Intel Patents Granted

Patents granted to Intel by the U.S. Patent and Trademark Office (USPTO).

  • Patent number: 12253724
    Abstract: Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, a compute die over the package substrate, and an optics die over the package substrate. In an embodiment, the optics die comprises grating couplers. In an embodiment, an optical connector for optically coupling optical fibers to the grating couplers is provided. In an embodiment, the optical connector comprises a fiber array unit (FAU), where the FAU has a turn. In an embodiment, the optical connector further comprises a fiber shuffler, where the fiber shuffler comprises a first V-groove with a first depth and a second V-groove with a second depth that is greater than the first depth. In an embodiment, the optical connector further comprises a ferrule.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventor: Asako Toda
  • Patent number: 12254526
    Abstract: Apparatuses including general-purpose graphics processing units having on chip dense memory for temporal buffering are disclosed. In one embodiment, a graphics multiprocessor includes a plurality of compute engines to perform first computations to generate a first set of data, cache for storing data, and a high density memory that is integrated on chip with the plurality of compute engines and the cache. The high density memory to receive the first set of data, to temporarily store the first set of data, and to provide the first set of data to the cache during a first time period that is prior to a second time period when the plurality of compute engines will use the first set of data for second computations.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Varghese George, Altug Koker, Aravindh Anantaraman, Subramaniam Maiyuran, SungYe Kim, Valentin Andrei, Elmoustapha Ould-Ahmed-Vall, Joydeep Ray, Abhishek R. Appu, Nicolas C. Galoppo von Borries, Prasoonkumar Surti, Mike Macpherson
  • Patent number: 12254337
    Abstract: Techniques for expanded trusted domains are disclosed. In the illustrative embodiment, a trusted domain can be established that includes hardware components from a processor as well as an off-load device. The off-load device may provide compute resources for the trusted domain. The trusted domain can be expanded and contracted on-demand, allowing for a flexible approach to creating and using trusted domains.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Karthik Kumar, Ravi L. Sahita, Marcos E. Carranza
  • Patent number: 12253877
    Abstract: In an embodiment, a processor may include a mesh network and a clock regulation circuit. The mesh network may include multiple mesh stops to operate based on a mesh clock signal. Each mesh stop may include a bandwidth counter to transmit a bandwidth count in response to a pulse of a synchronization signal. The clock regulation circuit may be to: receive a plurality of bandwidth counts from the plurality of mesh stops; aggregate the plurality of bandwidth counts to obtain an aggregated bandwidth value; determine a cycle stealing value based at least on a comparison of the aggregated bandwidth value to at least one threshold value; and gate the mesh clock signal based on the determined cycle stealing value. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Robin Gupta, Madhusudan Chidambaram
  • Patent number: 12255897
    Abstract: Systems and methods may provide for receiving web content and determining a trust level associated with the web content. Additionally, the web content may be mapped to an execution environment based at least in part on the trust level. In one example, the web content is stored to a trust level specific data container.
    Type: Grant
    Filed: September 29, 2023
    Date of Patent: March 18, 2025
    Assignee: INTEL CORPORATION
    Inventors: Hong C. Li, John B. Vicente, Prashant Dewan
  • Patent number: 12256218
    Abstract: An apparatus and system to provide separate network slices for security events are described. A dedicated secure network slice is provided for PDP data from a UE. The network slice is used for detecting security issues and sending security-related information to clients. The communications in the dedicated network slice are associated with a special PDP context used by the UE to interface with the network slice. Once the UE has detected a security issue or has been notified of the security issue on the network or remote servers, the UE uses a special PDP service, and is able to stop uplink/downlink channels, close running applications and enter into a safe mode, cut off connections to the networks, and try to determine alternate available connectivity.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Amar Srivastava, Christian Maciocco, Kshitij Arun Doshi
  • Patent number: 12255921
    Abstract: Methods, apparatus, and software for efficient encryption in virtual private network (VPN) sessions. A VPN link and an auxiliary link (and associated sessions) are established between computing platforms to support end-to-end communication between respective application running on the platforms. The VPN link may employ a conventional VPN protocol such as TLS or IPsec, while the auxiliary link comprises a NULL encryption VPN tunnel. To transfer data, a determination is made to whether the data are encrypted or non-encrypted. Encrypted data are transferred over the auxiliary link to avoid re-encryption of the data. Non-encrypted are transferred over the VPN link. TLS and IPsec VPN agents may be used to assist in setting up the VPN and auxiliary sessions. The techniques avoid double encryption of VPN traffic, while ensuring that various types of traffic transferred between platforms is encrypted.
