Intel Patents Granted

Patents granted to Intel by the U.S. Patent and Trademark Office (USPTO).

  • Patent number: 11223879
    Abstract: Providing adaptive visual browsing of digital content may be accomplished by presenting a scrolling ticker on a display for browsing of digital content available for viewing by a user of a processing system, the ticker having a plurality of items, each item including an image representing at least one of a content title and a content service provider; receiving a user input selection from a remote control device operated by the user, the user input selection selecting one of the ticker items to indicate the user's interest in the selected item; and changing at least one of the items in the ticker to another item in response to the user input selection, wherein the other item has metatags similar to or related to metatags of the selected item.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Sean Dunnahoo, Christie Flynn
  • Patent number: 11223524
    Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Georgios C. Dogiamis, Thomas L. Sounart, Johanna M. Swan
  • Patent number: 11222977
    Abstract: Integrated circuit transistor structures are disclosed that reduce n-type dopant diffusion, such as phosphorous or arsenic, from the source region and the drain region of a germanium n-MOS device into adjacent shallow trench isolation (STI) regions during fabrication. The n-MOS transistor device may include at least 75% germanium by atomic percentage. In an example embodiment, the structure includes an intervening diffusion barrier deposited between the n-MOS transistor and the STI region to provide dopant diffusion reduction. In some embodiments, the diffusion barrier may include silicon dioxide with carbon concentrations between 5 and 50% by atomic percentage. In some embodiments, the diffusion barrier may be deposited using chemical vapor deposition (CVD), atomic layer deposition (ALD), or physical vapor deposition (PVD) techniques to achieve a diffusion barrier thickness in the range of 1 to 5 nanometers.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Glenn A. Glass, Anand S. Murthy, Karthik Jambunathan, Cory C. Bomberger, Tahir Ghani, Jack T. Kavalieros, Benjamin Chu-Kung, Seung Hoon Sung, Siddharth Chouksey
  • Patent number: 11222462
    Abstract: A method for improving performance of generation of digitally represented graphics. The method comprises: receiving a first representation of a base primitive; providing a set of instructions associated with vertex position determination; executing said retrieved set of instructions on said first representation of said base primitive using bounded arithmetic for providing a second representation of said base primitive, and subjecting said second representation of said base primitive to a culling process. A corresponding apparatus and computer program product are also presented.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Jon N. Hasselgren, Jacob J. Munkberg, Franz Petrik Clarberg, Tomas G. Akenine-Moller
  • Patent number: 11222545
    Abstract: Technologies for providing signal quality based route management for unmanned aerial vehicles include a device that includes circuitry to produce a data set indicative of a wireless communication signal quality at each of multiple locations in a geographic area. The circuitry is also to produce, as a function of the data set and a target wireless communication signal quality, a planned route for a vehicle through the geographic area.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Shu-Ping Yeh, Jingwen Bai, Feng Xue, Mark Davis, Shilpa Talwar
  • Patent number: 11222082
    Abstract: Particular embodiments described herein provide for a system that can be configured to determine an identification (ID) of a computer processing unit (CPU) using one or more tests and/or measurements, intercept the result of a query from a process to determine the ID of the CPU, replace the result of the query if the result of the query does not match the determined ID of the CPU, and communicate the result of the query that includes the determined ID of the CPU to the process. In an example, the query is a CPUID opcode and the results of the query are intercepted after passing through a hypervisor.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventor: Alexander Komarov
  • Patent number: 11222836
    Abstract: Device package and a method of forming a device package are described. The device package includes an interposer with interconnects on an interconnect package layer and a conductive layer on the interposer. The device package has dies on the conductive layer, where the package layer includes a zero-misalignment two-via stack (ZM2VS) and a dielectric. The ZM2VS directly coupled to the interconnect. The ZM2VS further includes the dielectric on a conductive pad, a first via on a first seed, and first seed on a top surface of the conductive pad, where the first via extends through dielectric. The ZM2VS also has a conductive trace on dielectric, and a second via on a second seed, the second seed is on the dielectric, where the conductive trace connects to first and second vias, where second via connects to an edge of conductive trace opposite from first via.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Veronica Strong, Aleksandar Aleksov, Brandon Rawlings, Johanna Swan
  • Patent number: 11221687
