Abstract: A high-speed transmission connector is described that includes a housing, a row of front side contacts supported on the housing, a row of rear side contacts supported on the housing, and a metal member. The housing has a slot to be fitted with a header of an external communication partner, and an upper plate portion and a lower plate portion facing each other vertically across the slot. The front side contact portions are exposed on a front side in the slot and the rear side contact portions are exposed on a rear side in the slot. The metal member supports the upper plate portion and the lower plate portion and fastens the upper plate portion and the lower plate portion.

Abstract: A connector is provided that includes a plurality of socket type connectors to be mounted on a first substrate and a plurality of plug type connectors to be mounted on a second substrate, thereby electrically connecting the first substrate and the second substrate. The socket type connector includes a housing with a slot and a plurality of contacts arranged in the slot. The plug type connector includes a housing with a header to be fitted in the slot, and a plurality of contacts arranged in the header. The housing of the socket type connector and the housing of the plug type connector has a rotationally asymmetrical shape as viewed from a fitting direction.

Abstract: Provided are a contact pin and a socket for inspection that can improve electrical performance or thermal performance. An embodiment includes: an electric conductive electrical contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; an electric conductive thermal contact extending from the base end to the tip and having an elastic deformation part elastically expandable and compressible in the extending direction formed between the base end and the tip; and an electrically conductive casing that bundles the electrical contact and the thermal contact laterally stacked adjacent to each other, and the casing is in contact with the electrical contact and the thermal contact so as to form a path bypassing the elastic deformation part.

Abstract: Provided is a socket for inspection that can correct inclination of a terminal in contact with a device under inspection to stabilize the terminal-to-electrode contact. The socket includes: a contact terminal having a barrel with a flange, a device side terminal, a test board side terminal, and a spring; a housing having a stepped hole through which the contact terminal is inserted and in which a step that abuts against the flange is axially formed; and a movable pedestal provided so as to move closer to and away from the housing and having a receiving hole through which a distal end side of the device side terminal projecting from the barrel is inserted and which receives an electrode of the device. A guide part whose inner diameter is substantially the same as the outer diameter of a projecting portion of the device side terminal is formed in the receiving hole.

Abstract: A socket which holds an IC package and is to be mounted on a circuit board is described that includes: a housing with a bottom portion, two pairs of side wall portions and an opening accommodating the IC package, contacts and holders. The bottom portion is provided with penetration holes. The two pairs of side wall portions face each other across the opening and one pair of side wall portions are provided with ribs protruding outward. The contacts are supported by the housing so as to pass through the penetration holes and are exposed on an opposite side of the opening. The holders have first support holes and are fixed to side surfaces of the housing with the ribs passing through the first support holes.

Abstract: According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.

Abstract: Provided is an IC socket for a semiconductor capable of preventing adhesion of dust to a photodetection surface provided on an opposite side of a contact surface of an image sensor with no contact with the photodetection surface. The IC socket for a semiconductor includes: a seat (12) that has an attachment surface (12a) to which an image sensor (60) is attached; a base (10) that has a placement surface (10b) on which the seat (12) is placed and a secured surface (10a) located on an opposite side of the placement surface (10b) and secured to an inspection substrate; and a lid member (18) that does not come into contact with the image sensor (60) and that covers a back surface region (80) on a side of a back surface (64) of the image sensor (60) when the image sensor (60) is attached to the seat (12).

Abstract: A group of contact pads (20EB) formed on a lower surface (20B) at a connection end of a board portion of an optical module board (20) includes, in order from the endmost end, a contact pad (20B1) conducting to a ground line (G), contact pads (20B2) and (20B3) conducting to transmission-side high-speed signal lines (S), a contact pad (20B4) conducting to the ground line (G), contact pads (20B5, 20B6, and 20B7) conducting to low-speed signal lines (S), a contact pad (20B8) conducting to the ground line (G), contact pads (20B9 and 20B10) conducting to receiving-side high-speed signal lines (S), and a contact pad (20B11) conducting to the ground line (G).

