Abstract: An apparatus comprising an interface to receive a video signal transmitted by a video source device to a first port of a plurality of ports of a display; and a controller comprising circuitry, the controller to responsive to a detection that the video source device is to enter a standby mode, cause the display to enter a low power state; and upon waking from the low power state, scan the first port of the plurality of ports for a communication from the video source device and quiesce scanning of the remaining one or more ports of the plurality of ports of the display.

Abstract: Integrated circuit metallization lines having a planar top surface but different vertical heights, for example to control intra-layer resistance/capacitance of integrated circuit interconnect. A hardmask material layer may be inserted between two thicknesses of dielectric material that are over a via metallization. Following deposition of the hardmask material layer, trench openings may be patterned through the hardmask layer to define where line metallization will have a greater height. Following the deposition of a thickness of dielectric material over the hardmask material layer, a trench pattern may be etched through the uppermost thickness of dielectric material, exposing the hardmask material layer wherever the trench does not coincide with an opening in the hardmask material layer. The trench etch may be retarded where the hardmask material layer is exposed, resulting to trenches of differing depth. Trenches of differing depth may be filled with metallization and then planarized.

Abstract: Methods and apparatus for hierarchical reinforcement learning (RL) algorithm for network function virtualization (NFV) server power management. A first RL model at a first layer is trained by adjusting a frequency of the core of processor while performing a workload to obtain a first trained RL model. The trained RL model is operated in an inference mode while training a second RL model at a second level in the RL hierarchy by adjusting a frequency of the core and a frequency of processor circuitry external to the core to obtain a second trained RL model. Training may be performed online or offline. The first and second RL models are operated in inference modes during online operations to adjust the frequency of the core and the frequency of the circuitry external to the core while executing software on the plurality of cores of to perform a workload, such as an NFV workload.

Abstract: Gate-all-around integrated circuit structures having depopulated channel structures, and methods of fabricating gate-all-around integrated circuit structures having depopulated channel structures using a bottom-up approach, are described. For example, integrated circuit structure includes a first vertical arrangement of nanowires and a second vertical arrangement of nanowires above a substrate. The first vertical arrangement of nanowires has a greater number of nanowires than the second vertical arrangement of nanowires. The first vertical arrangement of nanowires has an uppermost nanowire co-planar with an uppermost nanowire of the second vertical arrangement of nanowires. The first vertical arrangement of nanowires has a bottommost nanowire below a bottommost nanowire of the second vertical arrangement of nanowires. A first gate stack is over the first vertical arrangement of nanowires. A second gate stack is over the second vertical arrangement of nanowires.

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to generate command lists to be offloaded to accelerator circuitry. An example apparatus includes kernel duration model circuitry to predict a duration of execution of a first kernel based on a first source location, a first name, a first property of a first argument, or an occupancy of the first kernel. The example apparatus includes subsequent kernel model circuitry to predict a tuple and a dependency of a second kernel based on a second source location, a second name, a second property of a second argument, or a time of submission of the previous kernel. The example apparatus includes reinforcement learning model circuitry to determine whether to bundle the first kernel into a command list based on the duration of execution of the first kernel, the tuple of the second kernel, or the dependency of the second kernel.

Abstract: Error correction coding (ECC) mis-corrected reads, if undetected, result in silent data corruption of a non-volatile memory device. Overcoming ECC mis-corrected reads is based on a read signature of a result of reading a page in the non-volatile memory device. An ECC mis-correct logic counts the number of bits in the end-most buckets into which the bits of the result is divided. End-most buckets that are overpopulated or starved reveal a tell-tale read signature of an ECC mis-correct. The ECC mis-correct is likely to occur when the read reference voltage level used to read the page is shifted in one direction or another to an extreme amount that risks reading data from a different page. Detecting ECC mis-corrected reads can be used to overcome the ECC mis-corrects and mitigate silent data corruption.

Abstract: Embodiments may relate to a system to be used in an oscillating neural network (ONN). The system may include a control node and a plurality of nodes wirelessly communicatively coupled with a control node. A node of the plurality of nodes may be configured to identify an oscillation frequency of the node based on a weight W and an input X. The node may further be configured to transmit a wireless signal to the control node, wherein a frequency of the wireless signal oscillates based on the identified oscillation frequency. Other embodiments may be described or claimed.

