Patents Assigned to Yamaichi Electronics Co., Ltd.
  • Patent number: 8835768
    Abstract: In a flexible circuit board, signal wirings and ground wirings are provided on one main surface of a base film formed of a thermoset resin. A coverlay film formed of a thermoplastic resin is adhered to and integrated with the signal wirings, ground wirings, and base film. External terminals 15 are disposed in a predetermined conductor pattern on one main surface of the coverlay film, and a plated layer is formed on each of the external terminals. A first ground layer and a rear side resin film are adhered in this order below the base film to be integrated.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: September 16, 2014
    Assignee: Yamaichi Electronics Co. Ltd.
    Inventor: Noriaki Sekine
  • Publication number: 20140202755
    Abstract: In a receptacle cage, a front EMI fingers in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between outer peripheral surfaces of an upper case as well as a lower plate of an optical module connected to a receptacle connector in a receptacle connector accommodating portion and an inner surface of the cage is shielded by a top EMI fingers serving as a second shield member and side EMI fingers serving as third shield members. Moreover, the lower plate comes into contact with a bottom wall portion which is grounded.
    Type: Application
    Filed: March 24, 2014
    Publication date: July 24, 2014
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Toshiyasu ITO
  • Patent number: 8770864
    Abstract: An optical module receptacle assembly includes a receptacle cage to detachably house an optical module, a receptacle connector housed in a receptacle connector accommodating portion of the receptacle cage, and a connector cover covering the receptacle connector. A given clearance CLE, which is greater than a clearance CLD being set smaller than a clearance CLA, is formed between an upper surface of a tip end portion of a plug connector of the optical module and an inner peripheral surface of a slot of the receptacle connector.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: July 8, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Toshiyasu Ito
  • Patent number: 8735731
    Abstract: In a flexible circuit board, signal wirings and ground wirings are provided on one main surface of a base film formed of a thermoset resin. A coverlay film formed of a thermoplastic resin is adhered to and integrated with the signal wirings, ground wirings, and base film. External terminals 15 are disposed in a predetermined conductor pattern on one main surface of the coverlay film, and a plated layer is formed on each of the external terminals. A first ground layer and a rear side resin film are adhered in this order below the base film to be integrated.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: May 27, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Noriaki Sekine
  • Patent number: 8727792
    Abstract: In a contact block comprising a contact holder having multiple through-holes arranged in a position adjustment direction, two positioning pins are inserted via the through-holes to two through-holes selected from multiple through-holes formed in a contact block accommodation portion in the position adjustment direction, and thereby the relative positions of contact portions of contact terminals held by the contact holder can be adjusted with respect to terminals of a semiconductor device.
    Type: Grant
    Filed: October 8, 2010
    Date of Patent: May 20, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Takahiro Ishibashi, Katunori Takahashi, Noriyuki Matsuoka
  • Publication number: 20140127946
    Abstract: A receptacle connector includes: a housing which is made of a insulative resin, and which defines a housing space having an opening portion through which a connection target object is to be inserted; plural contacts which are made of a metal, and which include plural signal line contacts and plural ground contacts housed in the housing space so as to be arranged adjacent to each other; and plural conductive members which are made of a conductive resin, and which are disposed correspondingly with the plural ground contacts so that each of the plural conductive members is electrically connected to a corresponding one of the plural ground contacts.
    Type: Application
    Filed: November 8, 2012
    Publication date: May 8, 2014
    Applicants: YAMAICHI ELECTRONICS USA, INC., YAMAICHI ELECTRONICS CO., LTD.
    Inventors: Toshiyasu ITO, Takeshi NISHIMURA, Osamu SHIMIZU
  • Patent number: 8714839
    Abstract: In a receptacle cage, a front EMI fingers in a tubular shape serving as a first shield member is provided on the entire periphery of a substantially rectangular module slot. In addition, a gap between outer peripheral surfaces of an upper case as well as a lower plate of an optical module connected to a receptacle connector in a receptacle connector accommodating portion and an inner surface of the cage is shielded by a top EMI fingers serving as a second shield member and side EMI fingers serving as third shield members. Moreover, the lower plate comes into contact with a bottom wall portion which is grounded.
    Type: Grant
    Filed: August 27, 2012
    Date of Patent: May 6, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Toshiyasu Ito
  • Patent number: 8669774
    Abstract: The probe pin includes a plunger formed of a sheet metal, and a coil spring unit formed of a metal wire and configured to hold the plunger thereon. In a developed state, the plunger includes first and second portions each of which has an upper contact strip, a wide portion, and a lower contact strip, and which are connected to each other via the wide portions formed in the first and second portions. The plunger is formed in a united manner by folding together the first and second portions along a boundary of the wide portions formed therein to thereby bring at least the wide portions into tight contact with each other.
    Type: Grant
    Filed: March 8, 2011
    Date of Patent: March 11, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Yuji Kato, Takeyuki Suzuki
  • Patent number: 8647151
    Abstract: A ground contact plate in a contact unit includes fixing pieces provided at predetermined equal intervals in a longitudinal direction. The fixing pieces are respectively fitted in opposed slits in ground contact terminals via a transmission blade.
