Abstract: A pressure control system for a liquid-cooled electronic component cooling device. A cooling device cools an electronic component through a refrigerant moving along a pipe. A radiator is mounted on one side of the cooling device to exchange heat with the refrigerant, and has a vent hole extending outwardly. A head has discharge holes communicating with a plurality of first hollows formed therein in an outer circumferential surface thereof with a driver hole provided in an upper surface thereof. A body is coupled to a bottom side of the head and has a second hollow communicating with the first hollows in a lengthwise direction. A pressure controller extends outward from a bottom of the body with an inner portion thereof communicating with the second hollow, and includes a coupler having threads on one side of an outer circumferential surface thereof to be screwed into the vent hole.
Abstract: A pushing action and a suction action are simultaneously performed on a working fluid passing through a heat transfer base, such that a heat exchange of cooling water can be efficiently performed, according to one embodiment of the present invention.
Abstract: A notebook computer cooler using a thermoelectric element includes a housing, a base plate, as an top surface of the housing, having a thermal pad made of a thermally conductive material and on which a notebook computer is seated; a thermoelectric pad disposed in the housing such that a cooling surface thereof is in contact with an inner surface of the thermal pad; a fan disposed on a side opposite the cooling surface of the thermoelectric pad; and a plurality of vent holes penetrated through the base plate and a lower surface of the housing. According to the notebook computer cooler using a thermoelectric element, it is possible to provide an excellent cooling function of the notebook computer by efficiently absorbing the heat of the notebook computer through the thermal pad of a conductive material by using the heat absorption function of the thermoelectric element.
Abstract: A method of fabricating an electronic component cooling apparatus. In the electronic component cooling apparatus, a cooling tower includes a plurality of heat dissipation plates stacked on each other, and heat pipes extend through portions of the heat dissipation plates in the top-bottom direction. A heat transfer block includes a base having grooves receiving the heat pipes and a cover covering the heat pipes is located on a top surface of an electronic component. The method includes locating the base above the heat pipes and pressing the base to the heat pipes using a press so that the grooves receive the heat pipes, dropping Cu dust produced from the pressing, realigning an assembly of the base and the heat pipes so that the base is located below, and a fourth step of locating the cover above the assembly and pressing the cover to the assembly using the press.
Abstract: A notebook computer cooler using a thermoelectric element includes a housing, a base plate, as an top surface of the housing, having a thermal pad made of a thermally conductive material and on which a notebook computer is seated; a thermoelectric pad disposed in the housing such that a cooling surface thereof is in contact with an inner surface of the thermal pad; a fan disposed on a side opposite the cooling surface of the thermoelectric pad; and a plurality of vent holes penetrated through the base plate and a lower surface of the housing. According to the notebook computer cooler using a thermoelectric element, it is possible to provide an excellent cooling function of the notebook computer by efficiently absorbing the heat of the notebook computer through the thermal pad of a conductive material by using the heat absorption function of the thermoelectric element.
Abstract: A pressure control system for a liquid-cooled electronic component cooling device. A cooling device cools an electronic component through a refrigerant moving along a pipe. A radiator is mounted on one side of the cooling device to exchange heat with the refrigerant, and has a vent hole extending outwardly. A head has discharge holes communicating with a plurality of first hollows formed therein in an outer circumferential surface thereof with a driver hole provided in an upper surface thereof. A body is coupled to a bottom side of the head and has a second hollow communicating with the first hollows in a lengthwise direction. A pressure controller extends outward from a bottom of the body with an inner portion thereof communicating with the second hollow, and includes a coupler having threads on one side of an outer circumferential surface thereof to be screwed into the vent hole.
Abstract: A pushing action and a suction action are simultaneously performed on a working fluid passing through a heat transfer base, such that a heat exchange of cooling water can be efficiently performed, according to one embodiment of the present invention.
Abstract: A pump for a water cooler is positioned inside or outside an electronic device having heating parts in order to cool heat generated by the heating parts via a circulating refrigerant.
Type:
Grant
Filed:
August 9, 2013
Date of Patent:
September 13, 2016
Assignee:
ZALMAN TECH CO., LTD.
Inventors:
Sang Woong Park, Hak Bong Lee, Hyun Woo Lee
Abstract: A portable accessory for preventing death grip of a hand-held apparatus and improving radio wave transmission and reception of the hand-held apparatus. The portable accessory includes an inductive signal amplifying circuit including: a radio transmission/radio unit that transmits or receives radio waves; a capacitive coupled unit that is capacitively coupled with an antenna mounted in the hand-held apparatus; and an impedance matching unit that connects the radio wave transmission/reception unit and the capacitive coupled unit and transmits radio waves.
Abstract: A pump for a water cooler is positioned inside or outside an electronic device having heating parts in order to cool heat generated by the heating parts via a circulating refrigerant.
Type:
Application
Filed:
August 9, 2013
Publication date:
November 13, 2014
Applicant:
ZALMAN TECH CO., LTD.
Inventors:
Sang Woong PARK, Hak Bong LEE, Hyun Woo LEE