Abstract: One or more machine readable storage media, an apparatus, and a method. The apparatus provides a mechanism to implement a trusted telemetry governor (TTG) inside a trusted execution environment. The TTG is to determine a security policy to be applied to telemetry data corresponding to component of a computing infrastructure, receive the telemetry data in encrypted format and, based on the security policy: process the telemetry data including at least one of generating transformed telemetry data or analyzing the telemetry data to generate a report therefrom, and generating telemetry information from the telemetry data. The telemetry information includes at least one of processed telemetry data, a report, or a recommendation based on an analysis of the telemetry data. The TTG is to send the telemetry information outside of the trusted execution environment to a consumer of the telemetry data.

Abstract: Methods and apparatuses relating to switching of a shadow stack pointer are described. In one embodiment, a hardware processor includes a hardware decode unit to decode an instruction, and a hardware execution unit to execute the instruction to: pop a token for a thread from a shadow stack, wherein the token includes a shadow stack pointer for the thread with at least one least significant bit (LSB) of the shadow stack pointer overwritten with a bit value of an operating mode of the hardware processor for the thread, remove the bit value in the at least one LSB from the token to generate the shadow stack pointer, and set a current shadow stack pointer to the shadow stack pointer from the token when the operating mode from the token matches a current operating mode of the hardware processor.

Abstract: Examples described herein relate to a network interface receiving a firmware update from one or more packets. In some examples, the one or more packets indicate a start of a firmware update. In some examples, the network interface can also perform authenticating the start of firmware update indication and based on authentication of the firmware update, permit a firmware update of a device. In some examples, the device is one or more of: Board Management Controller (BMC), central processing unit (CPU), network interface, Ethernet controller, storage controller, memory controller, display engine, graphics processing unit (GPU), accelerator device, or peripheral device. In some examples, an end of firmware update indicator is received in the one or more packets. In some examples, communications are maintained through a port during a firmware change.

Abstract: Examples relate to an encoding apparatus, encoding device, encoding method, computer program and to a corresponding computer system. An encoding apparatus comprises processing circuitry configured to encode at least two video streams to perform video compression encoding using one or more encoders, wherein the one or more encoders are each configured to deter-mine an encoding context based on the video stream processed by the respective encoder, the encoding context comprising at least one or more reference frames determined by the respective encoder. The processing circuitry is configured to store at least one of the encoding contexts determined by the one or more encoders in a shared memory portion of the memory circuitry that is accessible to the one or more encoders. The processing circuitry is configured to proceed, using the one or more encoders, with encoding the at least two video streams based on an encoding context stored in the shared memory portion.

Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.

Abstract: Systems, apparatuses, and methods to response to distinguish a ghost target from an actual target based on radar signals and ranges determined from the radar signals. In particular, the disclosure provides an intrusion detection system receiving ranges and velocities for targets detected based on radar signals, determining a potential ghost target from the received velocities and confirming the potential ghost target based on estimated ranges and perturbations of the vehicle speed.

Abstract: A mechanism is described for facilitating smart distribution of resources for deep learning autonomous machines. A method of embodiments, as described herein, includes detecting one or more sets of data from one or more sources over one or more networks, and introducing a library to a neural network application to determine an optimal point at which to apply frequency scaling without degrading performance of the neural network application at a computing device.

Abstract: An embodiment of an adaptive video encoder may include technology to determine headset-related information including at least one of focus-related information and motion-related information, and determine one or more video encode parameters based on the headset-related information. Other embodiments are disclosed and claimed.

Abstract: One embodiment provides an apparatus comprising a memory device configured to store a page table that includes a set of page table entries and a graphics processing cluster array including a plurality of graphics multiprocessors, the plurality of graphics multiprocessors coupled via a data interconnect. The graphics multiprocessor of the plurality of graphics multiprocessors includes a translation lookaside buffer (TLB) coupled with the memory device, the TLB to cache a first page table entry of the set of page table entries, the first page table entry to indicate that a first virtual page is a valid page that is cleared to a clear color and circuitry to bypass an access to the memory device for the first virtual page and determine a color associated with the first virtual page based on the indication that the first virtual page is a valid page that is cleared to the clear color.

Abstract: A method and system for controlling an analog-to-digital converter (ADC) in an observation path in a transceiver. The transceiver includes a transmit path, a receive path, and an observation path. The observation path includes an analog buffer and an observation ADC. A controller generates a control signal to control sampling events at the observation ADC to activate the observation ADC at combined uniform and non-uniform sampling instants. The controller may also generate a second control signal indicating whether digital data obtained by the observation ADC is valid or not. The digital data generated by the observation ADC at non-uniform sampling instants is indicated as invalid and digital data generated by the observation ADC at uniform sampling instants is indicated as valid. The digital data indicated as invalid may be discarded and the digital data indicated as valid is used for calibration of the transmit path or the receive path.