    Type: Grant
    Filed: June 6, 2012
    Date of Patent: February 11, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Fumihito Ikegami, Hiroaki Kukita
  • Patent number: 8591267
    Abstract: The contact head includes a head base, and at least two elastic contact pieces located on an upper end portion of the head base and configured to electrically contact a contact target object. A dent having a circular horizontal cross-sectional shape is formed at a central portion surrounded by the at least two elastic contact pieces. Additionally, each of the elastic contact pieces is formed with a tip end serving as a free end of the elastic contact piece located on a circumference of at least one virtual circle which is a circle concentric with an inscribed circle inscribed in a horizontal cross-sectional shape of the head base and which has a diameter being the same as or smaller than a diameter of the inscribed circle. Moreover, the contact piece is formed to be elastically deformable in a vertical direction by being formed to extend spirally.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: November 26, 2013
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Akihiko Hemmi
  • Patent number: 8562363
    Abstract: A card connector with an ejection mechanism is described. The card connector may include a base member, a cover member, a card accommodating space, and contact lines, which are electrically connected to a card placed into the card accommodating space. The card connector may also include an ejection lever, a spring, which pushes the ejection lever to the card accommodating space, and a pair of guide walls, which lead the ejection lever in a card insertion/withdrawal direction. The card connector may further include an ejection mechanism for pulling the IC card out of the card accommodating space. The ejection lever may include an arm portion, which comes in contact with a front end portion of the card, a spring mounting portion, a slide portion, which is led to a pair of the guide walls, and a pull portion, which extends outside the base member.
    Type: Grant
    Filed: May 31, 2011
    Date of Patent: October 22, 2013
    Assignee: Yamaichi Electronics Co. Ltd.
    Inventors: Kouji Kikuchi, Yoshiharu Ishii, Masaaki Ooya
  • Publication number: 20130251314
    Abstract: An optical module receptacle assembly includes a receptacle cage to detachably house an optical module, a receptacle connector housed in a receptacle connector accommodating portion of the receptacle cage, and a connector cover covering the receptacle connector. A given clearance CLE, which is greater than a clearance CLD being set smaller than a clearance CLA, is formed between an upper surface of a tip end portion of a plug connector of the optical module and an inner peripheral surface of a slot of the receptacle connector.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 26, 2013
    Applicant: YAMAICHI ELECTRONICS CO., LTD.
    Inventor: Toshiyasu ITO
  • Patent number: 8535101
    Abstract: A device, wherein, at cells 10ai of a metallic upper housing 10 corresponding to a signal line, between an end portion of an adapter 24 that has electrically insulating properties the inner surface of an upper housing 12 that has electrically insulating properties, an annular air layer Ai is formed at the peripheries of sleeves 20S of contact terminals 20ai that have the same structure as each other, and wherein, at the cells 10ai that correspond to ground lines, contact points 20CT2 of the contact terminals 20ai are inserted in through-holes 12ai of the lower housing 12, and their contact points 20CT1 are inserted into small diameter holes 22b of conductive collars 22 that touch the inner surfaces of the cells 10ai.
    Type: Grant
    Filed: September 7, 2011
    Date of Patent: September 17, 2013
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Katsumi Suzuki, Takeyuki Suzuki
  • Patent number: 8523583
    Abstract: A receptacle connector used as an electrical connector. The receptacle connector includes: a housing in which a receiving space is formed, a connection target being inserted in the receiving space; a plurality of contacts being arranged parallel to one another, having a plurality of signal line contacts and a plurality of ground contacts, and being placed with every two adjacent signal line contacts for transmitting signals interposed between two ground contacts; a supporting member made of an electrically-insulating synthetic resin material, and configured to integrally support and fix thereto the plurality of contacts; and a common contact made of a conductive resin material and configured to be provided with a certain gap from each of the plurality of ground contacts to electrically connect the plurality of ground contacts. The plurality of contacts integrated together by the supporting member are received in the receiving space.
    Type: Grant
    Filed: October 5, 2011
    Date of Patent: September 3, 2013
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Toshiyasu Ito
  • Patent number: 8500469
    Abstract: In a card accommodation portion, an upper section (14U) provided with contact terminals (16ai) electrically connected to an SD card (SDC) detachably attached and a lower section (14D) provided with contact terminals (18ai) electrically connected to an HG-Duo card (22) or a Duo card (23) detachably attached are formed in a stacked manner.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: August 6, 2013
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Yosuke Takai
  • Patent number: 8496490
    Abstract: A card connector for accommodating either of a first card and a second card with the different size from the first card, includes: contacts including first contacts for the first card and second contacts for the second card; a partition plate which partitions a card accommodation space up and down; and an eject mechanism including an eject member which slides in the card connector in a front-back direction, a card contacting member coupled to the ejected member and having a first card pressing surface that abuts on the first card, and a movable metal member attached to the card contacting member and having a second card pressing surface that abuts on the second card and that is moved between a first position and a second position.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: July 30, 2013
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Yosuke Takai
  • Patent number: 8460023
    Abstract: In the case where the cable CA is passed through the hole of the sealing tube and connected to the plug contact terminal and the socket contact terminal, when the female threaded portions and of the stepped pressure nut members and are respectively screwed onto the male threaded portions and of the plug housing and the socket housing, the outer periphery of the cable CA inside the plug housing and the socket housing is sealed by way of the pressing pieces and the sealing tube being pressed.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: June 11, 2013
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventor: Toshiyuki Someya
  • Patent number: D699607
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: February 18, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Yuji Nakamura, Katsumi Suzuki
  • Patent number: D706716
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: June 10, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Hiroshi Takahira, Takahiro Shimoyama
  • Patent number: D706717
    Type: Grant
    Filed: October 29, 2012
    Date of Patent: June 10, 2014
    Assignee: Yamaichi Electronics Co., Ltd.
    Inventors: Hiroshi Takahira, Takahiro Shimoyama