Abstract: There is provided an experimental management apparatus and experimental management program for electroplating that can carry out an electroplating experiment more efficiently and can manage experimental data more efficiently. The electroplating experimental management apparatus has a computer body 1a, which includes a central processing unit 101, a program memory 102, and a data memory 103. The program memory 102 stores a predicted value calculation program 102a for working out a predicted value of an experimental result based upon a physical property data file 103a and an arithmetic expression data file 103b read out of the data memory 103; an experimental data management program 102b for obtaining experimental data; and a data analysis program 102c for working out experimental data at each point of time during experiment based upon analysis of the experimental data obtained by the experimental data management program 102b.

Abstract: An internal stress testing device for high speed electroplating is disclosed. The testing device comprises: a tank to be filled with a plating solution; a metal plate for anode disposed within the tank; a metal rod for cathode disposed within the tank and rotatably held by a motor at a position opposite to the metal plate for anode; a metal plate for cathode in the shape of a thin plate mounted on the metal rod; and a DC power supply connected to the metal plate for anode and the metal rod for cathode.

Abstract: An apparatus for testing high speed electroplating having a small size and a simple construction comprising a tank having an inclined portion formed on the bottom surface, a metal plate for the anode placed on said inclined portion, a metal rod for the cathode held by a motor which can rotate along the side of the tank opposite to said metal plate for the anode, a metal plate for the cathode wound around said metal rod for the cathode, and a DC power supply connected to said metal plate for the anode and to said metal rod for the cathode can simulate the state of the high speed electroplating.