Patents Assigned to Yamamoto-MS Co., Ltd.
  • Patent number: 6153065
    Abstract: An internal stress testing device for high speed electroplating is disclosed. The testing device comprises: a tank to be filled with a plating solution; a metal plate for anode disposed within the tank; a metal rod for cathode disposed within the tank and rotatably held by a motor at a position opposite to the metal plate for anode; a metal plate for cathode in the shape of a thin plate mounted on the metal rod; and a DC power supply connected to the metal plate for anode and the metal rod for cathode.
    Type: Grant
    Filed: June 15, 1999
    Date of Patent: November 28, 2000
    Assignee: Yamamoto-MS Co., Ltd.
    Inventor: Wataru Yamamoto
  • Patent number: 6017427
    Abstract: An apparatus for testing high speed electroplating having a small size and a simple construction comprising a tank having an inclined portion formed on the bottom surface, a metal plate for the anode placed on said inclined portion, a metal rod for the cathode held by a motor which can rotate along the side of the tank opposite to said metal plate for the anode, a metal plate for the cathode wound around said metal rod for the cathode, and a DC power supply connected to said metal plate for the anode and to said metal rod for the cathode can simulate the state of the high speed electroplating.
    Type: Grant
    Filed: April 22, 1998
    Date of Patent: January 25, 2000
    Assignee: Yamamoto-MS Co., Ltd.
    Inventor: Tatsuo Yamamoto