    Abstract: One embodiment provides a method. The method includes receiving, with a computing system, stylus orientation data representing an orientation of a stylus. The method includes receiving, with a computing system, grip characteristics data representing a grip on the stylus by a user. The method includes identifying, with the computing system, a stylus mode for use by the computing system, at least partially based on the stylus orientation data and the grip characteristics data. The method includes applying the stylus mode to the computing system to interpret interaction data representing interactions of the stylus with the computing system.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Arvind Kumar, Amy Wiles
  • Patent number: 11221849
    Abstract: Disclosed embodiments relate to executing a vector multiplication instruction. In one example, a processor includes fetch circuitry to fetch the vector multiplication instruction having fields for an opcode, first and second source identifiers, and a destination identifier, decode circuitry to decode the fetched instruction, execution circuitry to, on each of a plurality of corresponding pairs of fixed-sized elements of the identified first and second sources, execute the decoded instruction to generate a double-sized product of each pair of fixed-sized elements, the double-sized product being represented by at least twice a number of bits of the fixed size, and generate an unsigned fixed-sized result by rounding the most significant fixed-sized portion of the double-sized product to fit into the identified destination.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Venkateswara R. Madduri, Carl Murray, Elmoustapha Ould-Ahmed-Vall, Mark J. Charney, Robert Valentine, Jesus Corbal
  • Patent number: 11222877
    Abstract: The present disclosure is directed to systems and methods for improving heat distribution and heat removal efficiency in PoP semiconductor packages. A PoP semiconductor package includes a first semiconductor package that is physically, communicably, and conductively coupled to a stacked second semiconductor package. A thermally conductive member that includes at least one thermally conductive member may be disposed between the first semiconductor package and the second semiconductor package. The thermally conductive member may include: a single thermally conductive element; multiple thermally conductive elements; or a core that includes at least one thermally conductive element. The thermally conductive elements are thermally conductively coupled to an upper surface of the first semiconductor package and to the lower surface of the second semiconductor package to facilitate the transfer of heat from the first semiconductor package to the second semiconductor package.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Omkar Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson, Zhimin Wan, Haifa Hariri, Sri Chaitra J. Chavali, Nazmiye Acikgoz Akbay, Fadi Y. Hafez, Christopher L. Rumer
  • Patent number: 11223882
    Abstract: Techniques for acoustic management of entertainment devices and systems are described. Various embodiments may include techniques for acoustically determining a location of a remote control or other entertainment device. Some embodiments may include techniques for controlling one or more entertainment components using voice commands or other acoustic information. Other embodiments may include techniques for establishing a voice connection using a remote control device. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: January 11, 2022
    Assignee: INTEL CORPORATION
    Inventors: Bran Ferren, Cory J. Booth, David B. Andersen
  • Patent number: 11222947
    Abstract: Methods and structures formed thereby are described relating to the doping non-planar fin structures. An embodiment of a structure includes a substrate, wherein the substrate comprises silicon, a fin on the substrate comprising a first portion and a second portion; and a dopant species, wherein the first portion comprises a first dopant species concentration, and the second portion comprises a second dopant species concentration, wherein the first dopant species concentration is substantially less than the second dopant species concentration.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Cory E. Weber, Aaron D. Lilak, Szuya S. Liao, Aaron A. Budrevich
  • Patent number: 11222848
    Abstract: Methods/structures of joining package structures are described. Those methods/structures may include a die disposed on a surface of a substrate, an interconnect bridge embedded in the substrate, and at least one vertical interconnect structure disposed through a portion of the interconnect bridge, wherein the at least one vertical interconnect structure is electrically and physically coupled to the die.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Kemal Aygun, Zhiguo Qian, Jianyong Xie
  • Patent number: 11223970
    Abstract: For example, a wireless communication device may be configured to determine a Concurrent Multiple Band (CMB) routing scheme based on Quality of Service (QoS) requirement information and network condition information, the CMB routing scheme to route a plurality of application streams to a plurality of radios of the wireless communication device for wireless communication over a plurality of wireless communication bands, the plurality of application streams corresponding to one or more applications to be executed by the wireless communication device; and to route the plurality of application streams to the plurality of radios by determining, based on the CMB routing scheme, to which radio of the plurality of radios to route the application stream of the plurality of application streams.
