Patents Assigned to Yamaichi Electronics Co., Ltd.
  • Patent number: 11199670
    Abstract: A length of a protection wall, which is greater than a length of projection of a connecting end portion of a plug connector from opening end portions of an upper case as well as a lower case of an optical module, is set to be smaller than an interval between a contact surface of each of lower stopper pieces of a receptacle cage to come into contact with an end surface of a side wall as well as an end surface of an end surface of the lower case and an opening end surface of a slot of a host connector.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: December 14, 2021
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 11029332
    Abstract: The test socket includes: a pressing body for pressing an IC package housed in a device housing portion in a direction toward a board; a lid-part main body holding the pressing body while allowing reciprocating movement in the direction toward and from the board, and to be connected to a housing-part main body; a stopper attached at an intermediate point to the lid-part main body so that the stopper is swingable, the stopper having an engaging portion 5a coming into engagement with the housing-part main body, and a proximal end portion approaching and separating from a side surface of the lid-part main body; and an insertion portion to be inserted into a gap between the proximal end portion and the side surface of the lid-part main body according to an action of the pressing body pressing the IC package in the direction toward the board.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: June 8, 2021
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Kouki Nakashima
  • Publication number: 20210075163
    Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).
    Type: Application
    Filed: December 14, 2017
    Publication date: March 11, 2021
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Publication number: 20210055488
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Application
    Filed: October 26, 2020
    Publication date: February 25, 2021
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Patent number: 10859777
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: December 8, 2020
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Publication number: 20200358217
    Abstract: A host connector includes a connector insulator having a slot allowing detachable insertion of a plug connector of a module, a first contact terminal group including contact terminals arranged inside the connector insulator and each brought into contact with a contact pad on one side at a connection end of the plug connector, and a second contact terminal group including contact terminals each brought into contact with a contact pad on another side opposed to the aforementioned contact pad. The first contact terminal group includes grounding sub-contact terminals arranged inside slits of the connector insulator, grounding main contact terminals supporting the grounding sub-contact terminals, and signal contact terminals. Contact portions of each grounding main contact terminal and of each signal contact terminal having the same shape are arranged on a common straight line, and the signal contact terminals are disposed between the grounding main contact terminals.
    Type: Application
    Filed: May 11, 2020
    Publication date: November 12, 2020
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Publication number: 20200142143
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Application
    Filed: January 3, 2020
    Publication date: May 7, 2020
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Patent number: 10534033
    Abstract: When each signal line contact terminal (10ai) is installed in a base member (30), an upper housing (28), and a lower housing (26), the upper housing (28) is installed together in such a way as to be sandwiched between the base member (30) and the lower housing (26). Here, collars (16) are fitted on outer peripheral portions of a first extending portion (52A) and a second extending portion (52C) of the signal line contact terminal (10ai), respectively. Moreover, air layers are formed between an outer peripheral portion of a drum portion (52B) of the signal line contact terminal (10ai) and an inner peripheral surface forming a hole (28b), between an outer peripheral portion of the first extending portion (52A) and an inner peripheral surface forming a hole (30b), between an outer peripheral portion of the second extending portion (52C) and an inner peripheral surface forming a hole (26b), and between an outer peripheral portion of a plunger (56) and an inner peripheral surface forming a hole (26e).
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: January 14, 2020
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yuji Nakamura, Masashi Iwata
  • Publication number: 20190302144
    Abstract: The test socket includes a fifth housing 15 located in a central part of contact terminals 21 in an axial direction and having electrical conductivity, plural through-holes 15c being formed in the fifth housing 15 to pass the respective contact terminals 21 therethrough; a sixth housing 16 stacked in the axial direction on the fifth housing 15, passage holes being formed in the sixth housing 16, the passage holes being configured to position the contact terminals 21 in a direction orthogonal to the axial direction; and an eighth housing 18 having electrical conductivity and stacked in the axial direction by sandwiching the sixth housing 16 between the eighth housing 18 and fifth housing 15, wherein the sixth housing 16 is provided with through-vias configured to form a conductive path in the axial direction.
    Type: Application
    Filed: March 27, 2019
    Publication date: October 3, 2019
    Applicant: Yamaichi Electronics Co., Ltd.
    Inventors: Yuji NAKAMURA, Masashi IWATA
  • Publication number: 20190285817
    Abstract: A length of a protection wall, which is greater than a length of projection of a connecting end portion of a plug connector from opening end portions of an upper case as well as a lower case of an optical module, is set to be smaller than an interval between a contact surface of each of lower stopper pieces of a receptacle cage to come into contact with an end surface of a side wall as well as an end surface of an end surface of the lower case and an opening end surface of a slot of a host connector.
