Abstract: There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (1A) includes: a first anode (12A) disposed in a first plating bathtub (11A); an insulating substrate (4) having a hole (5) and disposed in the first plating bathtub (11A); a pair of first cathodes (13AX, 13AY), each cathode being provided in the insulating substrate (4) at a bottom portion of the hole (5) and at a surface on an opening side of the hole (5); a first plating power source (14A) configured to supply an electric current between the first anode (12) and the pair of first cathodes (13AX, 13AY); and a first electric current measuring circuit (22A) configured to measure respective values of electric currents flowing through the pair of first cathodes (13AX, 13AY).

Abstract: There is provided a plating apparatus capable of suitably measuring a micro-throwing power. A first plating apparatus (1A) includes: a first anode (12A) disposed in a first plating bathtub (11A); an insulating substrate (4) having a hole (5) and disposed in the first plating bathtub (11A); a pair of first cathodes (13AX, 13AY), each cathode being provided in the insulating substrate (4) at a bottom portion of the hole (5) and at a surface on an opening side of the hole (5); a first plating power source (14A) configured to supply an electric current between the first anode (12) and the pair of first cathodes (13AX, 13AY); and a first electric current measuring circuit (22A) configured to measure respective values of electric currents flowing through the pair of first cathodes (13AX, 13AY).

Abstract: A plating apparatus capable of preventing difference in an electrode potential between the pair of cathodes and a disturbance in a current distribution in Haring cell test and so on is provided. A plating apparatus (1) has an anode (12) and a pair of cathodes (13X) (13Y) which are provided in a plating bathtub (11); a plating power source (14) to supply an electric current between the anode (12) and the pair of cathodes (13X) (13Y); and a feedback circuit (21) to have an electrode potential of a first cathode (13X) equal to an electrode potential of a second cathode (13Y) while a summation of electric currents flowing through the pair of cathodes (13X) (13Y) is kept constant.

Abstract: A plating device comprising: a water tank into which a plating solution is poured; a tubular nozzle being disposed in the water tank and serving as an anode; a to-be-plated object being disposed in the water tank so as to be opposed to the nozzle and serving as a cathode; a direct-current power source to apply a voltage between the nozzle and the to-be-plated object; and a pump to circulate the plating solution such that the plating solution poured into the water tank passes through the nozzle and is ejected onto the to-be-plated object. A perforated plate member, which includes a through-hole having a smaller diameter than the inside diameter of the nozzle, is arranged on the inflow side of the nozzle such that the through-hole is opposed to an open region of the nozzle.

Abstract: Provided are a plating apparatus and a container bath, which have a simpler structure than a conventional system and are capable of improving uniformity of a plating thickness. The plating apparatus includes a plating tank which stores a plating liquid, an anode member arranged inside the plating tank, a plating object arranged inside the plating tank to face the anode member, a cathode jig which contacts with the plating object, and a space formed between the anode member and the plating object to be a flow passage to which the plating liquid flows from the plating tank. The plating liquid flows into the space from above relative to the space, and is sucked by a pump from below relative to the space.

Abstract: Provided are a plating apparatus and a container bath, which have a simpler structure than a conventional system and are capable of improving uniformity of a plating thickness. The plating apparatus includes a plating tank which stores a plating liquid, a cathode member arranged inside the plating tank, a plating object arranged inside the plating tank to face the cathode member, an anode jig which contacts with the plating object, and a space formed between the cathode member and the plating object to be a flow passage to which the plating liquid flows from the plating tank. The plating liquid flows into the space from above relative to the space, and is sucked by a pump from below relative to the space.

Abstract: A plating apparatus (1) includes: a holding member (2) that holds a plated object (W); a spacer (4) that is stacked on the holding member (2) via a first seal member (3) in an annular shape surrounding the plated object (W), and has a through portion (45) from which the plated object (W) is exposed and which stores a plating solution; and an anode member (6) that is stacked on the spacer (4) via a second seal member (3) in an annular shape surrounding the through portion (45), and has an anode layer (62) arranged to face the plated object (W) which is exposed from the through portion (45).

Abstract: A plating jig can perform the processing of plating wherein a thickness of a plating film formed on each object to be plated becomes even when a plurality of objects to be plated are plated at a time. The plating jig is horizontally disposed, immersed in plating solution, and rotated about a rotational axis. The plating jig includes a plurality of supporting rods and a pair of end plates which support both ends of the supporting rods. The supporting rods are disposed on the circumference of the end plates. A plurality of notches are formed on the supporting rod at regular intervals along the rotational axis.

Abstract: The present invention can provide 1 which barrel plating apparatus where a plating barrel has permeable holes and slits in a size of order of micrometers on the wall thereof. The plating barrel is fabricated with porous plastic materials which have permeable holes and slits to the plating liquid and no piece materials to be plated are dropped thereof. Further advantage of the present invention is to provide a drain tool to drain the plating liquid L staying in the plating barrel.

Abstract: An electroplating jig which includes: a first insulator plate having an aperture; a second insulator plate sandwiching a body to be plated between the first insulator plate and the second insulator plate so that the body to be plated is faced outside from the aperture; and a conductive plate for conducting electric current supplied from outside to the body to be plated, the conductive plate being arranged between the first or second insulator plate and the body to be plated, wherein the conductive plate is formed using a conductive rubber contacting elastically with the body to be plated.

