Abstract: An apparatus and method for tagged memory management, an embodiment including execution circuitry to generate a system memory access request having a first address pointer and address translation circuitry to determine whether to translate the first address pointer with metadata processing. The address translation circuitry is to access address translation tables to translate the first address pointer to a first physical address, perform a lookup in a memory metadata table to identify a memory metadata value associated with a physical address range including the first physical address, determine a pointer metadata value associated with the first address pointer, and compare the memory metadata value with the pointer metadata value; and when the comparison results in a validation of the memory access request, then return the first physical address.

Abstract: Implementations of the disclosure provide a processing device comprising an address translation circuit to intercept a work request from an I/O device. The work request comprises a first ASID to map to a work queue. A second ASID of a host is allocated for the first ASID based on the work queue. The second ASID is allocated to at least one of: an ASID register for a dedicated work queue (DWQ) or an ASID translation table for a shared work queue (SWQ). Responsive to receiving a work submission from the SVM client to the I/O device, the first ASID of the application container is translated to the second ASID of the host machine for submission to the I/O device using at least one of: the ASID register for the DWQ or the ASID translation table for the SWQ based on the work queue associated with the I/O device.

Abstract: A processor of an aspect includes a decode unit to decode an instruction. The processor also includes an execution unit coupled with the decode unit. The execution unit, in response to the instruction, is to determine that an attempted change due to the instruction, to a shadow stack pointer of a shadow stack, would cause the shadow stack pointer to exceed an allowed range. The execution unit is also to take an exception in response to determining that the attempted change to the shadow stack pointer would cause the shadow stack pointer to exceed the allowed range. Other processors, methods, systems, and instructions are disclosed.

Abstract: A wireless energy transfer system includes an electronic device having at least two members, each housing at least a portion of the electronic device pivotably coupled via a number of hinges. A hinge member is disposed proximate at least some of the number of hinges. At least one receiver coil may be disposed in, on, or about the hinge member. Removing the receiver coil from the members housing the electronic device advantageously permits thinning of the members and a beneficial reduction in height of the electronic device. A power supply may include a number of power supply coils disposed in, on, or about a power supply member. Some or all of the power supply coils may wirelessly couple to the at least one receiver coil via an electromagnetic field and transfer energy to the electronic device when the electronic device is disposed proximate the power supply.

Abstract: Various embodiments are generally directed to techniques for supporting the distributed execution of a task routine among multiple secure controllers incorporated into multiple computing devices. An apparatus includes a first processor component and first secure controller of a first computing device, where the first secure controller includes: a selection component to select the first secure controller or a second secure controller of a second computing device to compile a task routine based on a comparison of required resources to compile the task routine and available resources of the first secure controller; and a compiling component to compile the task routine into a first version of compiled routine for execution within the first secure controller by the first processor component and a second version for execution within the second secure controller by a second processor component in response to selection of the first secure controller. Other embodiments are described and claimed.

Abstract: Embodiments herein may present an integrated circuit or a computing system having an integrated circuit, where the integrated circuit includes a physical network layer, a physical computing layer, and a physical memory layer, each having a set of dies, and a die including multiple tiles. The physical network layer further includes one or more signal pathways dynamically configurable between multiple pre-defined interconnect topologies for the multiple tiles, where each topology of the multiple pre-defined interconnect topologies corresponds to a communication pattern related to a workload. At least a tile in the physical computing layer is further arranged to move data to another tile in the physical computing layer or a storage cell of the physical memory layer through the one or more signal pathways in the physical network layer. Other embodiments may be described and/or claimed.

Abstract: The present disclosure describes a digital signal processing (DSP) block that includes a plurality of columns of weight registers and a plurality of inputs configured to receive a first plurality of values and a second plurality of values. The first plurality of values is stored in the plurality of columns of weight registers after being received. In a first mode of operation, the first and second pluralities of values are received via a first portion of the plurality of inputs. In a second mode of operation, the first plurality of values is received via a second portion of the plurality of inputs, and the second plurality of values is received via the first portion of the plurality of inputs. Additionally, the DSP block includes a plurality of multipliers configured to simultaneously multiply each value of the first plurality of values by each value of the second plurality of values.

Abstract: An example apparatus includes a communication interface; memory; a screen to present media; and processor circuitry to at least: cause transmission of an indication related to a screen state to a source device, the screen state corresponding to at least one of an orientation capability or a rotation capability of the screen of a sink device; and access the media, the media from the source device, the media adapted based on the indication related to the screen state.

