Intel Patents Granted

Patents granted to Intel by the U.S. Patent and Trademark Office (USPTO).

  • Patent number: 11206390
    Abstract: Systems, apparatuses and methods may provide for technology that includes a substrate, and a display pipeline coupled to the substrate. The display pipeline may to barrel an initial image to form a barreled image.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Ravindra A. Babu, Sagar C. Pawar, Satyanantha R. Musunuri, Sashank Ms, Kalyan K. Kaipa
  • Patent number: 11205995
    Abstract: An apparatus injects a start clock to a crystal at the beginning to increase an overall start up speed of the crystal. The apparatus relies on an impedance change inside the crystal itself instead of searching for a synchronization on the yet small crystal oscillation. The apparatus includes an oscillator (separate from the crystal) to search for the crystal's resonance frequency by detecting the crystal's impedance change. Once the frequency of the oscillator matches the crystal's resonance, there is significant change in the crystal's impedance. Using that information, the apparatus can lock the oscillator frequency at the crystal resonance frequency and inject the clock with high efficiency.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Brent Carlton, Hao Luo, Somnath Kundu
  • Patent number: 11204766
    Abstract: Embodiments include a method comprising identifying, by an instruction scheduler of a processor core, a first high power instruction in an instruction stream to be executed by an execution unit of the processor core. A pre-charge signal is asserted indicating that the first high power instruction is scheduled for execution. Subsequent to the pre-charge signal being asserted, a voltage boost signal is asserted to cause a supply voltage for the execution unit to be increased. A busy signal indicating that the first high power instruction is executing is received from the execution unit. Based at least in part on the busy signal being asserted, de-asserting the voltage boost signal. More specific embodiments include decreasing the supply voltage for the execution unit subsequent to the de-asserting the voltage boost signal. More Further embodiments include delaying asserting the voltage boost signal based on a start delay time.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Jason Seung-Min Kim, Nitin N. Garegrat, Anitha Loke, Nasima Parveen, David Y. Fang, Kursad Kiziloglu, Dmitry Sergeyevich Lukiyanchenko, Fabrice Paillet, Andrew Yang
  • Patent number: 11206748
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Raghavendra Doddi, Ravishankar Srikanth, Kathiravan D, Prakash Kurma Raju
  • Patent number: 11204808
    Abstract: Systems and methods for are provided for offloading computing tasks from constrained devices. An example apparatus includes an offload computing protocol (OCP) enabled device. The OCP enabled device includes OCP extensions to the operating system to enable the offloading of computing tasks. A proximity locator may use a radio transceiver to locate an OCP device that can accept a computing task. The OCP enabled device may include an OCP bundle comprising code and data, wherein the OCP bundle is to be sent to the OCP device.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Fearghal O'Hare, Michael Nolan, James A. O'Neill
  • Patent number: 11206510
    Abstract: A communication device adapted for communicating in a communication system can include a receiver, a processor, and a transmitter. The receiver can receive (e.g., capture, sniff) information from one or more wireless devices (e.g., vehicles) using a first communication technology (e.g., V2X technologies). The processor can process the received information to generate system information associated with the communication system. The transmitter can transmit the system information to one or more wireless devices using a second communication technology (e.g., LTE) different from the first communication technology.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Martin Kolde, Thorsten Clevorn
  • Patent number: 11206690
    Abstract: Systems, methods, and computer-readable storage media for measuring one-way delay in multi-access networks (MAMS) are provided. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Jing Zhu, Pengfei Zhao
  • Patent number: 11205962
    Abstract: An apparatus is described which includes a delay-line with reasonably matched delay cells and some logic to ascertain both a correct number of DC-DC converters and interleaving angles or phase offsets. The apparatus measures an operating frequency in real-time in multiples of the individual delay cells of the delay-line. The smaller the period, the higher the load coupled to the DC-DC converters and, therefore the greater the number of DC-DC converters are needed to service the load. The period determines the load and can be used to determine the number of DC-DC converters needed and thereby accomplishing autonomous phase enabling/shedding.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Nachiket Desai, Harish Krishnamurthy, Suhwan Kim