    Type: Grant
    Filed: June 16, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Akhilesh S. Thyagaturu, Vinodh Gopal
  • Patent number: 12256487
    Abstract: The present disclosure is directed to a hybrid dielectric interconnect stack for a printed circuit board having a first dielectric layer with a first dielectric constant and a first dielectric loss tangent positioned over an intermediate layer, which includes a first dielectric sublayer with a first sublayer dielectric constant and a first sublayer dielectric loss tangent, an embedded conductive layer, and a second dielectric sublayer with a second sublayer dielectric constant and a second sublayer dielectric loss tangent, in which the embedded conductive layer is positioned between the first and second dielectric sublayers, and a second dielectric layer with a second dielectric constant and a second dielectric loss tangent, in which the intermediate layer is positioned between the first and second dielectric layers.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Jackson Chung Peng Kong, Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Chin Lee Kuan, Tin Poay Chuah
  • Patent number: 12253722
    Abstract: An optical package comprising an optical die that is electrically coupled to a package substrate, and an optical interconnect adjacent the optical die. The optical interconnect comprises a first polarizing filter adjacent to a first lens, a second polarizing filter adjacent to a second lens; and a film comprising a magnetic material between the first polarizing filter and the second polarizing filter. The second polarizing filter is rotated with respect to the first polarizing filter and the magnetic material is to rotate a polarization vector of light incoming to the optical interconnect. An optical fiber interface port is immediately adjacent to the first lens. The second lens is immediately adjacent to an optical interface of the optical die.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Hiroki Tanaka, Kristof Darmawikarta, Brandon Marin, Robert May, Sri Ranga Sai Boyapati
  • Patent number: 12255147
    Abstract: An electronic substrate may be fabricated having at least two glass layers separated by an etch stop layer, wherein a bridge is embedded within one of the glass layers. The depth of a cavity formed for embedding the bridge is control by the thickness of the glass layer rather than by controlling the etching process used to form the cavity, which allows for greater precision in the fabrication of the electronic substrate. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate, such that the bridge provides device-to-device interconnection between the at least two integrated circuit devices. In a further embodiment, the integrated circuit package may be electrically attached to an electronic board.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: March 18, 2025
    Assignee: Intel Corporation
    Inventors: Jeremy Ecton, Brandon Marin, Srinivas Pietambaram, Suddhasattwa Nad
  • Patent number: 12248174
    Abstract: A photonic integrated circuit including a semiconductor substrate having integrate a semiconductor light source configured to emit coherent light of at least the first wavelength and the second wavelength, the semiconductor light source having a first factor; a waveguide structure optically coupled to the semiconductor light source, the waveguide structure having a second Q factor that is higher than the first Q factor, the waveguide structure configured to form an optical cavity for at least the light of the first wavelength and the second wavelength; an optical output structure configured to optically couple the waveguide structure with a plurality of optical channels to transmit light of the first wavelength and the second wavelength from the waveguide structure to the plurality of optical channels.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: William Hayenga, George Rakuljic, Eduardo Temprana Giraldo
  • Patent number: 12248783
    Abstract: Methods for frequency scaling for per-core accelerator assignments and associated apparatus. A processor includes a CPU (central processing unit) having multiple cores that can be selectively configured to support frequency scaling and instruction extensions. Under this approach, some cores can be configured to support a selective set of AVX instructions (such as AVX3/5G-ISA instructions) and/or AMX instructions, while other cores are configured to not support these AVX/AMX instructions. In one aspect, the selective AVX/AMX instructions are implemented in one or more ISA extension units that are separate from the main processor core (or otherwise comprises a separate block of circuitry in a processor core) that can be selectively enabled or disabled. This enables cores having the separate unit(s) disabled to consume less power and/or operate at higher frequencies, while supporting the selective AVX/AMX instructions using other cores.