    Type: Grant
    Filed: December 25, 2019
    Date of Patent: January 11, 2022
    Assignee: INTEL CORPORATION
    Inventors: Daniel Cohn, David Birnbaum, Ehud Reshef, Ofer Hareuveni, Dor Chay
  • Patent number: 11222847
    Abstract: A device and method of utilizing a repeater circuit to extend the viable length of an interconnect bridge. Integrated circuit packages using a repeater circuit in a repeater die, embedded in a substrate, and included in an interconnect bridge are show. Methods of connecting semiconductor dies using interconnect bridges coupled with repeater circuits are shown.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Ravindranath V. Mahajan, Zhiguo Qian, Henning Braunisch, Kemal Aygun, Sujit Sharan
  • Patent number: 11222127
    Abstract: A microcoded processor instruction may invoke a number of microinstructions to perform a round of a SHA3 operation using a circuit that includes a first stage circuit to perform a set of first bitwise XOR operations on a set of five input blocks to yield first intermediate output blocks; perform a set of second bitwise XOR operations on a first intermediate block and a rotation of another first intermediate block to yield second intermediate blocks; and perform a set of third bitwise XOR operations on a second intermediate block and an input block to yield third intermediate blocks. The circuit further includes a second stage circuit to rotate bits within each of the third intermediate blocks to yield a set of fourth intermediate blocks, and a third stage circuit to perform an affine mapping on bits within each of the fourth intermediate blocks to yield a set of output blocks.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Santosh Ghosh, Michael LeMay, Manoj R. Sastry, David M. Durham
  • Patent number: 11222863
    Abstract: Embodiments of the present disclosure describe techniques for fabricating a stacked integrated circuit (IC) device. A first wafer that includes a plurality of first IC dies may be sorted to identify first known good dies of the plurality of first IC dies. The first wafer may be diced to singulate the first IC dies. A second wafer that includes a plurality of second IC dies may be sorted to identify second know good dies of the plurality of second IC dies. The first known good dies may be bonded to respective second known good dies of the second wafer. In some embodiments, the first known good dies may be thinned after bonding the first know good dies to the second wafer. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Fay Hua, Christopher M. Pelto, Valluri R. Rao, Mark T. Bohr, Johanna M. Swan
  • Patent number: 11222895
    Abstract: Memory devices in which a memory cell includes a thin film select transistor and a capacitor (1TFT-1C). A 2D array of metal-insulator-metal capacitors may be fabricated over an array of the TFTs. Adjacent memory cells coupled to a same bitline may employ a continuous stripe of thin film semiconductor material. An isolation transistor that is biased to remain off may provide electrical isolation between adjacent storage nodes of a bitline. Wordline resistance may be reduced with a wordline shunt fabricated in a metallization level and strapped to gate terminal traces of the TFTs at multiple points over a wordline length. The capacitor array may occupy a footprint over a substrate. The TFTs providing wordline and bitline access to the capacitors may reside substantially within the capacitor array footprint. Peripheral column and row circuitry may employ FETs fabricated over a substrate substantially within the capacitor array footprint.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Yih Wang, Abhishek Sharma, Van Le
  • Patent number: 11223361
    Abstract: An integrated circuit device may include programmable logic fabric disposed on a first integrated circuit die and having configuration memory. The integrated circuit device may also include a base die that may provide memory and/or operating supporting circuitry. The first die and the second die may be coupled using a high-speed parallel interface. The interface may employ microbumps. The first die and the second die may also include controllers for the interface.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: January 11, 2022