Abstract: The electrode cartridge for measuring an internal stress of a film of plating includes a cathode support, an anode support, a shield plate and an anode shell. The anode support supports an anode plate so that the anode plate is opposite to the cathode plate with a predetermined spacing. The shield plate is interposed between the cathode and anode plates. A through hole is made in the shield plate in such a manner that the through hole confronts a plating section and has a geometry which is reduced by a first predetermined scale factor relative to a geometry of the plating section. An opening is made in the anode shell in such a manner that the opening confronts the plating section and has a geometry which is magnified by a second predetermined scale factor relative to the geometry of the plating section.

Abstract: A plating jig can perform the processing of plating wherein a thickness of a plating film formed on each object to be plated becomes even when a plurality of objects to be plated are plated at a time. The plating jig is horizontally disposed, immersed in plating solution, and rotated about a rotational axis. The plating jig includes a plurality of supporting rods and a pair of end plates which support both ends of the supporting rods. The supporting rods are disposed on the circumference of the end plates. A plurality of notches are formed on the supporting rod at regular intervals along the rotational axis.

Abstract: The present invention provides a liquid tank which has a compact construction comprising a process bath, an agitation service bath, an agitation room, a liquid supply tunnel, and a liquid supply outlet.

Abstract: The present invention can provide 1 which barrel plating apparatus where a plating barrel has permeable holes and slits in a size of order of micrometers on the wall thereof. The plating barrel is fabricated with porous plastic materials which have permeable holes and slits to the plating liquid and no piece materials to be plated are dropped thereoff. Further advantage of the present invention is to provide a drain tool to drain the plating liquid L staying in the plating barrel.

Abstract: To provide a cathode cartridge, which comprises a tabular cathode conductor 5, which has an open hole having a same shape to that of plated pats 2a of a plated base 2 as a negative plate, which has a plurality of a protruding portion that presses contact to a peripheral part 2d around the plated parts 2a, a first elastic thin board 3, which covers a rear side of the plated base 2 and has a recess 3a, a tabular rear wall insulator 6, which covers both a back side of the cathode conductor 5 and a back side of the first elastic thin board 3, and has a recess 6b, a tabular front side insulator 7, which has an aperture having the same shape to that of the plated parts 2a, which covers a front side of the cathode conductor 5, and has a recess 7b, into which the cathode conductor 5 gets just, and a second elastic thin board 4, which has an aperture (open hole) having the same shape to that of the plated parts 2a, which is sandwiched between the cathode conductor 5 to provide a cathode cartridge of testing device for

Abstract: The present invention provides a liquid tank which has a compact construction comprising a process bath, an agitation service bath, an agitation room, a liquid supply tunnel, and a liquid supply outlet.

Abstract: There is provided an experimental management apparatus and experimental management program for electroplating that can carry out an electroplating experiment more efficiently and can manage experimental data more efficiently. The electroplating experimental management apparatus has a computer body 1a, which includes a central processing unit 101, a program memory 102, and a data memory 103. The program memory 102 stores a predicted value calculation program 102a for working out a predicted value of an experimental result based upon a physical property data file 103a and an arithmetic expression data file 103b read out of the data memory 103; an experimental data management program 102b for obtaining experimental data; and a data analysis program 102c for working out experimental data at each point of time during experiment based upon analysis of the experimental data obtained by the experimental data management program 102b.

Abstract: A cathode cartridge of a testing device for electroplating is provided, and includes a dummy plate 7 as a negative pole provided outside a tabular front insulator 6. The dummy plate includes an orifice a having the same shape as a plated part 2a of a plated base 2 as a negative plate. Protruding portions 4 press contact to a peripheral part of the plated base 2a. A tabular cathode conductor 4 connects with a direct voltage source not soaked in a plating solvent. A tabular rear insulator 5 covers rear sides of the plated base 2 and the cathode conductor 4, and has a recess, into which the plated base 2 and the cathode conductor 4 are retained. A tabular front insulator 6 having an orifice having the same shape as the plated base 2a covers a front side of the cathode conductor 4. An elastic thin board 9 is sandwiched between the plate base 2 and the tabular front insulator.

Abstract: A cathode cartridge (N) for an electroplating tester includes a cathode conductor (10) that conducts electricity to a surface (Wa) to be plated of a silicon wafer (W) as an object to be plated, a first insulator (20) that covers a front side of the silicon wafer (W) and holds the cathode conductor (10), and a second insulator (30) that covers a back side of the silicon wafer (W) and holds the silicon wafer (W). Negative portions other than the surface (Wa) to be plated of the silicon wafer (W) are insulated from plating solution with a first O-ring (22) fitted in the first insulator (20) and a second O-ring (32) fitted in the second insulator (30).

Abstract: A cathode cartridge N for an electroplating tester includes a cathode conductor 10 that conducts electricity to a surface Wa to be plated of a silicon wafer W as an object to be plated, a first insulator 20 that covers a front side (the surface Wa to be plated) of the silicon wafer W and holds the cathode conductor 10, and a second insulator 30 that covers a back side (reverse to the surface Wa to be plated) of the silicon wafer W and holds the silicon wafer W. Negative portions other than the surface Wa to be plated of the silicon wafer W are insulated from plating solution with a first O-ring 22 fitted in the first insulator 20 and a second O-ring 32 fitted in the second insulator 30.