    Type: Grant
    Filed: September 15, 2023
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Stephen T. Palermo, Srihari Makineni, Shubha Bommalingaiahnapallya, Neelam Chandwani, Rany T. Elsayed, Udayan Mukherjee, Lokpraveen Mosur, Adwait Purandare
  • Patent number: 12248808
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to relocate a compute thread, the apparatus comprising control circuitry to maintain a location of a plurality of domain access counters associated with a plurality of compute-memory domains for a first compute thread, and an execution monitor to set a first domain access counter of the plurality of domain access counters, the first domain access counter associated with a first compute-memory domain of the compute-memory domains, and relocate the first compute thread to a second compute-memory domain of the compute-memory domains in response to a comparison between a second domain access counter associated with the second compute-memory domain and the first domain access counter.
    Type: Grant
    Filed: June 26, 2021
    Date of Patent: March 11, 2025
    Assignee: INTEL CORPORATION
    Inventors: Rolf Riesen, Robert Wisniewski, Rajesh Poornachandran
  • Patent number: 12248570
    Abstract: The present disclosure is directed to systems and methods for detecting side-channel exploit attacks such as Spectre and Meltdown. Performance monitoring circuitry includes first counter circuitry to monitor CPU cache misses and second counter circuitry to monitor DTLB load misses. Upon detecting an excessive number of cache misses and/or load misses, the performance monitoring circuitry transfers the first and second counter circuitry data to control circuitry. The control circuitry determines a CPU cache miss to DTLB load miss ratio for each of a plurality of temporal intervals. The control circuitry the identifies, determines, and/or detects a pattern or trend in the CPU cache miss to DTLB load miss ratio. Upon detecting a deviation from the identified CPU cache miss to DTLB load miss ratio pattern or trend indicative of a potential side-channel exploit attack, the control circuitry generates an output to alert a system user or system administrator.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Paul Carlson, Rahuldeva Ghosh, Baiju Patel, Zhong Chen
  • Patent number: 12248696
    Abstract: Example compute-in-memory (CIM) or processor-in-memory (PIM) techniques using repurposed or dedicated static random access memory (SRAM) rows of an SRAM sub-array to store look-up-table (LUT) entries for use in a multiply and accumulate (MAC) operation.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Saurabh Jain, Srivatsa Rangachar Srinivasa, Akshay Krishna Ramanathan, Gurpreet Singh Kalsi, Kamlesh R. Pillai, Sreenivas Subramoney
  • Patent number: 12248556
    Abstract: An apparatus to facilitate an authenticator-integrated generative adversarial network (GAN) for secure deepfake generation is disclosed.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 11, 2025
    Assignee: INTEL CORPORATION
    Inventors: Ilke Demir, Carl S. Marshall, Satyam Srivastava, Steven Gans
  • Patent number: 12250592
    Abstract: Logic to generate an extremely high throughput (EHT) physical layer protocol data unit (PPDU) comprising a medium access control (MAC) management frame. the MAC management frame comprising a QoS management field. the QoS management field comprising at least one bit value to indicate quality of service (QoS) management capability associated with links associated with more than one frequency bands. Logic to cause the transmission of the EHT PPDU. And logic to receive and decode the EHT PPDU.