Abstract: An apparatus and method for efficiently managing shadow stacks. For example, one embodiment of a processor comprises: a plurality of registers to store a plurality of shadow stack pointers (SSPs); event processing circuitry to select a first SSP of the plurality of SSPs from a first register of the plurality of registers responsive to receipt of a first event associated with a first event priority level, the first SSP usable to identify a top of a first shadow stack; verification and utilization checking circuitry to determine whether the first SSP has been previously verified, wherein if the first SSP has not been previously verified then initiating a set of atomic operations to verify the first SSP and confirm that the first SSP is not in use, the set of atomic operations using a locking operation to lock data until the set of atomic operations are complete.

Abstract: In an example, an apparatus comprises a plurality of execution units and logic, at least partially including hardware logic, to gate at least one of a multiply unit or an accumulate unit in response to an input of value zero. Other embodiments are also disclosed and claimed.

Abstract: Techniques for scalable virtualization of an Input/Output (I/O) device are described. An electronic device composes a virtual device comprising one or more assignable interface (AI) instances of a plurality of AI instances of a hosting function exposed by the I/O device. The electronic device emulates device resources of the I/O device via the virtual device. The electronic device intercepts a request from the guest pertaining to the virtual device, and determines whether the request from the guest is a fast-path operation to be passed directly to one of the one or more AI instances of the I/O device or a slow-path operation that is to be at least partially serviced via software executed by the electronic device. For a slow-path operation, the electronic device services the request at least partially via the software executed by the electronic device.

Abstract: A method for emulating a guest centralized flag architecture by using a native distributed flag architecture. The method includes receiving an incoming instruction sequence using a global front end; grouping the instructions to form instruction blocks, wherein each of the instruction blocks comprise two half blocks; scheduling the instructions of the instruction block to execute in accordance with a scheduler; and using a distributed flag architecture to emulate a centralized flag architecture for the emulation of guest instruction execution.

Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to facilitating increased clock speeds on a substrate by lowering the impedance of traces that provide clock signals to components such as DRAM. For example, embodiments may include a substrate with a first layer and a second layer parallel to the first layer with a first trace coupled with the first layer in a routing configuration and a second trace coupled with the second layer in the routing configuration, where the routing configuration of the first trace and the second trace substantially overlap each other with respect to an axis perpendicular to the first layer and the second layer, and where the first trace and the second trace are electrically coupled by a first and a second electrical coupling perpendicular to the first layer and the second layer.

Abstract: Error correction values for a memory device include row error correction values and column error correction values for the same memory array. The memory device includes a memory array that is addressable in two spatial dimensions: a row dimension and a column dimension. The memory array is written as rows of data, and can be read as rows in the row dimension or read as columns in the column dimension. A data write triggers updates to row error correction values and to column error correction values.

Abstract: A device is provided with two or more uplink ports to connect the device via two or more links to one or more sockets, where each of the sockets includes one or more processing cores, and each of the two or more links is compliant with a particular interconnect protocol. The device further includes I/O logic to identify data to be sent to the one or more processing cores for processing, determine an affinity attribute associated with the data, and determine which of the two or more links to use to send the data to the one or more processing cores based on the affinity attribute.

Abstract: Methods, apparatus, systems and articles of manufacture are disclosed that optimize workflows. An example apparatus includes an intent determiner to determine an objective of a user input, the objective indicating a task to be executed in an infrastructure, a configuration composer to compose a plurality of workflows based on the determined objective, a model executor to execute a machine learning model to create a confidence score relating to the plurality of workflows, and a workflow selector to select at least one of the plurality of workflows for execution in the infrastructure, the selection of the at least one of the plurality of workflows based on the confidence score.

Abstract: Example haptic gloves for virtual reality systems and related methods are disclosed herein. An example apparatus disclosed herein includes a glove to be worn on a hand of a user, an ultrasonic array disposed on an inner surface of the glove, and a control unit to activate the ultrasonic array device to generate haptic feedback on the hand of the user.

Abstract: A processor comprises a microarchitectural feature and dynamic tuning unit (DTU) circuitry. The processor executes a program for first and second execution windows with the microarchitectural feature disabled and enabled, respectively. The DTU circuitry automatically determines whether the processor achieved worse performance in the second execution window. In response to determining that the processor achieved worse performance in the second execution window, the DTU circuitry updates a usefulness state for a selected address of the program to denote worse performance. In response to multiple consecutive determinations that the processor achieved worse performance with the microarchitectural feature enabled, the DTU circuitry automatically updates the usefulness state to denote a confirmed bad state.