    Assignee: INTEL CORPORATION
    Inventors: Kevin Clark, Scott J. Weber, James Ball, Simon Chong, Ravi Prakash Gutala, Aravind Raghavendra Dasu, Jun Pin Tan
  • Patent number: 11222982
    Abstract: Methods and apparatus to form silicon-based transistors on group III-nitride materials using aspect ratio trapping are disclosed. An example integrated circuit includes a group III-nitride substrate and a fin of silicon formed on the group III-nitride substrate. The integrated circuit further includes a first transistor formed on the fin of silicon and a second transistor formed on the group III-nitride substrate.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Marko Radosavljevic, Sansaptak Dasgupta, Han Wui Then
  • Patent number: 11223606
    Abstract: Technologies for attesting a deployment of a workload using a blockchain includes a compute engine that receives a request from a remote device to validate one or more parameters of a managed node composed of one or more sleds. The compute engine retrieves a blockchain associated with the managed node. The blockchain includes one or more blocks, each block including information about the parameters of the managed node. The compute engine validates the blockchain and sends an indication that the blockchain is valid to the requesting device.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Johan Van de Groenendaal, Alberto J. Munoz
  • Patent number: 11223520
    Abstract: Some embodiments of the invention provide a forwarding element that can be configured through in-band data-plane messages from a remote controller that is a physically separate machine from the forwarding element. The forwarding element of some embodiments has data plane circuits that include several configurable message-processing stages, several storage queues, and a data-plane configurator. A set of one or more message-processing stages of the data plane are configured (1) to process configuration messages received by the data plane from the remote controller and (2) to store the configuration messages in a set of one or more storage queues. The data-plane configurator receives the configuration messages stored in the set of storage queues and configures one or more of the configurable message-processing stages based on configuration data in the configuration messages.
    Type: Grant
    Filed: October 16, 2017
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Changhoon Kim, Xiaozhou Li, Anurag Agrawal, Julianne Zhu
  • Patent number: 11221762
    Abstract: A processor includes a first memory interface to be coupled to a plurality of memory module sockets located off-package, a second memory interface to be coupled to a non-volatile memory (NVM) socket located off-package, and a multi-level memory controller (MLMC). The MLMC is to: control the memory modules disposed in the plurality of memory module sockets as main memory in a one-level memory (1LM) configuration; detect a switch from a 1LM mode of operation to a two-level memory (2LM) mode of operation in response to a basic input/output system (BIOS) detection of a low-power memory module disposed in one of the memory module sockets and a NVM device disposed in the NVM socket in a 2LM configuration; and control the low-power memory module as cache in the 2LM configuration in response to detection of the switch from the 1LM mode of operation to the 2LM mode of operation.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Joydeep Ray, Varghese George, Inder M. Sodhi, Jeffrey R. Wilcox
  • Patent number: 11221354
    Abstract: Embodiments of the invention include a resonant sensing system comprising driving circuitry to generate a drive signal during excitation time periods, a first switch coupled to the driving circuitry, and a sensing device coupled to the driving circuitry via the first switch during the excitation time periods. The sensing device includes beams to receive the drive signal during a first excitation time period that causes the beams to mechanically oscillate and generate a first induced electromotive force (emf) in response to the drive signal. The first switch decouples the sensing device and the driving circuitry during measurement time periods for measurement of the induced emf.