    Type: Grant
    Filed: June 26, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Laurent Cariou, Dave Cavalcanti, Dibakar Das, Chittabrata Ghosh, Ganesh Venkatesan
  • Patent number: 12249577
    Abstract: An integrated circuit structure includes a first interconnect level including a first dielectric between a pair of interconnect structures, a second interconnect level above the first interconnect level. The second interconnect level includes a cap structure including a second dielectric on the first dielectric, the cap structure includes a top surface and a sidewall surface and a liner comprising a third dielectric on the top surface and on the sidewall surface.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Shashi Vyas, Sudipto Naskar, Charles Wallace
  • Patent number: 12249541
    Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such semiconductor devices. In an embodiment, a method of fabricating a semiconductor device comprises, forming a first grating of parallel first lines, forming a second grating of parallel second lines, wherein the second lines are substantially orthogonal to the first lines, and wherein the first lines and second lines define a plurality of first openings, disposing a conformal mask layer over the first lines and the second lines, wherein the conformal mask layer partially fills the first openings and defines a second opening within each of the first openings, disposing a hardmask over the conformal mask layer, wherein the hardmask fills the second openings, patterning third openings into the hardmask, wherein the third openings clear the hardmask from at least one of the second openings, and removing the mask layer proximate to cleared second openings to clear first openings.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Leonard P. Guler, Chul-Hyun Lim, Paul A. Nyhus, Elliot N. Tan, Charles H. Wallace
  • Patent number: 12248333
    Abstract: Techniques are disclosed for the use of local buffers integrated into the execution units of a vector processor architecture. The use of local buffers results in less communication across the interconnection network implemented by vector processors, and increases interconnection network bandwidth, increases the speed of computations, and decreases power usage.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventor: Joseph Williams
  • Patent number: 12249553
    Abstract: Present disclosure relates to IC packages with integrated thermal contacts. In some embodiments, an IC package includes a package substrate, an IC die that is coupled to the package substrate, and at least one thermal contact for coupling to at least a portion of a heat exchanger, where the thermal contact is limited to being in a region located at a periphery of the IC package. In some embodiments, thermal contacts are such that at least a portion of a heat exchanger is to be attached on the side of the IC package. In some embodiments, thermal contacts may be provided within a recessed portion at the periphery of the IC package. Providing a thermal contact at a periphery of an IC package may enable improved cooling options, especially for systems where there is no or limited space for providing conventional heat exchangers on the top of the package.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Sonja Koller, Vishnu Prasad, Georg Seidemann
  • Patent number: 12248848
    Abstract: Quantum circuit assemblies that employ active pulse shaping in order to be able to control states of a plurality of qubits with signal pulses propagated over a shared signal propagation channel are disclosed. An example quantum circuit assembly includes a quantum circuit component that includes a first qubit, associated with a first frequency to control the state of the first qubit, and a second qubit, associated with a second frequency to control the state of the second qubit. A shared transmission channel is coupled to the first and second qubits. The assembly further includes a signal pulse generation circuit, configured to generate a signal pulse to be propagated over the shared transmission channel to control the state of the first qubit, where the signal pulse has a center frequency at the first frequency, a bandwidth that includes the second frequency, and a notch at the second frequency.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Sushil Subramanian, Stefano Pellerano, Ravi Pillarisetty, Jong Seok Park, Todor M. Mladenov
  • Patent number: 12249793
    Abstract: Disclosed embodiments include a modified M.2 interface that is configured to allow an increased current capacity on power-carrying pins. The power-carrying pins are implemented using an alloy that can sustain current levels in excess of those specified in the M.2 standard while remaining within M.2 standard specified temperature limits. Sockets and corresponding cards in embodiments are modified so that a card requiring the higher current capacity cannot fit into a legacy M.2 standard socket, while a legacy M.2 card can fit into a modified high current M.2 socket. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Richard Perry, Robert Schum, Mythili Hegde
  • Patent number: 12248785
    Abstract: A processor includes a binary translator an a decoder. The binary translator includes logic to analyze a stream of atomic instructions, identify words by boundary bits in the atomic instructions, generate a mask to identify the words, and load the mask and the plurality of words into an instruction cache line. The words include atomic instructions. At least one word includes more than one atomic instruction. The decoder includes logic to apply the mask to identify a first word from the instruction cache line and decode the first word based upon the applied mask.