  • Patent number: 11205717
    Abstract: Techniques are disclosed for forming a heterojunction bipolar transistor (HBT) that includes a laterally grown epitaxial (LEO) base layer that is disposed between corresponding emitter and collector layers. Laterally growing the base layer of the HBT improves electrical and physical contact between electrical contacts to associated portions of the HBT device (e.g., a collector). By improving the quality of electrical and physical contact between a layer of an HBT device and corresponding electrical contacts, integrated circuits using HBTs are better able to operate at gigahertz frequency switching rates used for modern wireless communications.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Sansaptak Dasgupta, Marko Radosavljevic, Han Wui Then, Paul B. Fischer
  • Patent number: 11204555
    Abstract: An apparatus, comprising at least one vessel having a bottom and at least one sidewall extending from the bottom, wherein the at least one sidewall encloses an interior of the at least one vessel, a shaft has a proximal end and a distal end, wherein the distal end of the shaft extends into the interior of the at least one vessel, wherein the proximal end of the shaft is coupled to a motor, at least one support structure which extends laterally from the shaft; and a substrate attachment fixture on a distal end of the at least one support structure, wherein the at least one support structure and the substrate attachment fixture are within the interior of the at least one vessel.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventor: Pooya Tadayon
  • Patent number: 11204750
    Abstract: The disclosed embodiments generally relate to methods, systems and apparatuses for dynamic firmware/software (FW/SW) update distribution in highly and fully autonomous or automated vehicles. In one embodiment, the disclosure relates to an apparatus to dynamically upgrade code in a vehicle. The apparatus may include: a communication module for one or more of wireless or landline communication; a central processing unit (CPU) in communication with the communication module, the CPU configured to receive an indication requiring a code upgrade to an existing vehicle code software and receive the code upgrade; store the code upgrade; execute code upgrade in parallel with the existing vehicle code software; log one or more error indications resulted from execution of the code upgrade; replace the existing vehicle code with the code upgrade if the logged error indication is less than a first threshold; and direct the code upgrade to a second vehicle to update the second vehicle code.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventor: Igor Tatourian
  • Patent number: 11205622
    Abstract: To overcome the problem of devices in a multi-chip package (MCP) interfering with one another, such as through electromagnetic interference (EMI) and/or radio-frequency interference (RFI), the chip package can include an electrically conductive stiffener that at least partially electrically shields the devices from one another. At least some of the devices can be positioned in respective recesses in the stiffener. In some examples, when the devices are positioned in the recesses, at least one device does not extend beyond a plane defined by a first side of the stiffener. Such shielding can help reduce interference between the devices. Because device-to-device electrical interference can be reduced, devices on the package can be positioned closer to one another, thereby reducing a size of the package. The devices can electrically connect to a substrate via electrical connections that extend through the stiffener.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong
  • Patent number: 11204769
    Abstract: A global front end scheduler to schedule instruction sequences to a plurality of virtual cores implemented via a plurality of partitionable engines. The global front end scheduler includes a thread allocation array to store a set of allocation thread pointers to point to a set of buckets in a bucket buffer in which execution blocks for respective threads are placed, a bucket buffer to provide a matrix of buckets, the bucket buffer including storage for the execution blocks, and a bucket retirement array to store a set of retirement thread pointers that track a next execution block to retire for a thread.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventor: Mohammad Abdallah
  • Patent number: 11205616