Abstract: The present disclosure is directed to a system having a first loading component and a second loading component for applying load to a device during a test of the device, the first loading component is configured to be moveable with respect to the second loading component. The system includes a seal member arranged between the first loading component and the second loading component, the seal member is adapted to engage the device during testing so as to apply a load against the device during testing and provide sealing around a cavity positioned below the first loading component and above the device.

Abstract: An RF chip package comprises a housing and one or more conductive contacts designed to electrically connect the RF chip package to other conductive contacts. The housing includes a first substrate, a 3-D antenna on the first substrate, and a second substrate. The second substrate includes a plurality of semiconductor devices and is bonded to the first substrate. An interconnect structure allows for electrical connection between the first and second substrates. In some cases, the first substrate is flip-chip bonded to the second substrate or is otherwise connected to the second substrate by an array of solder balls. By integrating both the 3-D antenna and RF circuitry together in the same chip package, costs are minimized while bandwidth is greatly improved compared to a separately machined 3-D antenna.

Abstract: Discussed herein is gate spacing in integrated circuit (IC) structures, as well as related methods and components. For example, in some embodiments, an IC structure may include: a first gate metal having a longitudinal axis; a second gate metal, wherein the longitudinal axis of the first gate metal is aligned with a longitudinal axis of the second gate metal; a first gate contact above the first gate metal; a second gate contact above the second gate metal; and an unordered region having an unordered lamellar pattern, wherein the unordered region is coplanar with the first gate contact and the second gate contact.

Abstract: Systems, methods, and apparatuses relating to one or more instructions for element aligning of a tile of a matrix operations accelerator are described.

Abstract: Apparatus and method for efficient graphics processing including ray tracing. For example, one embodiment of a graphics processor comprises: execution hardware logic to execute graphics commands and render images; an interface to couple functional units of the execution hardware logic to a tiled resource; and a tiled resource manager to manage access by the functional units to the tiled resource, a functional unit of the execution hardware logic to generate a request with a hash identifier (ID) to request access to a portion of the tiled resource, wherein the tiled resource manager is to determine whether a portion of the tiled resource identified by the hash ID exists, and if not, to allocate a new portion of the tiled resource and associate the new portion with the hash ID.

Abstract: In one embodiment, an apparatus includes an arbitration circuit with virtual link state machines to virtualize link states associated with multiple communication protocol stacks. The apparatus further includes a physical circuit coupled to the arbitration circuit and to interface with a physical link, where the physical circuit, in response to a retraining of the physical link, is to cause a plurality of the virtual link state machines to synchronize with corresponding virtual link state machines associated with a second side of the physical link, and where at least one of the communication protocol stacks is to remain in a low power state during the retraining and the synchronization. Other embodiments are described and claimed.

Abstract: Techniques and mechanisms for a victim cache to operate in conjunction with a skewed cache to help mitigate the risk of a side-channel attack. In an embodiment, a first line is evicted from a skewed cache, and moved to a victim cache, based on a message indicating that a second line is to be stored to the skewed cache. Subsequently, a request to access the first line results in a search of both the victim cache and sets of the skewed cache which have been mapped to an address corresponding to the first line. Based on the search, the first line is evicted from the victim cache, and reinserted in the skewed cache. In another embodiment, reinsertion of the first line in the skewed cache includes the first line and a third line being swapped between the skewed cache and the victim cache.

Abstract: A station (STA) configured for Quality-of-Service (QoS) management performs a Simple Reflective QoS (SRQ) protocol with an access point (AP) (i.e., another QoS STA) for QoS management of a QoS flow. As part of the SRQ protocol to exchange QoS profiles, the STA may encode a request frame to include a first SRQ capabilities information element (IE) for transmission to the AP. The inclusion of the first SRQ capabilities IE indicating that the STA supports the SRQ protocol. The STA may also decode a response frame received from the AP. The response frame includes a second SRQ capabilities IE indicating that the AP supports the SRQ protocol. The STA may also determine a QoS profile for the QoS flow based on SRQ capabilities of the STA and the AP. The STA may also create a SRQ tuple based the QoS profile for initiating the QoS flow.

Abstract: A vehicle control system (VCS) for a vehicle may include an in-vehicle bus and an intrusion detection system (IDS). The IDS may: calculate a planned output of the vehicle based on a message of a message stream received from at least one electronic control unit (ECU) coupled to the in-vehicle bus, calculate a reachable set based on an uncertainty metric, and identify an intrusion of the VCS based on a comparison of the planned output and the reachable set.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include an interposer having a surface, wherein a material of the interposer includes glass and the interposer includes through-glass vias (TGVs); a photonic integrated circuit (PIC) optically coupled to the surface of the interposer by optical glue or fusion bonding and electrically coupled to the TGVs in the interposer by hybrid bond interconnects; and an optical component optically coupled to the interposer, wherein the optical component is optically coupled to the PIC by an optical pathway through the interposer.