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Georgios C. Dogiamis, Sasha N. Oster, Feras Eid, Ian A. Young
  • Patent number: 11221875
    Abstract: A method and apparatus for cooperative scheduling of virtual machines. An exemplary method includes maintaining a CPU mask by a virtual machine manager, wherein the CPU mask comprises a real-time availability of each of a plurality of physical CPUs (PCPUs). A virtual machine (VM) is allowed to read the CPU mask.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 11, 2022
    Assignee: INTEL CORPORATION
    Inventors: Yuyang Du, Mingqiu Sun, Jian Sun, Yong Tong Chua
  • Patent number: 11221604
    Abstract: A split structure design for an internet of things (IoT) device including a control IoT device (CID) and a sensor IoT device (SID). An example of an apparatus provides a CID including a power transmitter to power a SID through a barrier and a control data transceiver to communicate with the SID through the barrier. The CID includes a power adjustor to increase a power transmission to the SID in steps, and an intermodule communicator to determine if communications have been established with the sensor IoT, and, if not, instruct the power adjustor to increase the power transmission to the SID by a step.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: January 11, 2022
    Assignee: Intel Corporaion
    Inventors: Jakub Wenus, Cliodhna Ni Scanaill, Keith Nolan, Niall Cahill, Wael Guibene, Mark Kelly
  • Patent number: 11222837
    Abstract: A micro-trace containing package substrate provides a low-inductance alternating-current decoupling path between a semiconductive device and a die-side capacitor.
    Type: Grant
    Filed: April 2, 2020
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Andrew Collins, Jianyong Xie, Sujit Sharan
  • Patent number: 11223446
    Abstract: Systems and devices can include a first port of a first device coupled to a second port of a second device across a multi-lane link. The first port can augment a data block with error correcting code by distributing error correcting code evenly across each lane of the data block, wherein each lane of the data block includes a same number of error correcting code. The first port can transmit the data block with the per-lane error correcting code to the second port across the multi-lane link. The second port can determine error correcting code based on the error correcting code bits received in the data block, and perform error correction on the symbols of the data block based on the error correcting code received.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventor: Debendra Das Sharma
  • Patent number: 11222392
    Abstract: An apparatus to facilitate compute optimization is disclosed. The apparatus includes a memory device including a first integrated circuit (IC) including a plurality of memory channels and a second IC including a plurality of processing units, each coupled to a memory channel in the plurality of memory channels.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Prasoonkumar Surti, Narayan Srinivasa, Feng Chen, Joydeep Ray, Ben J. Ashbaugh, Nicolas C. Galoppo Von Borries, Eriko Nurvitadhi, Balaji Vembu, Tsung-Han Lin, Kamal Sinha, Rajkishore Barik, Sara S. Baghsorkhi, Justin E. Gottschlich, Altug Koker, Nadathur Rajagopalan Satish, Farshad Akhbari, Dukhwan Kim, Wenyin Fu, Travis T. Schluessler, Josh B. Mastronarde, Linda L. Hurd, John H. Feit, Jeffery S. Boles, Adam T. Lake, Karthik Vaidyanathan, Devan Burke, Subramaniam Maiyuran, Abhishek R. Appu
  • Patent number: 11222119
    Abstract: Technologies for secure native code invocation include a computing device having an operating system and a firmware environment. The operating system executes a firmware method in an operating system context using a virtual machine. In response to invoking the firmware method, the operating system invokes a callback to a bridge driver in the operating system context. In response to the callback, the bridge driver invokes a firmware runtime service in the operating system context. The firmware environment executes a native code handler in the operating system context in response to invoking the firmware runtime service. The native code handler may be executed in a de-privileged container. The firmware method may process results data stored in a firmware mailbox by the native code handler, which may include accessing a hardware resource using a firmware operation region.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Sarathy Jayakumar, Mohan J. Kumar, Ron Story, Mahesh Natu
  • Patent number: 11222885
    Abstract: A backend electrostatic discharge (ESD) diode device structure is presented comprising: a first structure comprising a first material, wherein the first material includes metal; a second structure adjacent to the first structure, wherein the second structure comprises a second material, wherein the second material includes a semiconductor or an oxide; and a third structure adjacent to the second structure, wherein the third structure comprises of the first material, wherein the second structure is between the first and third structures. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: January 11, 2022