    Abstract: Memory bit cells having internal node jumpers are described. In an example, an integrated circuit structure includes a memory bit cell on a substrate. The memory bit cell includes first and second gate lines parallel along a second direction of the substrate. The first and second gate lines have a first pitch along a first direction of the substrate, the first direction perpendicular to the second direction. First, second and third interconnect lines are over the first and second gate lines. The first, second and third interconnect lines are parallel along the second direction of the substrate. The first, second and third interconnect lines have a second pitch along the first direction, where the second pitch is less than the first pitch. One of the first, second and third interconnect lines is an internal node jumper for the memory bit cell.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Smita Shridharan, Zheng Guo, Eric A. Karl, George Shchupak, Tali Kosinovsky
  • Patent number: 11204718
    Abstract: Embodiments are directed towards apparatuses, methods, and systems including a pre-read command to eliminate an additional access of read data from a storage location of a memory device. In embodiments, a memory controller issues a pre-read command to store read data in a pre-read latch. In embodiments, the command is issued during a first access of the read data from a storage location in connection with a modify-write operation of the read data. In embodiments, the pre-read latch is located in or coupled to a selected partition of a memory device that includes the storage location that stores the read data. In embodiments, the memory controller subsequently issues a modify-write command to compare the read data stored in the pre-read latch with incoming data, to eliminate a need for a second access of the storage location during completion of the modify-write operation. Additional embodiments may be described and claimed.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Rajesh Sundaram, Zion S. Kwok, Muthukumar Swaminathan
  • Patent number: 11206008
    Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Georgios C. Dogiamis, Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Johanna M. Swan
  • Patent number: 11206024
    Abstract: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Sharath Raghava, Ankireddy Nalamalpu, Dheeraj Subbareddy, Harsha Gupta, James Ball, Kavitha Prasad, Sean R. Atsatt
  • Patent number: 11204650
    Abstract: A method, apparatus and system enable indirect remote interaction with a web browser. In one embodiment, remote user gestures may be captured and processed to determine an action to be taken by the web browser.
    Type: Grant
    Filed: October 9, 2020
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Christopher L Elford, Howard P. Tsoi
  • Patent number: 11204977
    Abstract: Described herein is an accelerator device including a host interface, a fabric interconnect coupled with the host interface, and one or more hardware tiles coupled with the fabric interconnect, the one or more hardware tiles including sparse matrix multiply acceleration hardware including a systolic array with feedback inputs.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Subramaniam Maiyuran, Jorge Parra, Supratim Pal, Ashutosh Garg, Shubra Marwaha, Chandra Gurram, Darin Starkey, Durgesh Borkar, Varghese George
  • Patent number: 11205017
    Abstract: Embodiments are directed to post quantum public key signature operation for reconfigurable circuit devices. An embodiment of an apparatus includes one or more processors; and a reconfigurable circuit device, the reconfigurable circuit device including a dedicated cryptographic hash hardware engine, and a reconfigurable fabric including logic elements (LEs), wherein the one or more processors are to configure the reconfigurable circuit device for public key signature operation, including mapping a state machine for public key generation and verification to the reconfigurable fabric, including mapping one or more cryptographic hash engines to the reconfigurable fabric, and combining the dedicated cryptographic hash hardware engine with the one or more mapped cryptographic hash engines for cryptographic signature generation and verification.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: December 21, 2021
    Assignee: INTEL CORPORATION
    Inventors: Vikram Suresh, Sanu Mathew, Rafael Misoczki, Santosh Ghosh, Raghavan Kumar, Manoj Sastry, Andrew H. Reinders
  • Patent number: 11205630
    Abstract: A composite integrated circuit (IC) device structure comprising a host chip and a chiplet. The host chip comprises a first device layer and a first metallization layer. The chiplet comprises a second device layer and a second metallization layer that is interconnected to transistors of the second device layer. A top metallization layer comprising a plurality of first level interconnect (FLI) interfaces is over the chiplet and host chip. The chiplet is embedded between a first region of the first device layer and the top metallization layer. The first region of the first device layer is interconnected to the top metallization layer by one or more conductive vias extending through the second device layer or adjacent to an edge sidewall of the chiplet.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Adel Elsherbini, Patrick Morrow, Johanna Swan, Shawna Liff, Mauro Kobrinksy, Van Le, Gerald Pasdast