Abstract: Embodiments are generally directed to a flexible overlapping display. An embodiment of a mobile device includes a processor to process data for the mobile device, a bendable and foldable display screen, one or more device sensors to sense an orientation of the mobile device, and one or more display sensors to sense a current arrangement of the display screen. The processor is to identify one or more portions of the display screen that are visible to a user based at least in part on data from the one or more device sensors and the one or more display sensors.

Abstract: Disclosed embodiments relate to a cache line eviction algorithm. In one example, a system includes a last level cache (LLC) having multiple ways, each allocated to one of multiple priorities, each having specified minimum and maximum ways to occupy, a cache control circuit (CCC) to store an incoming cache line (CL) having a requestor priority to an invalid CL, if any, otherwise, when the requestor priority is a lowest priority and has an occupancy of one or more, or when the occupancy is at a maximum, to evict a least recently used (LRU) CL of the requestor priority, otherwise, when the occupancy is between a minimum and a maximum, to evict a LRU CL of the requestor or a lower priority, otherwise, when the occupancy is less than the minimum, to evict a LRU CL, if any, of the lower priority, and otherwise, to evict a LRU CL of a higher priority.

Abstract: Includes receiving, from a link partner, a message specifying a link partner receive wake time and resolving to a transmit wake time.

Abstract: Apparatus and method for processing virtual graphics processor telemetry data based on quanta.

Abstract: In one embodiment, a processor includes: a first plurality of intellectual property (IP) circuits to execute operations; and a second plurality of integrated voltage regulators, where the second plurality of integrated voltage regulators are oversubscribed with respect to the first plurality of IP circuits. Other embodiments are described and claimed.

Abstract: Methods and apparatus to transition between 2D and 3D renderings of augmented reality content are disclosed. An example apparatus includes instructions to cause programmable circuitry to: cause projection of an AR object onto at least one of a first surface in a real-world environment or a second surface in the real-world environment; cause the AR object to appear to move with variable depth relative to the first surface; cause the AR object to appear to move at a fixed depth relative to the second surface; cause the AR object to appear to transition from the first surface to the second surface when an apparent depth of the AR object relative to the first surface is within a threshold of the fixed depth; and prevent the AR object from appearing to transition to the second surface when the apparent depth is not within the threshold of the fixed depth.

Abstract: An example apparatus for selecting priors includes a training set receiver to receive a training dataset. The apparatus includes a prior generator to generate a set of redundant priors based on the training dataset. The apparatus includes an intermediate trainer to train a detection CNN using the set of redundant priors. The apparatus includes a score and location receiver to send all training samples of the training dataset to the trained detection CNN and receive responses for all of the redundant priors in the set of redundant priors. The apparatus includes a subset selector to select a subset of the set of redundant priors based on the responses.

Abstract: A robotic system is disclosed that uses autonomous tunnel navigation. The system includes a plurality of sensors (e.g., ranging, odometry) to measure a distance from the robotic system to a plurality of walls. Memory stores instructions and a processor is coupled to the memory and the plurality of sensors to execute the instructions. The instructions cause the robotic system to detect movement of the robotic system through a surrounding environment based on sensor measurements, determine if the robotic system is in a tunnel based on the sensor measurements, and navigate with the odometry-based sensor when the robotic system is determined to be in the tunnel or the ranging sensor when the robotic system is determined to be not in the tunnel.

Abstract: A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.

Abstract: Apparatus and method for compressing an acceleration data structure such as a bounding volume hierarchy (BVH). For example, one embodiment of a graphics processing apparatus comprises: one or more cores to execute graphics instructions including instructions to perform ray tracing operations; and compression circuitry to compress lowest level nodes of a hierarchical acceleration data structure comprising a plurality of hierarchically arranged nodes, each of the lowest level nodes comprising pointers to leaf data; the compression circuitry to quantize the lowest level nodes to generate quantized lowest level nodes and to store each quantized lowest level node and associated leaf data without the pointers to the leaf data.

Abstract: In one example an apparatus comprises a memory and a processor to create, from a first deep neural network (DNN) model, a first plurality of DNN models, generate a first set of adversarial examples that are misclassified by the first plurality of deep neural network (DNN) models, determine a first set of activation path differentials between the first plurality of adversarial examples, generate, from the first set of activation path differentials, at least one composite adversarial example which incorporates at least one intersecting critical path that is shared between at least two adversarial examples in the first set of adversarial examples, and use the at least one composite adversarial example to generate a set of inputs for a subsequent training iteration of the DNN model. Other examples may be described.

