Patents Assigned to Yamaichi Electronics Co., Ltd.
  • Patent number: 11545779
    Abstract: According to an embodiment, a high-speed transmission connector includes: a row of first contacts, a row of second contacts, a row of third contacts, a row of fourth contacts, an upper housing that supports the row of first contacts, a lower housing that supports the row of second contacts, and an inner housing that supports the row of third contacts and the row of fourth contacts. The upper housing, the lower housing, and the inner housing are assembled in such a manner that the upper housing and the lower housing face each other in a vertical direction with a gap therebetween, and the inner housing is accommodated in the upper housing and the lower housing. The gap forms a slot into which a header of a device as a communicating counterpart is to be fitted.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: January 3, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Yoshiharu Ishii
  • Patent number: 11536743
    Abstract: Provided is a Kelvin contact for inspection in which contacts and an insulating layer are less likely to be shifted relative to each other even after repeatedly performed Kelvin inspection. The Kelvin contact for inspection includes: a first contact having an upper contact point that comes into contact with one electrode terminal of an IC device and a lower contact point that comes into contact with an electrode pad of a substrate for inspection; and a second contact having an upper contact point that comes into contact with the one electrode terminal and the lower contact point that comes into contact with an electrode pad of the substrate for inspection. The first and second contacts are adjacently arranged to contact with the same one electrode terminal and provided with an insulating layer surrounding the entire main body area except upper and lower contact point areas including the upper and lower contact points, respectively.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: December 27, 2022
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Katsumi Suzuki, Akira Genma, Tsuyoshi Matsumoto, Tetsuya Kubota
  • Patent number: 11531060
    Abstract: The cylindrical member includes a cylindrical base material 40 made of beryllium copper, a first coating layer that is formed on the base material 40 and made of a Ni-based material and serves as a reinforcing material for the base material 40, and a second coating layer 42 that is formed on the first coating layers and made of a metal-based material different from the base material 40, wherein the first coating layer 41 has higher hardness than the base material 40, when the thickness of the base material 40 is represented by TB and the layer thickness of the first coating layer 41 formed on the outer surface is represented by T1OUT, the base material 40 is formed so as to satisfy 13 ?m?TB?25 ?m, and the first coating layer 41 is formed so as to satisfy T1OUT?TBĂ—4%.
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: December 20, 2022
    Assignee: Yamaichi Electronics, Co. Ltd.
    Inventors: Takeyuki Suzuki, Katsumi Suzuki, Satoshi Iizumi
  • Publication number: 20220368087
    Abstract: Provided are a cable connector and a cable connector assembly that can reduce crosstalk that may occur between proximate differential pairs at an end of a cable on an electronic device side. The cable connector for electrically connecting a cable (31a) to an electronic device (for example, an optical transceiver or an integrated circuit) includes a metal shield member (20) configured to cover a circumference of a part near an end of a differential pair (30a) on the electronic device side, and the differential pair is formed of the cable (31a).
    Type: Application
    Filed: October 3, 2019
    Publication date: November 17, 2022
    Applicant: Yamaichi Electronics Co., Ltd.
    Inventors: Kiyoshi ABE, Takahiro SHIMOYAMA
  • Patent number: 11450983
    Abstract: According to an embodiment, a housing of a high-speed transmission connector fitted to a connector of a counterpart substrate via a frontage. The housing of the first aspect includes: a bottom plate forming a bottom of the frontage and being provided with at least one boss on a surface opposite to the frontage side; a pair of first side walls facing each other in a first direction with the frontage sandwiched therebetween; and a pair of second side walls facing each other in a second direction orthogonal to the first direction with the frontage sandwiched therebetween. The bottom plate is provided with first through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the first side walls in the same planes and/or second through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the second side walls in the same planes.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: September 20, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Takahiro Shimoyama
  • Patent number: 11415624
    Abstract: An IC socket (2) includes a first contact terminal (15a) that contacts a gull wing type lead terminal (1b) of an IC device (1), a second contact terminal that contacts a J-type lead terminal, a cam portion (3d) and a sliding portion (15c5) for bringing the first contact terminal (15a) into contact with the gull wing type lead terminal (1b), and a latch (6) for bringing the second contact terminal into contact with the J-type lead terminal. An asynchronous operation in which a contact operation by the cam portion (3d) and the sliding portion (15c5) is performed after a contact operation by the latch (6) is performed.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 16, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Junichi Miyaaki
  • Patent number: 11360118
    Abstract: The contact probe comprises a barrel 50, an inspection device side terminal 60, a test board side terminal 70, and a spring 80 disposed in a state of being in contact with the test board side terminal 70 and the inspection device side terminal 60, the test board side terminal 70 includes a stop portion 74 that can abut on the caulked portion 52 in the barrel 50 and a terminal body that projects from the other end 56 of the barrel 50, and the terminal body includes, in order from a tip end, a first shaft section 71, a second shaft section 72 having a diameter larger than a diameter of the first shaft section 71, and a third shaft section 73 having a diameter smaller than the diameter of the second shaft section 72 and having at least a part that can be housed in the barrel 50.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: June 14, 2022
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Katsumi Suzuki, Seiya Yamamoto
  • Patent number: 11353497
    Abstract: A test socket includes a pedestal. The pedestal includes a central pedestal including a central contact portion coming in contact with a central region of a bottom surface of a semiconductor package and a plurality of insertion holes formed to correspond to a plurality of solder balls projecting from the bottom surface of the semiconductor package, so as to allow the solder balls to be inserted into respective insertion holes. The pedestal further includes a circumferential pedestal separated from the central pedestal by a space having an opening width larger than a diameter of the insertion hole and including a circumferential contact portion coming in contact with a circumference of the bottom surface of the semiconductor package.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: June 7, 2022