  • Patent number: 11206667
    Abstract: This disclosure describes systems, methods, and devices related to extreme high throughput (EHT) data scrambler. A device may determine an extreme high throughput (EHT) data field of a frame to be scrambled using an EHT data scrambler. The device may determine to initialize the EHT data scrambler using an initialization seed, wherein the initialization seed has a size greater than seven bits. The device may generate scrambled data using the initialization seed. The device may cause to send the frame comprising the scrambled data to a first station device.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: December 21, 2021
    Assignee: Intel Corporation
    Inventors: Qinghua Li, Xiaogang Chen, Assaf Gurevitz, Thomas J. Kenney, Shlomi Vituri, Feng Jiang
  • Patent number: 11206104
    Abstract: Some demonstrative embodiments include apparatuses, devices, systems and methods of communicating an Enhanced Directional Multi-Gigabit (DMG) (EDMG) Orthogonal Frequency-Division Multiplexing (OFDM) Physical layer (PHY) Protocol Data Unit (PPDU). For example, an EDMG station (STA) may be configured to generate an EDMG OFDM PPDU including at least a non-EDMG header (L-Header), an EDMG header, and a data field, the EDMG header including a spoofing error length indicator field configured to indicate whether or not a spoofing error of the EDMG OFDM PPDU is less than one OFDM symbol duration; and to transmit the EDMG OFDM PPDU over a channel bandwidth in a frequency band above 45 Gigahertz (GHz).
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: December 21, 2021
    Assignee: INTEL CORPORATION
    Inventors: Claudio Da Silva, Artyom Lomayev, Alexander Maltsev, Carlos Cordeiro, Michael Genossar
  • Patent number: 11205715
    Abstract: A method comprising: forming a substrate; forming a first nanowire over the substrate; forming a second nanowire over the substrate; forming a gate over a portion of the first and second nanowires; implanting a dopant such that a region between the first and second nanowires under the gate does not receive the dopant while a region between the first and second nanowires away from the gate receives the dopant, wherein the dopant amorphize a material of the region between the first and second nanowires away from the gate; and isotopically etching of the region between the first and second nanowires away from the gate.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: December 21, 2021
    Assignee: INTEL CORPORATION
    Inventors: Mark Armstrong, Biswajeet Guha, Jun Sung Kang, Bruce Beattie, Tahir Ghani
  • Patent number: 11201829
    Abstract: Technologies for pacing network packet transmissions include a computing device. The computing device includes a compute engine and a network interface controller (NIC). The NIC is to select a first transmit descriptor from a window of transmit descriptors. The first transmit descriptor is associated with a packet stream. The NIC is also to identify a node of a plurality of nodes of a hierarchical scheduler. The node is associated with the selected first transmit descriptor. The NIC is also to determine whether the identified node has a target amount of transmission credits available and transmit, in response to a determination that the identified node has a target amount of transmission credits available, the network packet associated with the first transmit descriptor to a target computing device.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Manasi Deval, Gregory J. Bowers, Ryan E. Hall
  • Patent number: 11200961
    Abstract: A method, apparatus and system. The method includes: storing, in a memory circuitry, information on memory commands and associated addresses, the memory commands including read and write commands corresponding to associated addresses within memory chips of a storage device; in response to a determination of a read failure corresponding to at least one of the memory commands: performing a read operation on the information from the memory circuitry; and causing the information to be sent to a host of a computer system that includes the storage device, the information adapted to be used to implement a memory debugging operation for the memory chips.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventor: Sebastian T. Uribe
  • Patent number: 11200176
    Abstract: A system and method are described for flushing a specified region of a memory side cache (MSC) within a multi-level memory hierarchy. For example, a computer system according to one embodiment comprises: a memory subsystem comprised of a non-volatile system memory and a volatile memory side cache (MSC) for caching portions of the non-volatile system memory; and a flush engine for flushing a specified region of the MSC to the non-volatile system memory in response to a deactivation condition associated with the specified region of the MSC.