    Assignee: Intel Corporation
    Inventors: Prashant Majhi, Ilya Karpov, Brian Doyle, Ravi Pillarisetty, Abhishek Sharma
  • Patent number: 11218320
    Abstract: In one example an apparatus comprises a computer readable memory, hash logic to generate a message hash value based on an input message, signature logic to generate a signature to be transmitted in association with the message, the signature logic to apply a hash-based signature scheme to a private key to generate the signature comprising a public key, and accelerator logic to pre-compute at least one set of inputs to the signature logic. Other examples may be described.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 4, 2022
    Assignee: INTEL CORPORATION
    Inventors: Vikram Suresh, Sanu Mathew, Manoj Sastry, Santosh Ghosh, Raghavan Kumar, Rafael Misoczki
  • Patent number: 11218322
    Abstract: Techniques and apparatuses for issuance of license upgrades for hardware components in the field, as well as the hardware components, are described. In one embodiment, for example an apparatus may include processor circuitry and memory in communication with the processor circuitry, wherein the memory contains a configuration data block and license data block, the configuration data block being read from the memory via a licensing apparatus and the licensing data block being written to the memory by the licensing apparatus. The processor may include executable code to process the licensing data block to facilitate an upgrade of the capabilities of the processor circuitry.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: January 4, 2022
    Assignee: INTEL CORPORATION
    Inventors: Sergiu D. Ghetie, Neeraj S. Upasani, Chukwunenye S. Nnebe, Won Lee, Shaila R. Murty, Arkadiusz Berent, Vasuki Chilukuri, David T. Mayo, Scott P. Bobholz, Vinila Rose, Wojciech S. Powiertowski
  • Patent number: 11218553
    Abstract: Methods, apparatus, systems and machine-readable storage media of a multi-access edge computing (MEC) component, of a first MEC system, for discovering platforms in MEC systems, are described. In an example, a list of MEC system identifiers is received from a dedicated reference point. The MEC system identifiers includes a system identifier of a second, different MEC system. A list of available MEC hosts in the second MEC system that fulfill a predefined requirement is received. A list of shareable services on the first MEC system is determined. Information is provided to the second MEC system regarding the list of shareable services on the first MEC system.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Miltiadis Filippou, Dario Sabella, Markus Dominik Mueck, Honglei Miao
  • Patent number: 11217126
    Abstract: The disclosed embodiments generally relate to methods, systems and apparatuses to provide ad hoc digital signage for public or private display. In certain embodiments, the disclosure provides dynamically formed digital signage. In one application, one or more drones are used to project the desired signage. In another application one or more drones are used to form a background to receive the projected image. In still another application, sensors are used to detect audience movement, line of sight or engagement level. The sensor information is then used to arrange the projecting drones or the surface-image drones to further signage presentation.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: January 4, 2022
    Assignee: INTEL CORPORATION
    Inventors: Carl S. Marshall, John Sherry, Giuseppe Raffa, Glen J. Anderson, Selvakumar Panneer, Daniel Pohl
  • Patent number: 11217964
    Abstract: There is disclosed in one example a fiberoptic communication device, including: a modulator to modulate data onto a laser pulse; and a semiconductor laser source including an active optical waveguide to provide optical gain and support an optical mode, the laser source further including a V-shaped current channel superimposed on the optical waveguide, and disposed to feed the active optical waveguide with electrical current along its length, the current channel having a proximate end to the optical mode, the proximate end having a width substantially matching a diameter of the optical mode, and a removed end from the optical mode, wherein the removed end is substantially wider than the proximate end.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Pierre Doussiere, George A. Ghiurcan, Jonathan K. Doylend, Harel Frish
  • Patent number: 11216182
    Abstract: A system includes an electronic display to display a virtual keyboard and a processor communicatively coupled to the electronic display. In some embodiments, the virtual keyboard includes a plurality of keys. In certain embodiments, the electronic display receives a first string of erased characters and a second string of replacement characters. In certain embodiments, the processor compares the first string and the second string to determine a difference at corresponding character locations of the first string and the second string. In some embodiments, the processor increments a counter based on the comparison, the counter corresponding to a first character of the first string and a second character of the second string. In certain embodiments, the processor adjusts at least one of the plurality of keys of the virtual keyboard in response to the counter meeting a threshold.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Roland P. Wooster, Alexander Conrad Erdman
