Patents Assigned to Yamaichi Electronics Co., Ltd.
  • Publication number: 20250112428
    Abstract: Provided are a relay device and a connector assembly that can electrically connect a connector and an external circuit board to each other without using terminals bent at a right angle. A relay device configured to electrically connect a plurality of contact pins to a plurality of cables and a host board includes a paddle board and a connection part, the paddle board electrically connects some of the plurality of contact pins to the plurality of cables, the connection part has a plurality of press-fit pins, and the plurality of press-fit pins electrically connect the paddle board to the host board.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 3, 2025
    Applicant: Yamaichi Electronics Co., Ltd.
    Inventors: Toshiyasu ITO, Toshitaka KURODA, Masaaki SAITO
  • Patent number: 12255418
    Abstract: A connector (7) includes: a first connector part (10) having a first module side connection part connected to one end of an OSFP module in the front (F), having a first substrate side connection part connected to a substrate, and installed on the substrate; a second connector part (20) provided at a position such that the first module side connection part is interposed between the substrate and the second connector part (20), having a second module side connection part connected to one end of an OSFP module at the front (F), having a second substrate side connection part connected to the substrate, and stacked on the first connector part (10); and an intermediate part (30) provided between the first connector part (10) and the second connector part (20), and a cooling flow path in which air flows from the front (F) side toward the rear (R) side of the connector (7) is formed in the intermediate part (30).
    Type: Grant
    Filed: October 9, 2019
    Date of Patent: March 18, 2025
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Toshiyasu Ito, Masaaki Saito
  • Patent number: 12237599
    Abstract: A socket includes a housing and a plurality of contacts. The housing is formed in a box-shape with an opening and is provided with a matrix of through holes at a bottom portion. The plurality of contacts includes ground contacts and signal contacts which are arranged so as to be aligned alternately in a predetermined array direction by one or a plurality of them and are passed through the through holes. The ground contacts adjacent to each other in the array direction are short-circuited.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: February 25, 2025
    Assignees: YAMAICHI ELECTRONICS CO., LTD., Huawei Technologies Co., Ltd.
    Inventor: Toshiyasu Ito
  • Patent number: 12027790
    Abstract: A connector set is provided that includes a first connector, a first cap to be attached to the first connector when the first connector is reflow-mounted on a first external substrate, a second connector, and a second cap to be attached to the second connector when the second connector is reflow-mounted on a second external substrate formed of a material with a smaller thermal expansion coefficient than that of the first external substrate. The second cap is formed of a material with a smaller thermal expansion coefficient than that of the first cap.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: July 2, 2024
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai
  • Publication number: 20240213715
    Abstract: A plug connector inserted in or extracted from a receptacle connector includes a casing and a lever member attached to the casing. The lever member has a fulcrum part supported pivotably to the casing, an engaging part that is located closer to the receptacle connector than the fulcrum part in an insertion-extraction direction and that can engage with an engaged part of the receptacle connector, and an operating part that is located on the opposite side from the receptacle connector with respect to the fulcrum part in the insertion-extraction direction and that, when pressed, can release the engaging part from engagement with the engaged part.
    Type: Application
    Filed: December 23, 2022
    Publication date: June 27, 2024
    Applicant: Yamaichi Electronics Co., Ltd.
    Inventor: Toshiyasu ITO
  • Patent number: 11984679
    Abstract: A connector set is disclosed that includes a plurality of connectors and a cap to be attached to the plurality of connectors when the plurality of connectors are reflow-mounted on an external substrate. Each one end portion of the connectors and the cap is provided with a fitted portion and a fitting portion to be fitted in the fitted portion. The fitted portion is provided with an opening portion for moving the fitting portion so as to absorb thermal expansion from one end portion side to the other end portion side due to temperature conversion of reflow.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: May 14, 2024
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai
  • Patent number: 11967785
    Abstract: A high-speed transmission connector is described that includes a housing, a row of front side contacts supported on the housing, a row of rear side contacts supported on the housing, and a metal member. The housing has a slot to be fitted with a header of an external communication partner, and an upper plate portion and a lower plate portion facing each other vertically across the slot. The front side contact portions are exposed on a front side in the slot and the rear side contact portions are exposed on a rear side in the slot. The metal member supports the upper plate portion and the lower plate portion and fastens the upper plate portion and the lower plate portion.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: April 23, 2024
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yoshiharu Ishii, Toshiyasu Ito
  • Patent number: 11949179
    Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: April 2, 2024
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai
  • Publication number: 20240019462
    Abstract: Provided are a contact pin and a socket for inspection that can improve electrical performance or thermal performance. An embodiment includes: an electric conductive electrical contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; an electric conductive thermal contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive casing that bundles the electrical contact and the thermal contact laterally stacked adjacent to each other, and the casing is in contact with the electrical contact and the thermal contact so as to form a path bypassing the elastic deformation part.