Abstract: A circuit system includes a memory block and first and second processing circuits. The first and second processing circuits store a matrix in the memory block by concurrently writing first and second rows or columns of the matrix to first and second regions of storage in the memory block, respectively. The first and second processing circuits transpose the matrix to generate a transposed matrix by concurrently reading first and second rows or columns of the transposed matrix from third and fourth regions of storage in the memory block, respectively.

Abstract: Various systems and methods for bus-off attack detection are described herein. An electronic device for bus-off attack detection and prevention includes bus-off prevention circuitry coupled to a protected node on a bus, the bus-off prevention circuitry to: detect a transmitted message from the protected node to the bus; detect a bit mismatch of the transmitted message on the bus; suspend further transmissions from the protected node while the bus is analyzed; determine whether the bit mismatch represents a bus fault or an active attack against the protected node; and signal the protected node indicating whether a fault has occurred.

Abstract: For example, a Bluetooth (BT) device may be capable of configuring a BT link for communication between the BT device and a keyboard device. For example, the BT device may be configured to identify a keypress attribute of keypresses on the keyboard device. For example, the BT device may be configured to identify the keypress attribute based on transmissions from the keyboard device to the BT device over the BT link between the BT device and the keyboard device. For example, the BT device may configure a bandwidth (BW) allocation for the BT link, for example, based on the keypress attribute.

Abstract: Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic assembly may include a core made of glass and having a surface, the core further including a first region having a first concentration of ions and a second region having a second concentration of ions at the surface of the core; and a third region having a third concentration of ions, wherein the second region is between the third region and the surface of the core, and wherein the third concentration of ions is less than the first and second concentrations of ions; a dielectric with a conductive pathway at the surface of the core; and a die electrically coupled to the conductive pathway in the dielectric at the surface of the core by an interconnect.

Abstract: A processor may aggregate cache misses in a cache, the cache shared by a plurality of input/output (I/O) sources. The processor may aggregate cache occupancy in the cache by the plurality of VO sources. The processor may and identify, based on the aggregating, a first I/O source of the plurality of I/O sources as impacting the cache.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include a substrate having a core with a surface, wherein a material of the core includes glass; and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) electrically coupled to the conductive pathways in the dielectric material; a first optical component between the PIC and the surface of the core, wherein the first optical component is coupled to the surface of the core by optical glue or by fusion bonding; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the core and the first optical component.

Abstract: Disclosed herein are microelectronic assemblies including strengthened glass cores, as well as related devices and methods. In some embodiments, a microelectronic assembly may include a glass core having a surface, a first region having a first concentration of ions extending from the surface of the core to a first depth; a second region having a second concentration of ions greater than the first concentration of ions, the second region between the first region and the surface of the core; a dielectric with a conductive pathway at the surface of the glass core; and a die electrically coupled to the conductive pathway in the dielectric at the surface of the core by an interconnect.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways and an interconnect die; a processor integrated circuit (XPU) and a photonic integrated circuit (PIC), having an active surface facing towards the core, electrically coupled to the interconnect die and to the conductive pathways; a first optical component optically coupled to the active surface of the PIC and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.

Abstract: Signal lines in the pin field of a printed circuit board layout are modified to reduce line impedance and improve signal integrity. The widths of signal lines are extended in the pin field to take full advantage of the available routing space between pads and adjacent signal lines. The signal line extension can be considered a subtractive approach in that the signal lines are extended to occupy the available muting space, with signal line extensions that would otherwise cause design rule violations being subtracted out. The edge of a signal line is extended to a keep-out region associated with a centerline that extends through a plurality of pads arranged in a line and located adjacent to the signal line. The edge of the signal line is also extended to keep-out regions associated with pads in the pin fields.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) having an active surface, wherein the PIC is coupled to the surface of the core with the active surface facing away from the core; a processor integrated circuit (XPU) electrically coupled to the conductive pathways in the dielectric material and to the active surface of the PIC; a first optical component optically coupled to a lateral surface of the PIC and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.