  • Patent number: 11216594
    Abstract: Embodiments are directed to countermeasures against hardware side-channel attacks on cryptographic operations. An embodiment of an apparatus includes multiple crypto cores; and a current source including multiple current source blocks, the current source blocks including a respective current source block associated with each of the crypto cores, and wherein the current sources blocks are switchable to switch on a current source block associated with each active core of the multiple crypto cores and to switch off a current source associated with each inactive core of the multiple cryptographic cores.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: January 4, 2022
    Assignee: INTEL CORPORATION
    Inventors: Santosh Ghosh, Debayan Das, Carlos Tokunaga, Avinash L. Varna, Joseph Friel
  • Patent number: 11217534
    Abstract: Techniques of protecting cored or coreless semiconductor packages having materials formed from dissimilar metals from galvanic corrosion are described. An exemplary semiconductor package comprises one or more build-up layers; first and second semiconductor components (e.g., die, EMIB, etc.) on or embedded in the one or more build-up layers. The first semiconductor component may be electrically coupled to the second semiconductor component via a contact pad and an interconnect structure that are formed in the one or more build-up layers. The contact pad can comprise a contact region, a non-contact region, and a gap region that separates the contact region from the non-contact region. Coupling of the contact pad and an interconnect structure is performed by coupling only the contact region with the interconnect structure. Also, a surface area of the contact region can be designed to substantially equal to a surface area of the interconnect structure.
    Type: Grant
    Filed: December 30, 2017
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Junnan Zhao, Ji Yong Park, Kyu Oh Lee
  • Patent number: 11217582
    Abstract: Unidirectional self-aligned gate endcap (SAGE) architectures with gate-orthogonal walls, and methods of fabricating unidirectional self-aligned gate endcap (SAGE) architectures with gate-orthogonal walls, are described. In an example, integrated circuit structure includes a first semiconductor fin having a cut along a length of the first semiconductor fin. A second semiconductor fin has a cut along a length of the second semiconductor fin. A gate endcap isolation structure is between the first semiconductor fin and the second semiconductor fin. The gate endcap isolation structure has a substantially uniform width along the lengths of the first and second semiconductor fins.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Walid M. Hafez, Sridhar Govindaraju, Mark Liu, Szuya S. Liao, Chia-Hong Jan, Nick Lindert, Christopher Kenyon, Sairam Subramanian
  • Patent number: 11218546
    Abstract: A non-transitory computer-readable storage medium, an apparatus, and a computer-implemented method to select respective physical infrastructure devices of an edge computing system to implement services requested by respective service-requesting clients. The computer-readable storage medium includes computer-readable instructions that, when executed, cause at least one processor to perform operations comprising, for each candidate physical infrastructure device, calculating a utility score corresponding to each of the services requested, wherein: the utility score corresponds to one of each of the respective service-requesting clients or each subgroup of a plurality of subgroups of the respective service-requesting clients.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Marcin Spoczynski, Michael Nolan, Keith A. Ellis, Radhika Loomba
  • Patent number: 11217535
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan
  • Patent number: 11216404
    Abstract: Apparatuses, methods, and computer-readable media are provided for operating a port manager to detect a first link condition or a second link condition of a circuitry. Under the first link condition, a first link between a downstream port of the circuitry and an upstream port of a switch is compatible to a first protocol, and a second link between a downstream port of the switch and an upstream port of a device is compatible to the second protocol. Under the second link condition, the first link exists and is compatible to the first protocol, while there is no second link being compatible to the second protocol. The port manager is to operate the downstream port of the circuitry according to the second protocol on detection of the first link condition, or according to the first protocol on detection of the second link condition. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: November 4, 2019
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventor: Mahesh Natu
  • Patent number: 11216724