    Type: Grant
    Filed: October 3, 2020
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Polychronis Xekalakis, Sumit Ahuja
  • Patent number: 12249997
    Abstract: An apparatus and method are provided to re-configure an existing low-jitter phase locked loop (PLL) circuit for fast start-up during system wake-up. During system start-up, a feed-back path of the PLL is disconnected to independently control the VCO frequency. This independently controlled VCO then injects energy into a resonator (e.g., a crustal oscillator) for its fast start-up. Once a resonance frequency of the resonator is detected and an oscillation builds up in the resonator, a VCO control voltage is stored. The PLL feedback is then restored and the stored VCO control voltage is applied to perform phase-locking operation. Since the PLL control voltage is already set to the desired operating point, the PLL lock time is very small.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Somnath Kundu, Hao Luo, Brent Carlton
  • Patent number: 12250800
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a radiation shield that includes a zipper. The radiation shield can include a wall that extends from a support structure of the electronic device, a first portion that is coupled to a cold plate over a radiation source, a second portion that is coupled to the wall, and a zipper that can zip the first portion to the second portion together and can unzip to separate the first portion from the second portion.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Yew San Lim, Jeff Ku, Boon Ping Koh, Min Suet Lim, Tin Poay Chuah
  • Patent number: 12250163
    Abstract: In one embodiment, a network interface controller (NIC) includes multiple packet transmission queues to queue data packets for transmission. The data packets are assigned to multiple traffic classes. The NIC also includes multiple input/output (I/O) interfaces for retrieving the data packets from memory. Each I/O interface is assigned to a subset of the traffic classes. The NIC also includes scheduler circuitry to select a first data packet to be retrieved from memory, and direct memory access (DMA) engine circuitry to retrieve the first data packet from memory via one of the I/O interfaces based on the traffic class of the first data packet, and store the first data packet in one of the packet transmission queues. The NIC also includes a transmission interface to transmit the first data packet over a network at a corresponding launch time indicated by the scheduler circuitry.
    Type: Grant
    Filed: September 26, 2020
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventor: Kishore Kasichainula
  • Patent number: 12248344
    Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Kristin L. Weldon, David Rodriguez, Jin Yang, David Shia, Jimmy Chuang, Mohanraj Prabhugoud, Mark Edmund Sprenger
  • Patent number: 12250233
    Abstract: Techniques include a method, apparatus, system and computer-readable medium to detect, quantify and localize attacks to enhance security for time-synchronized networking. Embodiments include a diagnostic stream producer to produce diagnostic information providing evidence of a timing attack on a node of a time-synchronized network. Embodiments include a diagnostic stream consumer to consume diagnostic information, analyze the diagnostic information, and determine whether a node is under a timing attack. Other embodiments are described and claimed.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Marcio Juliato, Javier Perez-Ramirez, Manoj Sastry, Dave Cavalcanti, Christopher Gutierrez, Vuk Lesi, Shabbir Ahmed
  • Patent number: 12248356
    Abstract: Examples include techniques to reduce memory power consumption during a system idle state. Cores of a single socket multi-core processor may be mapped to different virtual non-uniform memory architecture (NUMA) nodes and a dynamic random access memory (DRAM) may be partitioned into multiple segments that are capable of having self-refresh operations separately deactivated or activated. Different segments from among the multiple segments of DRAM may be mapped to the virtual NUMA nodes to allow for a mechanism to cause memory requests for pinned or locked pages of data to be directed to a given virtual NUMA node.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Virendra Vikramsinh Adsure, Chia-Hung S. Kuo, Robert J. Royer, Jr., Deepak Gandiga Shivakumar
  • Patent number: 12248304
    Abstract: A data verifier, comprising: a first processing circuitry, configured to perform a first safety operation, the first safety operation comprising: determining whether first sensor data representing a second processing circuitry factor satisfy a first verification criterion; and if first verification criterion is satisfied, execute a first safety measure; and if the first verification criterion is not satisfied, execute a second safety measure; a second processing circuitry, configured to perform a second safety operation, the second safety operation comprising: determining whether a first value, generated by a third processing logic from sensor data satisfy a second verification criterion; and if the second verification criterion is satisfied, execute a third safety measure; and if the second verification criterion is not satisfied, execute a fourth safety measure.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: March 11, 2025