Abstract: A socket having a housing, a plurality of contacts, a plurality of insulating members and a plurality of conductive resin members is described. The housing is in a box shape with an opening and is provided with a matrix of penetration holes at a bottom portion. The plurality of contacts include contacts for ground and respective pairs of contacts for high-speed differential transmission. The plurality of insulating members support the plurality of contacts and are pressed into the housing so that the contacts are exposed on an opposite side of the opening from the penetration holes of the housing. The plurality of conductive resin members are fitted at positions of the plurality of insulating members in contact with the contacts for ground.

Abstract: According to an embodiment, a high-speed transmission connector includes: a row of first contacts, a row of second contacts, a row of third contacts, a row of fourth contacts, an upper housing that supports the row of first contacts, a lower housing that supports the row of second contacts, and an inner housing that supports the row of third contacts and the row of fourth contacts. The upper housing, the lower housing, and the inner housing are assembled in such a manner that the upper housing and the lower housing face each other in a vertical direction with a gap therebetween, and the inner housing is accommodated in the upper housing and the lower housing. The gap forms a slot into which a header of a device as a communicating counterpart is to be fitted.

Abstract: Provided is a Kelvin contact for inspection in which contacts and an insulating layer are less likely to be shifted relative to each other even after repeatedly performed Kelvin inspection. The Kelvin contact for inspection includes: a first contact having an upper contact point that comes into contact with one electrode terminal of an IC device and a lower contact point that comes into contact with an electrode pad of a substrate for inspection; and a second contact having an upper contact point that comes into contact with the one electrode terminal and the lower contact point that comes into contact with an electrode pad of the substrate for inspection. The first and second contacts are adjacently arranged to contact with the same one electrode terminal and provided with an insulating layer surrounding the entire main body area except upper and lower contact point areas including the upper and lower contact points, respectively.

Abstract: The cylindrical member includes a cylindrical base material 40 made of beryllium copper, a first coating layer that is formed on the base material 40 and made of a Ni-based material and serves as a reinforcing material for the base material 40, and a second coating layer 42 that is formed on the first coating layers and made of a metal-based material different from the base material 40, wherein the first coating layer 41 has higher hardness than the base material 40, when the thickness of the base material 40 is represented by TB and the layer thickness of the first coating layer 41 formed on the outer surface is represented by T1OUT, the base material 40 is formed so as to satisfy 13 ?m?TB?25 ?m, and the first coating layer 41 is formed so as to satisfy T1OUT?TB×4%.

Abstract: Provided are a cable connector and a cable connector assembly that can reduce crosstalk that may occur between proximate differential pairs at an end of a cable on an electronic device side. The cable connector for electrically connecting a cable (31a) to an electronic device (for example, an optical transceiver or an integrated circuit) includes a metal shield member (20) configured to cover a circumference of a part near an end of a differential pair (30a) on the electronic device side, and the differential pair is formed of the cable (31a).

Abstract: According to an embodiment, a housing of a high-speed transmission connector fitted to a connector of a counterpart substrate via a frontage. The housing of the first aspect includes: a bottom plate forming a bottom of the frontage and being provided with at least one boss on a surface opposite to the frontage side; a pair of first side walls facing each other in a first direction with the frontage sandwiched therebetween; and a pair of second side walls facing each other in a second direction orthogonal to the first direction with the frontage sandwiched therebetween. The bottom plate is provided with first through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the first side walls in the same planes and/or second through holes for tolerance measurement having inner peripheral surfaces including side wall surfaces of the second side walls in the same planes.

Abstract: An IC socket (2) includes a first contact terminal (15a) that contacts a gull wing type lead terminal (1b) of an IC device (1), a second contact terminal that contacts a J-type lead terminal, a cam portion (3d) and a sliding portion (15c5) for bringing the first contact terminal (15a) into contact with the gull wing type lead terminal (1b), and a latch (6) for bringing the second contact terminal into contact with the J-type lead terminal. An asynchronous operation in which a contact operation by the cam portion (3d) and the sliding portion (15c5) is performed after a contact operation by the latch (6) is performed.