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

Abstract: Computers for supporting multiple virtual reality (VR) display devices and related methods are described herein. An example computer includes a graphics processing unit (GPU) to render frames for a first VR display device and a second VR display device, a memory to store frames rendered by the GPU for the first VR display device and the second VR display device, and a vertical synchronization (VSYNC) scheduler to transmit alternating first and second VSYNC signals to the GPU such that a time period between each of the first or second VSYNC signals and a subsequent one of the first or second VSYNC signals is substantially the same. The GPU is to, based on the first and second VSYNC signals, alternate between rendering a frame for the first VR display device and a frame for the second VR display device.

Abstract: A digital control scheme controls an integrator of a PID filter to implement non-linear control of saturating the duty cycle during which the proportional and derivative terms of the PID filter are set to 0 while the integrator and its internal states (previous values or memory) is set to a duty cycle that is the sum of the current nominal duty cycle plus a deltaD. The deltaD is the maximum duty cycle increment that is used to regulate a voltage regulator from ICCmin to ICCmax and is a configuration register that can be set post silicon. An FSM moves from a non-linear all ON state to an open loop duty cycle which maintains the output voltage slightly higher than the required Vref. After a certain period in this open loop, the FSM then ramps down the open loop duty cycle value until the output voltage is close to the Vref.

Abstract: An apparatus is provided which comprises: a fin; a layer formed on the fin, the layer dividing the fin in a first section and a second section; a first device formed on the first section of the fin; and a second device formed on the second section of the fin.

Abstract: For a buck-boost DC-DC converter with n-type high-side field effect transistor (HSFET), a supply is derived from input and output rails, and this supply maintains a constant differential voltage independent of input supply voltage. The derived supply is used as the high supply (HS) of an HSFET Driver. As such, the HSFET resistance becomes independent of supply variation. A wide range ultra-low IQ (Quiescent current), edge triggered level-shifter provides support to a bootstrapped power stage of the inverting buck-boost DC-DC converter. When p-type HSFET is used, a supply is derived from the input and output supply rails, and this derived supply maintains a constant differential voltage independent to the input supply voltage. The derived supply is used as the low supply (LS) or ‘ground’ of the HSFET Driver. As such, the p-type HSFET resistance becomes independent of supply variation.

Abstract: Embodiments described herein are directed to a temporary interconnect for use in testing one or more devices (e.g., one or more dies, inductors, capacitors, etc.) formed in semiconductor package. In one scenario, a temporary interconnect acts an electrical bridge that electrically couples a contact pad on a surface of a substrate and the test pad. Coupling the contact pad and the test pad to each other enables the device(s) coupled the contact pad to be tested. Following testing, the temporary interconnect can be removed or severed so that an electrical break is formed in the conductive path between test pad and the contact pad.

Abstract: Metallization structures under a semiconductor device layer. A metallization structure in alignment with semiconductor fin may be on a side of the fin opposite a gate stack. Backside and/or frontside substrate processing techniques may be employed to form such metallization structures on a bottom of a semiconductor fin or between bottom portions of two adjacent fins. Such metallization structures may accompany interconnect metallization layers that are over a gate stack, for example to increase metallization layer density for a given number of semiconductor device layers.

Abstract: An IC package, comprising a first IC component comprising a first interconnect on a first surface thereof; a second IC component comprising a second interconnect on a second surface thereof. The second component is above the first component, and the second surface is opposite the first surface. A thermoelectric cooling (TEC) device is between the first surface and the second surface. The TEC device is electrically coupled to the first interconnect and to the second interconnect.

Abstract: A thin film transistor (TFT) apparatus is disclosed, where the apparatus includes a gate comprising metal, a source and a drain, a semiconductor body, and two or more dielectric structures between the gate and the semiconductor body. In an example, the two or more dielectric structures may include at least a first dielectric structure having a first bandgap and a second dielectric structure having a second bandgap. The first bandgap may be different from the second bandgap. The TFT apparatus may be a back-gated TFT apparatus where the source is at least in part coplanar with the drain, and the gate is non-coplanar with the source and the drain.

Abstract: An embedded multi-die interconnect bridge (EMIB) is fabricated on a substrate using photolithographic techniques, and the EMIB is separated from the substrate and placed on the penultimate layer of an integrated-circuit package substrate, below the top solder-resist layer. A low Z-height of the EMIB, allows for useful trace and via real estate below the EMIB, to be employed in the package substrate.

Abstract: Disclosed herein are quantum dot devices with conductive liners, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include a base, a first fin extending from the base, a second fin extending from the base, a conductive material between the first fin and the second fin, and a dielectric material between the conductive material and the first fin.