    Type: Grant
    Filed: September 1, 2020
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Raj K. Ramanujan, Glenn J Hinton, David J. Zimmerman
  • Patent number: 11201492
    Abstract: A method of wirelessly charging batteries of devices includes detecting at least two devices being simultaneously present on a charging mat. It is determined, for each of the at least two devices, whether the device is compatible with a wireless charging standard. It is determined, for each of the two devices, whether the device is enabled for a near field communication. Charging of the devices is prevented if at least one of the devices is enabled for a near field communication but not compatible with the wireless charging standard.
    Type: Grant
    Filed: December 24, 2015
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Anand S. Konanur, Lei Shao, Steven G. Gaskill, Xintian E. Lin, Songnan Yang, Jason Ku, Jie Gao
  • Patent number: 11201114
    Abstract: Methods/structures of forming thin film resistors using interconnect liner materials are described. Those methods/structures may include forming a first liner in a first trench, wherein the first trench is disposed in a dielectric layer that is disposed on a substrate. Forming a second liner in a second trench, wherein the second trench is adjacent the first trench, forming an interconnect material on the first liner in the first trench, adjusting a resistance value of the second liner, forming a first contact structure on a top surface of the interconnect material, and forming a second contact structure on the second liner.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Kevin Lin, Christopher J. Jezewski, Richard F. Vreeland, Tristan A. Tronic
  • Patent number: 11201878
    Abstract: Various systems and methods for bus-off attack detection are described herein. An electronic device for bus-off attack detection and prevention includes bus-off prevention circuitry coupled to a protected node on a bus, the bus-off prevention circuitry to: detect a transmitted message from the protected node to the bus; detect a bit mismatch of the transmitted message on the bus; suspend further transmissions from the protected node while the bus is analyzed; determine whether the bit mismatch represents a bus fault or an active attack against the protected node; and signal the protected node indicating whether a fault has occurred.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Marcio Rogerio Juliato, Shabbir Ahmed, Santosh Ghosh, Christopher Gutierrez, Manoj R. Sastry
  • Patent number: 11200113
    Abstract: A memory device has multiple nonvolatile (NV) memory arrays that collectively store a block of data, with each array to store a portion of the data block. A selected NV memory array stores a write count for the block of data. In response to a write command, the NV memory arrays that store data perform an internal pre-write read. The selected NV memory array that stores the write count will perform a pre-write read of the write count, increment the write count internally to the selected NV memory array, and write the incremented write count back to the selected NV memory array.
    Type: Grant
    Filed: January 14, 2020
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventor: Shekoufeh Qawami
  • Patent number: 11199980
    Abstract: Various embodiments are generally directed to an apparatus, method and other techniques for determining a region of the memory for which to store information, inserting the information into the region of the memory, and applying one or more characteristics to the region of the memory via an instruction set architecture (ISA) operation, the one or more characteristics comprising an immutable characteristic to prevent modification of the information in the region of the memory.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: December 14, 2021
    Assignee: INTEL CORPORATION
    Inventors: Kirk D. Brannock, Barry E. Huntley
  • Patent number: 11202286
    Abstract: Embodiments of an access point (AP), station (STA) and method of communication are generally described herein. The AP may be included in a plurality of APs affiliated with a multi-link AP logical entity. As part of a multi-link AP logical entity, the plurality of APs may share a common medium access control (MAC) data service interface to an upper layer. The AP may exchange signaling with an STA as part of a multi-link setup process between the multi-link TP logical entity and a multi-link non-AP logical entity. The STA may be included in a plurality of STAs affiliated with the multi-link non-AP logical entity. The multi-link setup process may establish a link between each AP of the plurality of APs and a corresponding STA of the plurality of STAs.