    Type: Application
    Filed: October 3, 2018
    Publication date: September 19, 2019
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Patent number: 10321607
    Abstract: When an optical module is inserted into a compartment of a receptacle cage in a state where a heatsink is detached from the receptacle cage, a tip end portion of a protection wall portion of the optical module comes into contact with end portions of guide pieces of a guide plate even if the optical module is inserted with the protection wall portion being lifted up, and the tip end portion of the protection wall portion is thereby pushed down and guided to a clearance below the guide pieces.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: June 11, 2019
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Shigeru Sato, Yosuke Takai
  • Publication number: 20180238957
    Abstract: When each signal line contact terminal (10ai) is installed in a base member (30), an upper housing (28), and a lower housing (26), the upper housing (28) is installed together in such a way as to be sandwiched between the base member (30) and the lower housing (26). Here, collars (16) are fitted on outer peripheral portions of a first extending portion (52A) and a second extending portion (52C) of the signal line contact terminal (10ai), respectively. Moreover, air layers are formed between an outer peripheral portion of a drum portion (52B) of the signal line contact terminal (10ai) and an inner peripheral surface forming a hole (28b), between an outer peripheral portion of the first extending portion (52A) and an inner peripheral surface forming a hole (30b), between an outer peripheral portion of the second extending portion (52C) and an inner peripheral surface forming a hole (26b), and between an outer peripheral portion of a plunger (56) and an inner peripheral surface forming a hole (26e).
    Type: Application
    Filed: August 23, 2016
    Publication date: August 23, 2018
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yuji NAKAMURA, Masashi IWATA
  • Patent number: 10044124
    Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: August 7, 2018
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Hideki Sagano, Hideki Sato
  • Publication number: 20180164519
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Application
    Filed: June 8, 2016
    Publication date: June 14, 2018
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Patent number: 9930781
    Abstract: In a receptacle assembly, a module is guided by a guide rail and held inside an opening of a printed wiring board when a plug connector of the module is connected to a host connector. The receptacle assembly includes a guide member provided on the periphery of the opening of the wiring board and configured to form a module accommodation portion to detachably accommodate the module comprising a module board and to guide the module, a connector unit provided on the wiring board and configured to electrically connect the module board of the module to the wiring board, a first EMI gasket sealing a gap between a lower end portion of a connector cover covering the connector unit and the wiring board, and a second EMI gasket sealing a gap between a connecting end portion of the module and the periphery of an opening of the connector unit.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: March 27, 2018
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 9891394
    Abstract: In a transceiver module, where one end of a module substrate is inserted and connected to a concave portion of a plug connector and when one end face of the module substrate is touched to the inner periphery face forming the concave portion, a projection portion formed at the periphery of the concave portion of the plug connector is fitted to a notch portion of the module substrate.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: February 13, 2018
    Assignees: YAMAICHI ELECTRONICS CO., LTD., HITACHI METALS, LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito, Yoshinori Sunaga, Izumi Fukasaku, Kinya Yamazaki
  • Patent number: 9831582
    Abstract: A cable connector includes a connection end portion of a flexible board, in which a rectangular reinforcing plate molded of a conductive resin material is fixed to part of an upper surface of a ground plate. The connection end portion of the flexible board is electrically connected to a printed circuit board through the cable connector.
    Type: Grant
    Filed: June 7, 2017
    Date of Patent: November 28, 2017
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai
  • Patent number: 9759879
    Abstract: An electrode portion of a module board to be disposed in a transceiver module is formed from a group of contact pads which are arrayed substantially in parallel to a long side of the module board, and the group of contact pads include a line of ground line pads formed at predetermined intervals from one end to the other end, and two lines of signal line pads formed in spaces between the ground line pads.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: September 12, 2017
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Publication number: 20170250484
    Abstract: In a contact terminal, a first touch portion and a second touch portion of a movable piece and a first touch portion and a second touch portion of a movable piece bite into and thus pinch a spherical surface of a bump of a semiconductor device. In this state, when an electrode surface of the semiconductor device is warped upward during a test and the bump is about to be moved up, an inclined surface of a fixing portion of the movable piece and an inclined surface of a fixing portion of the movable piece fix the spherical surface of the bump.
    Type: Application
    Filed: February 14, 2017
    Publication date: August 31, 2017
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Hideki SAGANO, Hideki SATO
  • Publication number: 20170214184
    Abstract: A contact unit includes signal and power-supply contact terminals, a first blade in which the contact terminals are nipped and held, and a second blade. In each contact terminal formed of a conductive metal material by using the MEMS technique, for example, a tapered portion of a short-circuit piece and a tapered portion of another short-circuit piece come into contact with each other when a pressure at a predetermined value or higher is applied to a first contact and a second contact in a direction to come close to each other.
    Type: Application
    Filed: January 18, 2017
    Publication date: July 27, 2017
    Applicants: YAMAICHI ELECTRONICS CO., LTD., FUJITSU LIMITED
    Inventors: Yosuke TAKAI, Toshiyasu ITO, Satoshi OHSAWA