Abstract: Embodiments disclosed herein include electronic packages for PoINT architectures. Particularly, embodiments include electronic packages that include reinforcement substrates to minimize warpage. In an embodiment, an electronic package comprises, a reinforcement substrate, a plurality of through substrate vias through the reinforcement substrate, a dielectric substrate over the reinforcement substrate, a cavity into the dielectric substrate, and a component in the cavity.

Abstract: Disclosed herein are IC structures, packages, and devices assemblies that use ions or fixed charge to create field plate structures which are embedded in a dielectric material between gate and drain electrodes of a transistor. Ion- or fixed charge-based field plate structures may provide viable approaches to changing the distribution of electric field at a transistor drain to increase the breakdown voltage of a transistor without incurring the large parasitic capacitances associated with the use of metal field plates. In one aspect, an IC structure includes a transistor, a dielectric material between gate and drain electrodes of the transistor, and an ion- or fixed charge-based region within the dielectric material, between the gate and the drain electrodes. Such an ion- or fixed charge-based region realizes an ion- or fixed charge-based field plate structure. Optionally, the IC structure may include multiple ion- or fixed charge-based field plate structures.

Abstract: Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.

Abstract: An embodiment includes an apparatus comprising: a substrate; a thin film transistor (TFT) comprising: source, drain, and gate contacts; a semiconductor material, comprising a channel, between the substrate and the gate contact; a gate dielectric layer between the gate contact and the channel; and an additional layer between the channel and the substrate; wherein (a)(i) the channel includes carriers selected from the group consisting of hole carriers or electron carriers, (a)(ii) the additional layer includes an insulator material that includes charged particles having a polarity equal to a polarity of the carriers. Other embodiments are described herein.

Abstract: An integrated circuit includes a package substrate that includes first and second electrical traces. The integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. The first and second configurable dies are arranged in a first row. The third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. The first and third configurable dies are arranged in a first column. The second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. The first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. The second electrical trace is oblique with respect to the first electrical trace. The oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.

Abstract: A protected link between a first computing device and a second computing device is set up, wherein communication over the protected link is to comply with a communication protocol that allows packets to be reordered during transit. A plurality of packets are generated according to a packet format that ensures the plurality of packets will not be reordered during transmission over the protected link, the plurality of packets comprising a first packet and a second packet. Data of the plurality of packets are encrypted for transmission over the protected link, wherein data of the first packet is encrypted based on the cryptographic key and a first value of a counter and data of the second packet is encrypted based on the cryptographic key and a second value of the counter.

Abstract: An integrated circuit may include circuitry for accessing an associated die stack. The circuitry may receive temperature information as well as a plurality of operating parameters that help determine whether it may be desirable to reroute access commands or requests to one or more die in the stack. The circuitry may include a smart crossbar switch that implements an address translation or hashing function to help map the logical user address to a physical address space. Performing thermally aware traffic management in this way can ensure that acceptable timing margins are maintained in the system to minimize the probability of errors.

Abstract: Device and methods to receive an instruction to apply a requested power back-off (PBO) for transmitting a data packet at an adjusted transmission power adapted from a current transmission power; estimate a first energy quantity for transmitting the data packet based on the adjusted transmission power and a first estimated length of time for transmitting the data packet at the adjusted transmission power; determine the second transmission power that is greater than the adjusted transmission power and estimate a second energy quantity based on the second transmission power and a second estimated length of time for transmitting the data packet at the second transmission power, where the second energy quantity is less than the first energy quantity; and apply the second PBO based on the second transmission power for transmitting the data packet instead of applying the requested PBO.

Abstract: An apparatus including a circuit structure including a device stratum including a plurality of devices including a first side and an opposite second side; and a metal interconnect coupled to at least one of the plurality of devices from the second side of the device stratum. A method including forming a transistor device including a channel between a source region and a drain region and a gate electrode on the channel defining a first side of the device; and forming an interconnect to one of the source region and the drain region from a second side of the device.

Abstract: Systems and techniques for dynamic computation in an information centric network (ICN) are described herein. An interest packet to perform a computation may be received at a first interface of an ICN node. The ICN node may then perform a lookup in a forwarding information base (FIB) to identify a second interface to forward the interest packet. The interest packet may be forwarded on the second interface. Upon receipt of a data packet on the second interface in response to the interest packet, the ICN node may update an entry in the FIB for the second interfaces with a processing payload included in the data packet. The ICN node may then transmit the data packet downstream towards the originator of the interest packet.