    Type: Grant
    Filed: July 11, 2019
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Laurent Cariou, Daniel F. Bravo, Arik Klein, Robert J. Stacey, Daniel Leiderman, Ofer Schreiber, Danny Ben-Ari
  • Patent number: 11200717
    Abstract: Video or graphics, received by a render engine within a graphics processing unit, may be segmented into a region of interest such as foreground and a region of less interest such as background. In other embodiments, an object of interest may be segmented from the rest of the depiction in a case of a video game or graphics processing workload. Each of the segmented portions of a frame may themselves make up a separate surface which is sent separately from the render engine to the display engine of a graphics processing unit. In one embodiment, the display engine combines the two surfaces and sends them over a display link to a display panel. The display controller in the display panel displays the combined frame. The combined frame is stored in a buffer and refreshed periodically.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventor: Joydeep Ray
  • Patent number: 11201611
    Abstract: An input/output (I/O) circuit provides a direct current (DC) bias between I/O stages to control duty cycle of the I/O. The I/O circuit can include one or more predriver stages and one or more output stages. The predriver stages can collectively be referred to as a predriver stage, and the output stages can collectively be referred to an output stage. The output stage for a transmitter drives the signal line. The output stage for an input buffer provides a receive signal for processing by the receiver. The I/O circuit includes a control circuit to control the DC bias between the stages to provide trim adjustment of a duty cycle for the output stage.
    Type: Grant
    Filed: December 12, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Guan Wang, Qiang Tang, Agatino Massimo Maccarrone
  • Patent number: 11200186
    Abstract: Systems, methods, and apparatuses relating to operations in a configurable spatial accelerator are described. In one embodiment, a configurable spatial accelerator includes a first processing element that includes a configuration register within the first processing element to store a configuration value that causes the first processing element to perform an operation according to the configuration value, a plurality of input queues, an input controller to control enqueue and dequeue of values into the plurality of input queues according to the configuration value, a plurality of output queues, and an output controller to control enqueue and dequeue of values into the plurality of output queues according to the configuration value.
    Type: Grant
    Filed: June 30, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Kermin E. Fleming, Jr., Simon C. Steely, Jr., Kent D. Glossop, Mitchell Diamond, Benjamin Keen, Dennis Bradford, Fabrizio Petrini, Barry Tannenbaum, Yongzhi Zhang
  • Patent number: 11201420
    Abstract: Herein described are apparatuses and systems for facilitating alignment of computer component connectors. A package protector may include a body to at least partially surround an integrated circuit package of a circuit card when the package protector is mounted to the circuit card. The package protector may further include a guide pin component that extends from a side of the body, wherein the guide pin component is to be located adjacent to a header of the circuit card when the package protector is mounted to the circuit card, wherein a connector uses the guide pin component to align with the header via a guide pin.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Jun Lu, Wei Liao, Guangying Zhang, Liguang Du, Guoliang Ying, Fangbo Zhu, Song Kok Hang, Juan A. Orozco Ramirez, Wesley B. Morgan
  • Patent number: 11200104
    Abstract: Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Matthew J. Adiletta, Myles Wilde, Aaron Gorius, Michael T. Crocker, Paul H. Dormitzer, Mark A. Schmisseur
  • Patent number: 11200054
    Abstract: Apparatus and associated methods for implementing atomic instructions for copy-XOR of data. An atomic-copy-xor instruction is defined having a first operand comprising an address of a first cacheline and a second operand comprising an address of a second cacheline. The atomic-copy-xor instruction, which may be included in an instruction set architecture (ISA) of a processor, performs a bitwise XOR operation on copies of data retrieved from the first cacheline and second cacheline to generate an XOR result, and replaces the data in the first cacheline with a copy of data from the second cacheline when the XOR result is non-zero.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventor: Vinodh Gopal
  • Patent number: 11201940