    Assignee: INTEL CORPORATION
    Inventors: Darshan Raj, Ralf Sengle
  • Patent number: 12248852
    Abstract: Various systems and methods implement a decision architecture for autonomous systems. An autonomous system framework includes a safety ring configured to interface with safety features of an autonomous system; a security ring configured to provide authentication and verification services to transactions passed through the security ring; a privacy ring configured to ensure privacy of a user of the autonomous system; a trustworthiness ring configured to log and provide transparency of transactions passed through the trustworthiness ring; and a well-being ring configured to interface with the user and provide feedback and information to the user on a state of the autonomous system, wherein: each of the safety, security, privacy, trustworthiness, and well-being rings include at least one interface to at least one other of the safety, security, privacy, trustworthiness, and well-being rings.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Helen Adrienne Frances Gould, Ignacio Javier Alvarez Martinez, David W. Browning
  • Patent number: 12250617
    Abstract: Approaches for Multi-Access Edge Computing (MEC) Vehicle-to-Everything (V2X), Vehicle-To-Vehicle (V2V), and Autonomous Vehicles Distributed Networks (AVDN) functions in a MEC infrastructure are discussed. In various examples, operations and network configurations are described that use a service in an AVDN, including: identifying a service condition (e.g., based on a state of a service and connectivity to an instance of the service); establishing a connection in the AVDN in response to the service condition (e.g., using vehicle-to-vehicle (V2V) or Vehicle-to-Everything (V2X) network communications to the AVDN); and performing a service operation with the service via the AVDN.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Anish Rawat, Dario Sabella
  • Patent number: 12248800
    Abstract: Embodiments of apparatuses, methods, and systems for virtualization of interprocessor interrupts are disclosed. In an embodiment, an apparatus includes a plurality of processor cores; an interrupt controller register; and logic to, in response to a write from a virtual machine to the interrupt controller register, record an interprocessor interrupt in a first data structure configured by a virtual machine monitor and send a notification of the interprocessor interrupt to at least one of the plurality of processor cores.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Gilbert Neiger, Rajesh Sankaran, Hisham Shafi
  • Patent number: 12248561
    Abstract: Apparatus and method for role-based register protection. For example, one embodiment of an apparatus comprises: one or more processor cores to execute instructions and process data, the one or more processor cores to execute one or more security instructions to protect a virtual machine or trusted application from a virtual machine monitor (VMM) or operating system (OS); an interconnect fabric to couple the one or more processor cores to a device; and security hardware logic to determine whether to allow a read or write transaction directed to a protected register to proceed over the interconnect fabric, the security hardware logic to evaluate one or more security attributes associated with an initiator of the transaction to make the determination.
    Type: Grant
    Filed: September 25, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Vedvyas Shanbhogue, Ravi Sahita, Utkarsh Y KAKAIYA, Abhishek Basak, Lee Albion, Filip Schmole, Rupin Vakharwala, Vinit M Abraham, Raghunandan Makaram
  • Patent number: 12250636
    Abstract: A battery-powered device includes a baseband modem, configured to receive or send data according to a first operational mode, wherein the data correspond to a software application being executed on the battery-powered device; and a processor, configured to determine a resource requirement of the software application; and send a signal representing the determined resource requirement to the baseband modem; wherein the baseband modem is further configured to change from the first operational mode to a second operational mode based on the signal.
    Type: Grant
    Filed: November 8, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Shailendra Singh Chauhan, Santhosh Ap, Arunthathi Chandrabose, Mythili Hegde
  • Patent number: 12248807
    Abstract: Techniques for migration of a source protected virtual machine from a source platform to a destination platform are descried. A method of an aspect includes enforcing that bundles of state, of a first protected virtual machine (VM), received at a second platform over a stream, during an in-order phase of a migration of the first protected VM from a first platform to the second platform, are imported to a second protected VM of the second platform, in a same order that they were exported from the first protected VM. Receiving a marker over the stream marking an end of the in-order phase. Determining that all bundles of state exported from the first protected VM prior to export of the marker have been imported to the second protected VM. Starting an out-of-order phase of the migration based on the determination that said all bundles of the state exported have been imported.
