Abstract: A method for manufacturing a multilayer FPCB which includes providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit being created so as to align with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract: A method for screen printing a printed circuit board substrate comprises the following steps. A printed circuit board substrate including a copper foil layer is provided. Pluralities of marks are formed on the copper foil layer. A plurality of printing screens are provided, each includes an screen pattern and an opening corresponding to a respective mark. Printing material is applied on the ith screen Si to form an ith printing pattern and cover the ith mark at the ith opening, the ith printing pattern conforms to the ith screen pattern; checking whether the ith mark is covered by the printing material when i is less than N. Printing material is applied on the (i+1)th screen Si+1 so as to form an (i+1)th printing pattern on the copper foil layer and covers the (i+1)th Mark Mi+1 at the (i+1)th opening, if the ith mark is covered by the printing material.

Abstract: An exemplary wet processing apparatus includes a conveyor, a spraying system, and a suction system. The conveyor is configured for conveying a substrate. The spraying system includes an upper spraying conduit above the conveyor and an upper spraying nozzle mounted on the upper spraying conduit. The suction system includes a suction conduit and a suction nozzle connected to the suction conduit. The suction nozzle is adjacent to the conveyor and configured for suction the wet processing liquid sprayed on the substrate. The suction conduit is connected to the spraying conduit in such a manner that the flowing of the wet processing liquid in the upper spraying conduit can create a negative pressure in the suction conduit to enable the suction nozzle to suck the wet processing liquid on the substrate.

Abstract: The present invention relates to an apparatus for spraying an etchant and a method for manufacturing a printed circuit board. In one exemplary embodiment the apparatus includes a manifold, a plurality of feed pipes in fluid communication with the manifold, each of the feed pipes having a plurality of spray nozzles mounted thereon, the feed pipes cooperatively constitute a spray region, and a pressure-boosting device configured for increasing a spray pressure of the spray nozzles which are located at a central area of the spray region. The apparatus can overcome “the puddle effect” on an upper surface of the printed circuit board.

Abstract: A method for manufacturing printed circuit board includes steps below. A first electrically conductive layer including a first surface and a second surface at an opposite side thereof to the first surface is provided. A number of first traces directly formed on the second surface. A first insulating layer is formed on the second surface of the first electrically conductive layer and the surface of the first traces. The electrically conductive layer is etched to form a number of second traces, the second traces superpose the first traces, the first traces and the second traces constitute a circuit pattern.

Abstract: The present invention relates to a cleaning apparatus for printed circuit board. The cleaning apparatus includes a base, a clamping plate fixed to the base, at least one holding member, at least one cleaning roller, and a driving mechanism. The holding member is elastically supported on the base. The at least one cleaning roller is pivotably disposed on the at least one holding member respectively. The cleaning roller includes a cleaning layer attached to a surface of the cleaning roller. The clamping plate is opposite to and departs from the cleaning roller at a distance. The driving mechanism is coupled to the cleaning roller and configured for driving the cleaning roller to rotate. The cleaning apparatus can clean printed circuit board high efficiently.

Abstract: A coverlay processing system includes a processing device and a conveyance device. The conveyance device is configured for moving the coverlay to the process device. The conveyance device includes a pulling member, a first securing member, a detector and a controller. The pulling member is configured for driving the coverlay. The first securing member is configured for stopping moving the coverlay. The detector is configured for detecting a moving state of the coverlay and is connected to the controller. The controller is connected to the processing device for managing the operation of the processing device.

Abstract: A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance.

Abstract: A circuit substrate includes an electrically conductive layer having electrically conductive patterns formed therein, an insulating layer having a through hole, and a composite layer positioned between the electrically conductive layer and the insulating layer. The through hole is configured for having an electronic component mounted thereon. The composite layer includes a polymer matrix and at least one carbon nanotube bundle embedded in the polymer matrix. One end of the at least one carbon nanotube bundle contacts the electrically conductive patterns, and the other is exposed in the through hole of the insulation layer.

Abstract: A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB.

Abstract: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.

Abstract: An electroplating apparatus includes an electroplating tank, a first supporting bar, a first holding element, two second supporting bars, a number of spaced crossbars, a number of second holding elements, and a power supply. The first holding element is suspended in the tank from the first supporting bar, and the first holding element is configured for holding a plate-shaped workpiece in a manner that the workpiece is oriented along the first supporting bar. The second holding elements are suspended from the corresponding crossbars, each of the second holding elements arranged between the first and one of the second supporting bars and configured for holding a metal block. The power supply includes a cathode for electrical connection to the workpiece through the first supporting bar and the first holding element and an anode for electrically connection to the metal blocks through the second supporting bars and the second holding elements.