    Abstract: Technologies for flow rule aware exact match cache compression include multiple computing devices in communication over a network. A computing device reads a network packet from a network port and extracts one or more key fields from the packet to generate a lookup key. The key fields are identified by a key field specification of an exact match flow cache. The computing device may dynamically configure the key field specification based on an active flow rule set. The computing device may compress the key field specification to match a union of non-wildcard fields of the active flow rule set. The computing device may expand the key field specification in response to insertion of a new flow rule. The computing device looks up the lookup key in the exact match flow cache and, if a match is found, applies the corresponding action. Other embodiments are described and claimed.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Yipeng Wang, Ren Wang, Antonio Fischetti, Sameh Gobriel, Tsung-Yuan C. Tai
  • Patent number: 11201129
    Abstract: Methods, techniques, and structures relating to die packaging. In one exemplary implementation, a die package interconnect structure includes a semiconductor substrate and a first conducting layer in contact with the semiconductor substrate. The first conducting layer may include a base layer metal. The base layer metal may include Cu. The exemplary implementation may also include a diffusion barrier in contact with the first conducting layer and a wetting layer on top of the diffusion barrier. A bump layer may reside on top of the wetting layer, in which the bump layer may include Sn, and Sn may be electroplated. The diffusion barrier may be electroless and may be adapted to prevent Cu and Sn from diffusing through the diffusion barrier. Furthermore, the diffusion barrier may be further adapted to suppress a whisker-type formation in the bump layer.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Valery M. Dubin, Sridhar Balakrishnan, Mark Bohr
  • Patent number: 11201128
    Abstract: A packaged semiconductor die with a bumpless die-package interface and methods of fabrication are described. For example, a semiconductor package includes a substrate having a land side with a lowermost layer of conductive vias. A semiconductor die is embedded in the substrate and has an uppermost layer of conductive lines, one of which is coupled directly to a conductive via of the lowermost layer of conductive vias of the substrate. In another example, a semiconductor package includes a substrate having a land side with a lowermost layer of conductive vias. A semiconductor die is embedded in the substrate and has an uppermost layer of conductive lines with a layer of conductive vias disposed thereon. At least one of the conductive lines is coupled directly to a conductive via of the semiconductor die which is coupled directly to a conductive via of the lowermost layer of conductive vias of the substrate.
    Type: Grant
    Filed: December 23, 2015
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Pramod Malatkar, Weng Hong Teh, John S. Guzek, Robert L. Sankman
  • Patent number: 11199586
    Abstract: A Joint Test Access Group (JTAG) device can include a Joint Test Access Group (JTAG) port, transport layer circuitry to provide a communication to and from a debug device, and packet interpreter circuitry communicatively coupled between the JTAG port and the transport layer circuitry, the packet interpreter circuitry to translate data in a packet from the debug device into a sequence of bits to be provided to the JTAG port.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Enrico D. Carrieri, John W. Kitterman, Keith A. Jones
  • Patent number: 11200722
    Abstract: Systems and methods for super sampling and viewport shifting of non-real time 3D applications are disclosed. In one embodiment, a graphics processing unit includes a processing resource to execute graphics commands to provide graphics for an application, a capture tool to capture the graphics commands, and a data generator to generate a dataset including at least one frame based on the captured graphics commands and to modify viewport settings for each frame of interest to generate a conditioned dataset.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Joanna Douglas, Michal Taryma, Mario Garcia, Carlos Dominguez
  • Patent number: 11199895
    Abstract: In one embodiment, a method receives data regarding processing of a workload by a processor. The data is input into a prediction engine configured to classify the data into a plurality of workload classifications. Each workload classification describes different temporal behavior of the workload. Then, the method outputs a prediction for at least one of the plurality of workload classifications, wherein the prediction is used to control performance of the processor in an upcoming period of time.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Patrick Kam-shing Leung, James Hermerding, II, Muhammad Abozaed, Gilad Olswang, Moran Peri, Ido Karavany, William Freelove, Sudheer Nair, Tahi Hollander, Avishai Wagner