    Type: Application
    Filed: July 11, 2023
    Publication date: January 18, 2024
    Applicant: Yamaichi Electronics Co., Ltd.
    Inventor: Junichi MIYAAKI
  • Patent number: 11821915
    Abstract: Provided is a socket for inspection that can correct inclination of a terminal in contact with a device under inspection to stabilize the terminal-to-electrode contact. The socket includes: a contact terminal having a barrel with a flange, a device side terminal, a test board side terminal, and a spring; a housing having a stepped hole through which the contact terminal is inserted and in which a step that abuts against the flange is axially formed; and a movable pedestal provided so as to move closer to and away from the housing and having a receiving hole through which a distal end side of the device side terminal projecting from the barrel is inserted and which receives an electrode of the device. A guide part whose inner diameter is substantially the same as the outer diameter of a projecting portion of the device side terminal is formed in the receiving hole.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: November 21, 2023
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Kouki Nakashima, Katsumi Suzuki
  • Patent number: 11678453
    Abstract: A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: June 13, 2023
    Assignees: YAMAICHI ELECTRONICS CO., LTD., HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Toshiyasu Ito, Hui Zhang, Jie Zhang, Xiaohui Li
  • Patent number: 11624774
    Abstract: Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat (12) that has an attachment surface (12a) to which an image sensor (60) is attached; a base (10) that has a placement surface (10b) on which the seat (12) is placed and a secured surface (10a) located on an opposite side of the placement surface (10b) and secured to an inspection substrate; and a lid member (18) that does not come into contact with the image sensor (60) and that covers a back surface region (80) on a side of a back surface (64) of the image sensor (60) when the image sensor (60) is attached to the seat (12).
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: April 11, 2023
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Hiroki Kobayashi
  • Patent number: 11626678
    Abstract: According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: April 11, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu Ito, Yosuke Takai, Taichi Enjoji
  • Patent number: 11600950
    Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: March 7, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Yosuke Takai, Toshiyasu Ito
  • Patent number: 11569618
    Abstract: A socket having a housing, a plurality of contacts, a plurality of insulating members and a plurality of conductive resin members is described. The housing is in a box shape with an opening and is provided with a matrix of penetration holes at a bottom portion. The plurality of contacts include contacts for ground and respective pairs of contacts for high-speed differential transmission. The plurality of insulating members support the plurality of contacts and are pressed into the housing so that the contacts are exposed on an opposite side of the opening from the penetration holes of the housing. The plurality of conductive resin members are fitted at positions of the plurality of insulating members in contact with the contacts for ground.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: January 31, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Toshiyasu Ito
  • Patent number: 11545779
    Abstract: According to an embodiment, a high-speed transmission connector includes: a row of first contacts, a row of second contacts, a row of third contacts, a row of fourth contacts, an upper housing that supports the row of first contacts, a lower housing that supports the row of second contacts, and an inner housing that supports the row of third contacts and the row of fourth contacts. The upper housing, the lower housing, and the inner housing are assembled in such a manner that the upper housing and the lower housing face each other in a vertical direction with a gap therebetween, and the inner housing is accommodated in the upper housing and the lower housing. The gap forms a slot into which a header of a device as a communicating counterpart is to be fitted.
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: January 3, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Yoshiharu Ishii
  • Patent number: D978804
    Type: Grant
    Filed: June 9, 2020
    Date of Patent: February 21, 2023
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Takahiro Shimoyama
  • Patent number: D983146
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: April 11, 2023
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Takahiro Shimoyama
  • Patent number: D1070773
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: April 15, 2025
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Toshiyasu Ito
  • Patent number: D1070774
    Type: Grant
    Filed: September 28, 2022
    Date of Patent: April 15, 2025
    Assignee: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Toshiyasu Ito