Abstract: A PCB module includes a first rigid PCB having a first edge connector, a second rigid PCB having a second edge connector, and a connecting mechanism. The connecting mechanism includes a flexible connecting board, an elastic member, and a fixing member. The flexible connecting has a number of connecting circuit traces isolated from each other. The flexible connecting board is bent in such a manner that a first end portion is in contact with the first edge connector, and a second end portion is in contact with the second edge connector. Thus, the first edge connector is electrically connected with the second edge connector by the traces. The elastic member is compressed between the end portions of the flexible connecting board. The fixing member is configured to fix the first rigid PCB to the second rigid PCB and compress the elastic member.

Abstract: A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, and N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.

Abstract: An exemplary simulation system for manufacturing a printed circuit board is provided. The simulation system includes at least one simulation sub-system. The simulation sub-system includes an input module, a storing module, a processing module, and an output module. The input module is configured for acquiring a number of processing parameters associated with steps of a process for manufacturing the printed circuit board. The storing module is configured for storing a number of simulation functions relating to the steps of the process for manufacturing the printed circuit board. The processing module is configured for selecting and performing the corresponding simulation function according to the acquired parameters, thereby obtaining a simulation result. The output module is configured for output the simulation result.

Abstract: A method for smoothing a printed circuit board (PCB), comprising: providing a PCB having a first smooth outer surface and an opposite second outer surface, the second outer surface including a smooth region and a plurality of dimples; applying a liquid photoresist layer onto the second outer surface of the PCB to fill the dimples; solidifying the liquid photoresist in the dimples to obtain a solidified photoresist layer; polishing the solidified photoresist layer until a surface thereof being coplanar with the smooth region; and polishing the entire second outer surface until the solidified photoresist layer is removed, thereby obtaining a plain outer surface parallel to the first smooth outer surface.

Abstract: A holder for holding a flexible printed circuit board includes a main body and at least one securing member. The main body includes a hook portion and a holding member, wherein one of the securing member and the holding member comprises at least one magnet, and the other comprises at least one magnetic portion, at least one magnet or combination thereof such that the securing member capable of being magnetically attached to the holding member.

Abstract: A plating apparatus for plating a FPCB base board having a first conveyance region and a second conveyance region includes a shielding apparatus. The shielding apparatus includes a first shielding plate and a second shielding plate. The first shielding plate corresponds to the first conveyance region. A distance between the first shielding plate and the first conveyance region is from 5 millimeters to 20 millimeters. A width of the first shielding is equal to or larger than a width of the first conveyance region. The second shielding plate corresponds to the second conveyance region. A distance between the second shielding plate and the second conveyance region is from 5 millimeters to 20 millimeters. A width of the second shielding is equal to or larger than a width of the second conveyance region. The first and second shielding plates are made of an insulation material.

Abstract: A method for manufacturing a multilayer PCB comprises the following steps. First, a PCB substrate includes a first circuit layer is provided. The first circuit layer includes a mounting portion. A first solder-resistant layer is formed on the mounting portion and a protective adhesive film is attached on the first solder-resistant layer. Next, a first copper foil, a first adhesive layer, a second copper foil, and a second adhesive layer are laminated on the PCB substrate, and the first and second copper foils are etched to form circuit layers. Then a cavity is defined and the protective adhesive film is exposed in it. After removing the protective adhesive film, an electronic component is mounted in the cavity. As such, a multilayer PCB with the electronic component embedded in is obtained.

Abstract: An exemplary multilayer printed circuit board includes a first circuit substrate, a third circuit substrate, a second circuit substrate between the first and third circuit substrates, a first anisotropically conductive adhesive layer between the first and second circuit substrates, and a second anisotropically conductive adhesive layer between the second and third circuit substrates. The first circuit substrate includes a first conductive terminal and a first through hole. The second circuit substrate includes a second conductive terminal and two through holes (i.e. second and third through holes). The third circuit substrate includes a third conductive terminal and a fourth through hole. The first anisotropically conductive adhesive layer fills the first and third through holes to electrically connect the first and second conductive terminals. The second anisotropically conductive adhesive layer fills the second and fourth through holes to electrically connect the second and third conductive terminals.