    Type: Grant
    Filed: December 26, 2020
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Ravi Sahita, Dror Caspi, Vincent Scarlata, Sharon Yaniv, Baruch Chaikin, Vedvyas Shanbhogue, Jun Nakajima, Arumugam Thiyagarajah, Sean Christopherson, Haidong Xia, Vinay Awasthi, Isaku Yamahata, Wei Wang, Thomas Adelmeyer
  • Patent number: 12249372
    Abstract: A state may be encoded into a memory cell comprising a phase change material (PM) region and a select device (SD) region by: applying a first current in the memory cell over a first time period, wherein the first current applied over the first time period causes the PM region of the memory cell to be placed into an amorphous state and the SD region of the memory cell to be placed into an amorphous state; and applying a second current in the memory cell over a second time period after the first time period, wherein the second current applied over the third time period causes the SD region of the memory cell to be placed into a crystalline state and the PM region of the memory cell to remain in the amorphous state.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Rouhollah Mousavi Iraei, Kiran Pangal, Saad P. Monasa, Mini Goel, Raymond Zeng, Hemant P. Rao
  • Patent number: 12249297
    Abstract: Methods and systems for dynamically adjusting the power consumption of an organic light-emitting diode (OLED) panel are disclosed. In embodiments, a histogram of a frame to be displayed is generated, and a weighted dimming curve is generated, with heavier weighting given to mid-tone intensity pixels. High and low intensity pixels are left only minimally adjusted. The curve is then capped and smoothed to prevent artifacts and to preserve image contrast. Each pixel in the frame is then dimmed according to the curve, and the resultant transformed frame is displayed on the OLED panel.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Soorya Ramesh, Priyanka Karwa, Susanta Bhattacharjee, Geethacharan Rajagopalan, Arvind S. Tomar
  • Patent number: 12249004
    Abstract: Apparatus and method for migrating a container including graphics processor state.
    Type: Grant
    Filed: December 18, 2023
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Zhenyu Z Wang, Xinda Zhao, Owen Zhang
  • Patent number: 12249584
    Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a first die in a first dielectric layer; a magnetic core inductor, having a first surface and an opposing second surface, in the first dielectric layer, including a first conductive pillar, having a first end at the first surface of the magnetic core inductor and an opposing second end at the second surface, at least partially surrounded by a magnetic material that extends at least partially along a thickness of the first conductive pillar from the second end and tapers towards the first end; and a second conductive pillar coupled to the first conductive pillar; and a second die in a second dielectric layer on the first dielectric layer coupled to the second surface of the magnetic core inductor.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Kristof Kuwawi Darmawikarta, Benjamin T. Duong, Srinivas V. Pietambaram, Tarek A. Ibrahim
  • Patent number: 12249622
    Abstract: Embodiments disclosed herein include nanowire and nanoribbon devices with non-uniform dielectric thicknesses. In an embodiment, the semiconductor device comprises a substrate and a plurality of first semiconductor layers in a vertical stack over the substrate. The first semiconductor layers may have a first spacing. In an embodiment, a first dielectric surrounds each of the first semiconductor layers, and the first dielectric has a first thickness. The semiconductor device may further comprise a plurality of second semiconductor layers in a vertical stack over the substrate, where the second semiconductor layers have a second spacing that is greater than the first spacing. In an embodiment a second dielectric surrounds each of the second semiconductor layers, and the second dielectric has a second thickness that is greater than the first thickness.
    Type: Grant
    Filed: December 13, 2019
    Date of Patent: March 11, 2025
    Assignee: Intel Corporation
    Inventors: Tanuj Trivedi, Rahul Ramaswamy, Jeong Dong Kim, Ting Chang, Walid M. Hafez, Babak Fallahazad, Hsu-Yu Chang, Nidhi Nidhi
  • Patent number: 12243825
    Abstract: An electronic substrate may be fabricated to include a fine pitch dielectric layer having an upper surface, a coarse pitch dielectric layer on the upper surface of the fine pitch dielectric layer, and at least one hybrid conductive via extending through the fine pitch dielectric layer and the coarse pitch dielectric layer. The hybrid conductive via is fabricated such that a portion thereof that extends through the fine pitch dielectric layer is smaller than a portion extending through the coarse pitch dielectric layer, which results in a stepped configuration, wherein a portion of the hybrid conductive via abuts the upper surface of the fine pitch dielectric layer. In an embodiment of the present description, an integrated circuit package may be formed with the electronic substrate, wherein at least two integrated circuit devices may be attached to the electronic substrate, such that the bridge provides device-to-device interconnection therebetween.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: Srinivas Pietambaram, Rahul Manepalli
  • Patent number: 12243856
    Abstract: Embodiments include semiconductor packages and a method of forming the semiconductor packages. A semiconductor package includes a mold over and around a first die and a first via. The semiconductor package has a conductive pad of a first redistribution layer disposed on a top surface of the first die and/or a top surface of the mold. The semiconductor package includes a second die having a solder ball coupled to a die pad on a bottom surface of the second die, where the solder ball of the second die is coupled to the first redistribution layer. The first redistribution layer couples the second die to the first die, where the second die has a first edge and a second edge, and where the first edge is positioned within a footprint of the first die and the second edge is positioned outside the footprint of the first die.