    Abstract: Techniques are provided for acoustic event detection. A methodology implementing the techniques according to an embodiment includes extracting acoustic features from a received audio signal. The acoustic features may include, for example, one or more short-term Fourier transform frames, or other spectral energy characteristics, of the audio signal. The method also includes applying a trained classifier to the extracted acoustic features to identify and label acoustic event subparts of the audio signal and to generate scores associated with the subparts. The method further includes performing sequence decoding of the acoustic event subparts and associated scores to detect target acoustic events of interest based on the scores and temporal ordering sequence of the event subparts. The classifier is trained on acoustic event subparts that are generated through unsupervised subspace clustering techniques applied to training data that includes target acoustic events.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: January 4, 2022
    Assignee: INTEL CORPORATION
    Inventors: Kuba Lopatka, Tobias Bocklet, Mateusz Kotarski
  • Patent number: 11216396
    Abstract: Aspects of the disclosure are directed to systems, methods, and devices that include an application processor. The application processor includes an interface logic to interface with a communication module using a bidirectional interconnect link compliant with a peripheral component interconnect express (PCIe) protocol. The interface logic to receive a data packet from across the link, the data packet comprises a header and data payload; determine a hint bit set in the header of the data packet; determine a steering tag value in the data packet header based on the hint bit set; and transmit the data payload to non-volatile memory based on the steering tag set in the header.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Mark A. Schmisseur, Raj K. Ramanujan, Filip Schmole, David M. Lee, Ishwar Agarwal, David J. Harriman
  • Patent number: 11216249
    Abstract: A method for designing a system on a target device includes identifying a length for a carry chain that is supported by predefined quanta of a resource on the target device. A plurality of logical adders is mapped onto a single logical adder implemented on the carry chain subject to the identified length to increase logic utilization in a design for the system.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Martin Langhammer, Gregg William Baeckler
  • Patent number: 11216386
    Abstract: Techniques for setting a 2-level auto-close timer to access a memory device include examples of setting first and second time values for the 2-level auto-close timer to cause accessed rows to auto-close following a cache line access to a row of a bank of memory devices. For these examples, the cache line access is responsive to a multi-channel address interleaving policy that causes either successive or non-successive cache line accesses to the bank of memory devices.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Vivek Kozhikkottu, Suresh Chittor, Esha Choukse, Shankar Ganesh Ramasubramanian
  • Patent number: 11216366
    Abstract: A memory controller is to store a unique tag at the mid-point address within each of allocated memory portions. In addition to the tag data, additional metadata may be stored at the mid-point address of the memory allocation. For each memory access operation, an encoded pointer contains information indicative of a size of the memory allocation as well as its own tag data. The processor circuitry compares the tag data included in the encoded pointer with the tag data stored in the memory allocation. If the tag data included in the encoded pointer matches the tag data stored in the memory allocation, the memory operation proceeds. If the tag data included in the encoded pointer fails to match the tag data stored in the memory allocation, an error or exception is generated.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: David M. Durham, Michael LeMay
  • Patent number: 11217934
    Abstract: Embodiments may relate to a cover for a socket of a computing device. The cover may include a cover piece and a locking mechanism attached to the cover piece by a hinge. The locking mechanism, when in a locked position, may removably secure the cover to a bolster such that the cover piece overlays the socket. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventors: Ming-Chen Chang, Mustafa H. Haswarey, Praneetha Kolla, Whitten Schulz
  • Patent number: 11216408
    Abstract: The present disclosure generally relates to a device, method, or system for time sensitive networking. In an example, the device can include a time-sensitive networking controller and a scheduler. The device also includes an enhanced gate control list maintained on the time-sensitive networking controller to include a direct memory access address, a launch time, and a pre-fetch time for a data packet. The device may also include a transmitter of the time-sensitive networking controller to transmit the data packet retrieved using the direct memory access address at the launch time identified by the scheduler.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: January 4, 2022
    Assignee: Intel Corporation
    Inventor: Kishore Kasichainula