  • Patent number: 11200210
    Abstract: Examples include techniques for backing up a file to long term “cold” storage by using circuitry, and logic for execution by the circuitry, to receive a request to back up the file in a distributed file system to cold storage, to copy the file from at least one data node of the distributed file system to cold storage, to set a location of the file in cold storage in a name node of the distributed file system, and to set a length of the file to zero in the name node.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: December 14, 2021
    Assignee: INTEL CORPORATION
    Inventors: Malini K. Bhandaru, Uma Maheswara Rao Gangumalla, Niraj Rai, Rakesh Radhakrishnan Potty, Kai Zheng, Yi Chen, Qiyuan Gong, Varsha Parthasarathy, Vinod Sharma, Nofil Fawad, Wei Zhou
  • Patent number: 11200721
    Abstract: An apparatus and method for efficient image reprojection in a virtual reality system. For example, one embodiment of an apparatus comprises: a sensor interface to collect motion data from one or more sensors during a virtual reality session; graphics circuitry to execute graphics program code to render an image frame during the virtual reality session; a processor to generate motion transform data using the motion data, the motion transform data specifying how the image frame is to be adjusted prior to display; a reprojection engine to perform an in-line reprojection of the frame using the motion transform data to generate a reprojected image frame; and display circuitry to display the reprojected frame.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: December 14, 2021
    Assignee: INTEL CORPORATION
    Inventors: Kyle Anderson, Wesley J. Holland
  • Patent number: 11200183
    Abstract: Implementations of the disclosure provide processing device comprising: an interrupt managing circuit to receive an interrupt message directed to an application container from an assignable interface (AI) of an input/output (I/O) device. The interrupt message comprises an address space identifier (ASID), an interrupt handle and a flag to distinguish the interrupt message from a direct memory access (DMA) message. Responsive to receiving the interrupt message, a data structure associated with the interrupt managing circuit is identified. An interrupt entry from the data structure is selected based on the interrupt handle. It is determined that the ASID associated with the interrupt message matches an ASID in the interrupt entry. Thereupon, an interrupt in the interrupt entry is forwarded to the application container.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Sanjay Kumar, Rajesh M. Sankaran, Philip R. Lantz, Utkarsh Y. Kakaiya, Kun Tian
  • Patent number: 11199421
    Abstract: Technologies for determining a user's location include a mobile computing device to determine, based on sensed inertial characteristics of the device, a walking gait of a user. The walking gait is one of a first gait indicative of the user holding the g device to the user's side or a second gait indicative of the user swinging the device along the user's side. The device further detects that the user has taken a physical step based on the inertial characteristics and the determined walking gait of the user, and determines a raw directional heading of the device indicative of a direction of the physical step. The device determines an estimated location of the user based on the determined raw directional heading, an estimated step length, and the user's previous location.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Ke Han, Xun Wang, Xiaodong Cai, Liang Li
  • Patent number: 11200055
    Abstract: Embodiments detailed herein relate to matrix operations. In particular, support for matrix (tile) addition, subtraction, and multiplication is described. For example, circuitry to support instructions for element-by-element matrix (tile) addition, subtraction, and multiplication are detailed. In some embodiments, for matrix (tile) addition, decode circuitry is to decode an instruction having fields for an opcode, a first source matrix operand identifier, a second source matrix operand identifier, and a destination matrix operand identifier; and execution circuitry is to execute the decoded instruction to, for each data element position of the identified first source matrix operand: add a first data value at that data element position to a second data value at a corresponding data element position of the identified second source matrix operand, and store a result of the addition into a corresponding data element position of the identified destination matrix operand.
    Type: Grant
    Filed: July 1, 2017
    Date of Patent: December 14, 2021
    Assignee: Intel Corporation
    Inventors: Robert Valentine, Dan Baum, Zeev Sperber, Jesus Corbal, Elmoustapha Ould-Ahmed-Vall, Bret L. Toll, Mark J. Charney, Barukh Ziv, Alexander Heinecke, Milind Girkar, Simon Rubanovich