    Type: Grant
    Filed: June 30, 2023
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: David O'Sullivan, Georg Seidemann, Richard Patten, Bernd Waidhas
  • Patent number: 12243545
    Abstract: A method and system of neural network dynamic noise suppression is provided for audio processing.
    Type: Grant
    Filed: December 24, 2021
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: Adam Kupryjanow, Lukasz Pindor
  • Patent number: 12243875
    Abstract: Embodiments disclosed herein include forksheet transistor devices having a dielectric or a conductive spine. For example, an integrated circuit structure includes a dielectric spine. A first transistor device includes a first vertical stack of semiconductor channels spaced apart from a first edge of the dielectric spine. A second transistor device includes a second vertical stack of semiconductor channels spaced apart from a second edge of the dielectric spine. An N-type gate structure is on the first vertical stack of semiconductor channels, a portion of the N-type gate structure laterally between and in contact with the first edge of the dielectric spine and the first vertical stack of semiconductor channels. A P-type gate structure is on the second vertical stack of semiconductor channels, a portion of the P-type gate structure laterally between and in contact with the second edge of the dielectric spine and the second vertical stack of semiconductor channels.
    Type: Grant
    Filed: January 10, 2024
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: Seung Hoon Sung, Cheng-Ying Huang, Marko Radosavljevic, Christopher M. Neumann, Susmita Ghose, Varun Mishra, Cory Weber, Stephen M. Cea, Tahir Ghani, Jack T. Kavalieros
  • Patent number: 12244507
    Abstract: Systems and techniques for intelligent data forwarding in edge networks are described herein. A request may be received from an edge user device for a service via a first endpoint. A time value may be calculated using a timestamp of the request. Motion characteristics may be determined for the edge user device using the time value. A response to the request may be transmitted to a second endpoint based on the motion characteristics.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: Francesc Guim Bernat, Ned M. Smith, Kshitij Arun Doshi, Suraj Prabhakaran, Timothy Verrall, Kapil Sood, Tarun Viswanathan
  • Patent number: 12244601
    Abstract: A system includes an orchestrator to receive a first request for resources for a workload of a tenant and to select a first node cluster in a first compute domain to be provisioned for the workload. The system also includes a first security manager to run in a trusted execution environment of one or more processors to receive attestation results for a second node cluster from a second security manager in a second compute domain, and to establish the first node cluster and the second node cluster as a trusted group of node clusters for the workload based, at least in part, on determining that a first compute node in the first node cluster meets one or more security requirements of a workload execution policy associated with the workload and that the attestation results indicate that a second compute node in the second node cluster meets the one or more security requirements.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: Anahit Tarkhanyan, Reshma Lal, Jianping Xu, Christine E. Severns-Williams
  • Patent number: 12243496
    Abstract: Often when there is a glare on a display screen the user may be able to mitigate the glare by tilting or otherwise moving the screen or changing their viewing position. However, when driving a car there are limited options for overcoming glares on the dashboard, especially when you are driving for a long distance in the same direction. Embodiments are directed to eliminating such glare. Other embodiments are related to mixed reality (MR) and filling in occluded areas.
    Type: Grant
    Filed: May 24, 2023
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: Arthur J. Runyan, Richmond Hicks, Nausheen Ansari, Narayan Biswal, Ya-Ti Peng, Abhishek R. Appu, Wen-Fu Kao, Sang-Hee Lee, Joydeep Ray, Changliang Wang, Satyanarayana Avadhanam, Scott Janus, Gary Smith, Nilesh V. Shah, Keith W. Rowe, Robert J. Johnston
  • Patent number: 12245523
    Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a substrate and a quantum well stack disposed on the substrate. The quantum well stack may include a quantum well layer and a back gate, and the back gate may be disposed between the quantum well layer and the substrate.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: March 4, 2025
    Assignee: Intel Corporation
    Inventors: Jeanette M. Roberts, Ravi Pillarisetty, David J. Michalak, Zachary R. Yoscovits, James S. Clarke, Van H. Le