Abstract: A water cooling apparatus is disposed outside an electronic apparatus equipped with a heat generating part to cool heat generated from the heat generating part by using a coolant. The water cooling apparatus includes a plurality of hollow tubes through which the coolant receiving the heat of the heat generating part flows to be cooled. Each hollow tube is formed in a shape of a quadratic curve. The water cooling apparatus further includes at least one radiator that includes a plurality of heat dissipation fins coupled to the plurality of hollow tubes and is arranged to be separated from each other along the plurality of hollow tubes.

Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including: a body comprising an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a metal powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a vaporization surface of the sintered wick where evaporation of the working fluid occurs, wherein a plurality of through holes are formed in the additional layer such that the working fluid changed into a vapor state passes through the additional layer after passing the sintered wick.

Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool a heat generating electronic component that generates heat during operation, the evaporator including: a body including an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a copper powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a surface of the sintered wick, wherein the additional layer is formed by sintering copper particles having a size smaller than that of the copper powder forming the sintered wick, and the working fluid moved from the sintered wick is changed in a vapor state to be discharged.

Abstract: A portable accessory for preventing death grip of a hand-held apparatus and improving radio wave transmission and reception of the hand-held apparatus. The portable accessory includes an inductive signal amplifying circuit including: a radio transmission/radio unit that transmits or receives radio waves; a capacitive coupled unit that is capacitively coupled with an antenna mounted in the hand-held apparatus; and an impedance matching unit that connects the radio wave transmission/reception unit and the capacitive coupled unit and transmits radio waves.

Abstract: A portable accessory for preventing death grip of a hand-held apparatus and improving radio wave transmission and reception of the hand-held apparatus. The portable accessory includes an inductive signal amplifying circuit including: a radio transmission/radio unit that transmits or receives radio waves; a capacitive coupled unit that is capacitively coupled with an antenna mounted in the hand-held apparatus; and an impedance matching unit that connects the radio wave transmission/reception unit and the capacitive coupled unit and transmits radio waves.

Abstract: An evaporator for a looped heat pipe (LHP) system, in which a working fluid circulates to cool heat generating electronic components that generate heat during operation, the evaporator including: a body comprising an inlet through which the working fluid enters and an outlet through which the working fluid is discharged; a sintered wick that is included in the body, wherein the sintered wick is formed by sintering a metal powder, and a plurality of pores are formed in the sintered wick; and an additional layer that is formed on a vaporization surface of the sintered wick where evaporation of the working fluid occurs, wherein a plurality of through holes are formed in the additional layer such that the working fluid changed into a vapor state passes through the additional layer after passing the sintered wick.

Abstract: Disclosed herein is a capacitor module including at least one capacitor, a cooling case accommodating the capacitor, and a cooling unit disposed in the cooling case and cooling a side surface of the capacitor. According to the present invention, cooling efficiency of the capacitor is maximized and fixing force of the capacitor in the cooling case is superior so that product reliability of the capacitor module can be improved.

Abstract: Provided is a method of manufacturing an evaporator for a loop heat pipe system including a condenser, a vapor transport line, and a liquid transport line, and more particularly, to a method of manufacturing an evaporator for a loop heat pipe system which provides a simple manufacturing process capable of improving a contact state between a sintered wick and a heating plate.

Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler. Accordingly, the air drawn by the cooling fans is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler, thereby cooling the notebook computer.

Abstract: Provided is a cooler for a notebook computer. The cooler includes: a body comprising an upper plate, a lower plate, and an air passage formed between the upper plate and the lower plate; one or more cooling fans mounted on the body and drawing air into the air passage; and one or more vent holes formed in portions of the upper plate other than portions of the upper plate over the cooling fans, wherein the air drawn by the cooling fan is flown through the air passage of the body and discharged through the vent holes to the notebook computer placed on the body of the cooler.

Abstract: Provided is an apparatus for cooling heat generating computer parts that installed in a computer. The apparatus includes a heat transferring block capable of being thermally coupled to the heat generating parts to conduct the heat generated by the heat dissipating parts; at least one heat pipe, each including a block coupling portion thermally coupled to the heat transferring block and a fin coupling portion formed of a generally curved shape composed essentially of one or more circular arc portions; and a plurality of heat dissipating fins, each having at least one perforation hole. The geometry of the curvature of the entirety of the fin coupling portion is shaped so that the geometry alone would not allow the heat pipe to be inserted through the perforation hole of the heat dissipating fins. The fin coupling portion of the heat pipe passes through each of the at least one perforation hole of the plurality of heat dissipating fins.