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Takanori Nose
  • Patent number: 11336045
    Abstract: According to an embodiment, an LGA socket includes a center substrate, first and second insulator and a plurality of pairs of contacts. The center substrate is configured by a multi-layer structure including a ground layer and a plurality of through holes formed through the center substrate. The first insulator is arranged around the plurality of through holes on an upper surface of the center substrate. The second insulator is arranged around the plurality of through holes on a lower surface of the center substrate. The plurality of pairs of contacts are inserted into the through holes from an upper side and from a lower side of the through holes and are soldered via the through holes to be electrically connected to each other.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: May 17, 2022
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Yoshiya Yamada, Koji Kikuchi, Toshiyasu Ito, Yosuke Takai
  • Patent number: 11329419
    Abstract: The inspection socket includes: a contact terminal 80 including a barrel 82 having a flange section 90, a device-side terminal 84, and a board-side terminal 86; housings 10, 30, and 50 having through holes 10c, 30c, and 50c into which the contact terminal 80 is inserted; and housings 20 and 40 having through holes 20c and 40c into which the contact terminal 80 is inserted, the through holes 20c and 40c being larger than the outer diameter of the contact terminal 80 excluding the flange section 90 and smaller than the outer diameter of the flange section 90. The housings 20 and 40 are sandwiched between the housings 10, 30, and 50, the flange section 90 is contained in the through hole 50c, and the through holes 10c, 30c, and 50c are designed to have, for impedance matching, a gap from the outer periphery of the contact terminal 80.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: May 10, 2022
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Yuji Nakamura
  • Patent number: 11293944
    Abstract: The test socket includes a fifth housing 15 located in a central part of contact terminals 21 in an axial direction and having electrical conductivity, plural through-holes 15c being formed in the fifth housing 15 to pass the respective contact terminals 21 therethrough; a sixth housing 16 stacked in the axial direction on the fifth housing 15, passage holes being formed in the sixth housing 16, the passage holes being configured to position the contact terminals 21 in a direction orthogonal to the axial direction; and an eighth housing 18 having electrical conductivity and stacked in the axial direction by sandwiching the sixth housing 16 between the eighth housing 18 and fifth housing 15, wherein the sixth housing 16 is provided with through-vias configured to form a conductive path in the axial direction.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: April 5, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yuji Nakamura, Masashi Iwata
  • Patent number: 11243363
    Abstract: In a transceiver module, when one end portion of a module board (18) is inserted and connected to a concave portion (16R) of a plug connector (16), a projection portion (16PP) formed on the periphery of the concave portion (16R) of the plug connector (16) is fitted into a notch portion (18PH) as one end surface of the module board (18) comes into contact with an inner peripheral surface that forms the concave portion (16R).
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: February 8, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 11239589
    Abstract: A host connector includes a connector insulator having a slot allowing detachable insertion of a plug connector of a module, a first contact terminal group including contact terminals arranged inside the connector insulator and each brought into contact with a contact pad on one side at a connection end of the plug connector, and a second contact terminal group including contact terminals each brought into contact with a contact pad on another side opposed to the aforementioned contact pad. The first contact terminal group includes grounding sub-contact terminals arranged inside slits of the connector insulator, grounding main contact terminals supporting the grounding sub-contact terminals, and signal contact terminals. Contact portions of each grounding main contact terminal and of each signal contact terminal having the same shape are arranged on a common straight line, and the signal contact terminals are disposed between the grounding main contact terminals.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: February 1, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 11199670
    Abstract: A length of a protection wall, which is greater than a length of projection of a connecting end portion of a plug connector from opening end portions of an upper case as well as a lower case of an optical module, is set to be smaller than an interval between a contact surface of each of lower stopper pieces of a receptacle cage to come into contact with an end surface of a side wall as well as an end surface of an end surface of the lower case and an opening end surface of a slot of a host connector.
    Type: Grant
    Filed: October 3, 2018
    Date of Patent: December 14, 2021
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 11029332
    Abstract: The test socket includes: a pressing body for pressing an IC package housed in a device housing portion in a direction toward a board; a lid-part main body holding the pressing body while allowing reciprocating movement in the direction toward and from the board, and to be connected to a housing-part main body; a stopper attached at an intermediate point to the lid-part main body so that the stopper is swingable, the stopper having an engaging portion 5a coming into engagement with the housing-part main body, and a proximal end portion approaching and separating from a side surface of the lid-part main body; and an insertion portion to be inserted into a gap between the proximal end portion and the side surface of the lid-part main body according to an action of the pressing body pressing the IC package in the direction toward the board.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: June 8, 2021
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Kouki Nakashima
  • Publication number: 20210075163
    Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).
    Type: Application
    Filed: December 14, 2017
    Publication date: March 11, 2021
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke TAKAI, Toshiyasu ITO
  • Patent number: D949799
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: April 26, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai, Taichi Enjoji
  • Patent number: D958758
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: July 26, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Takahiro Shimoyama
  • Patent number: D968337
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: November 1, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Masaaki Saito
  • Patent number: D969749
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: November 15, 2022
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai, Taichi Enjoji