleaning apparatus includes a case body, a sprinkling unit, a switching valve, and a rotating mechanism. The case body has an opening disposed at a top thereof, an outlet disposed at a bottom thereof, and a receiving space disposed between the opening and the outlet. The sprinkling unit is installed in the case body and has plural nozzles configured corresponding to the receiving space. The switching valve is installed at the outlet to open or close the outlet. The rotating mechanism is configured corresponding to the opening and connected to the carrier and is able to drive the carrier in which the model passes through the opening and is disposed in the receiving space. Thus, the safety, stability, and convenience of the model clean-up are improved.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: April 4, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC., CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED
    Inventors: Peng-Yang Chen, Wen-Ten Lin
  • Patent number: 9598185
    Abstract: A material filling apparatus for 3D printing fills materials into a material tank by a feeding part and includes a fixed sleeve with a first open end and a fixed end connected to the feeding part, a moving sleeve movably inserted and tightly fitted and interfered with the fixed sleeve, and a material output pipe inserted into the moving sleeve. The material tank is movably sheathed on the material output pipe. The moving sleeve has a second open end and a blocking end. The material output pipe has a connecting end and a material output end. The blocking end blocks the rear end of the material tank. The material tank squeezed by the filled material moves the connecting end towards the material output end and the rear end away from the material output end to push the blocking end and move the moving sleeve together with the material tank.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: March 21, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC., CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED
    Inventor: Tzu-Hua Su
  • Publication number: 20170028642
    Abstract: A printing head module including a body, a feeding roller assembly and a feeding sensor is provided. The body includes a material-supplying channel and a nozzle connected to the material-supplying channel. The feeding roller assembly is disposed at the material-supplying channel to transmit the modeling material to the nozzle. The feeding sensor is disposed at the feeding roller assembly to detect whether the feeding roller assembly rotates. The feeding sensor is coupled to a control unit, such that the control unit generates a notice according to a detection result of the feeding sensor.
    Type: Application
    Filed: October 17, 2016
    Publication date: February 2, 2017
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limi ted
    Inventors: Kwan Ho, Yu-Chuan Chang
  • Patent number: D777165
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: January 24, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC., CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED
    Inventors: Li-Wei Chen, Jen-Hsiang Liu, Ming-En Ho, Jia-Yi Juang, Yang-Teh Lee, Chun-An Hsu
  • Patent number: D777228
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: January 24, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC., CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED
    Inventors: Che-Wei Chang, Wen-Chun Chung, Chun-An Hsu
  • Patent number: D777808
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: January 31, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Che-Wei Chang, Wen-Chun Chung, Chun-An Hsu
  • Patent number: D777809
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: January 31, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventor: Pin-Hsuan Wu
  • Patent number: D777810
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: January 31, 2017
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company Limited
    Inventors: Chieh Kao, Wen-Chun Chung, Chun-An Hsu
  • Patent number: D779597
    Type: Grant
    Filed: June 1, 2015
    Date of Patent: February 21, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC., CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED
    Inventor: Te-Wei Liu
  • Patent number: D785093
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: April 25, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC., CAL-COMP ELECTRONICS & COMMUNICATIONS COMPANY LIMITED
    Inventors: Chun-An Hsu, Wen-Chun Chung, Chieh Kao
  • Patent number: D787574
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: May 23, 2017
    Assignees: XYZPRINTING, INC., KINPO ELECTRONICS, INC.
    Inventors: Yang-Teh Lee, Jia-Yi Juang, Chun-Hsiang Huang, Chun-Heng Ou, Kwei-Jui Teng, Yi-Chu Hsieh, Pin-Hsuan Wu, Hong-Chuan Yeh