Abstract: A PIC first patch architecture includes a solderless electrical connection at a die interconnect surface. Redistribution layers (RDLs) are patterned onto a face of an integrated circuit (IC) die and photonic integrated circuit (PIC) die prior to placement of the RDLs into a cavity in a glass layer. Optical interconnections for the PIC die are protected during RDL patterning and optical waveguides may be patterned into the glass layer fore or after assembling the PIC first patch including the RDL and glass layer.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a photonic assembly may include a substrate having a core with a surface, wherein a material of the core includes glass; and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) electrically coupled to the conductive pathways in the dielectric material; a first optical component between the PIC and the surface of the core, wherein the first optical component is along a perimeter of the core; and a second optical component coupled to the first optical component, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component.

Abstract: Embodiments may be generally directed to techniques to cause communication of a registration request between a first end-point and a second end-point of an end-to-end path, the registration request to establish resource load monitoring for one or more resources of the end-to-end path, receive one or more acknowledgements indicating resource loads for each of the one or more resources of the end-to-end path, at least one of the acknowledgements to indicate a resource of the one or more resources is not meeting a threshold requirement for the end-to-end path, and perform an action for communication traffic utilizing the one or more resources based on the acknowledgement.

Abstract: An integrated circuit (IC) package substrate including a glass core having a cavity filter structure, and related devices and methods, are disclosed herein. In some embodiments, an IC package substrate may include a core made of glass, and the core including a first core portion having a first surface and a trench and a ridge in the first surface, the trench and the ridge lined with a conductive material; and a second core portion having a second surface, the second surface lined with the conductive material, wherein the first surface of the first core portion is physically coupled to the second surface of the second core portion forming a cavity filter structure.

Abstract: An active filter and an analog-to-digital converter (ADC) configured to suppress out-of-band peaking. An active filter may include an active device configured to provide a power gain to an input signal, a feedback network configured to connect an output of the active device to an input of the active device, and an input impedance network configured to couple the input signal to the input of the active device. A combination of the feedback network and the input impedance network is configured to provide frequency response properties of the active filter such that a frequency domain signal transfer function of the active filter has a constant in numerator.

Abstract: Technologies for providing accelerated functions as a service in a disaggregated architecture include a compute device that is to receive a request for an accelerated task. The task is associated with a kernel usable by an accelerator sled communicatively coupled to the compute device to execute the task. The compute device is further to determine, in response to the request and with a database indicative of kernels and associated accelerator sleds, an accelerator sled that includes an accelerator device configured with the kernel associated with the request. Additionally, the compute device is to assign the task to the determined accelerator sled for execution. Other embodiments are also described and claimed.

Abstract: A monolithic three-dimensional integrated circuit may include multiple transistor levels separated by one or more levels of metallization. An upper level transistor structure may include a monocrystalline channel material over a bottom gate stack. The channel material and the gate stack materials may be formed on a donor substrate at any suitable temperature, and subsequently transferred from the donor substrate to a host substrate that includes lower-level circuitry. The upper-level transistor may be patterned from the transferred layers so that the gate electrode includes one or more bonding layers. Source and drain material may be patterned from a source and drain material layer that was transferred from the donor substrate along with the channel material, or source and drain material may be grown at low temperatures from the transferred channel material.

Abstract: Apparatus and method for compression of acceleration structure build data in a ray tracing implementation. For example, one embodiment of an apparatus comprises: traversal hardware logic to traverse rays through a graphics scene comprising a plurality of primitives; and an acceleration data structure processing unit comprising: a bounding box compressor to compress a set of bounding boxes to generate a plurality of bounding box compression blocks, and an index compressor to compress a set of indices to generate a plurality of index compression blocks, and an acceleration data structure builder for constructing acceleration structures based on bounding box compression blocks and index compression blocks.

Abstract: Embodiments herein describe techniques for a semiconductor device including a TFT having a gate electrode with a gate length determined by a spacer. Embodiments may include a gate electrode above a substrate, a channel layer above the gate electrode, and a source electrode, a drain electrode, and a spacer above the channel layer. The drain electrode may be separated from the source electrode by the spacer. The drain electrode and the source electrode may have different widths or include different materials. Furthermore, the spacer may overlap with the gate electrode, hence the gate length of the gate electrode may be determined by the spacer width. Other embodiments may be described and/or claimed.

Abstract: A low-latency digital-signature with side-channel security is described. An example of an apparatus includes a coefficient multiplier circuit to perform polynomial multiplication, the coefficient multiplier circuit providing Number Theoretic Transform (NTT) and INTT (Inverse NTT) processing; and one or more accessory operation circuits coupled with the coefficient multiplier circuit, each of the one or more accessory operation circuits to perform a computation based at least in part on a result of an operation of the NTT/INTT coefficient multiplier circuit, wherein the one or more accessory operation circuits are to receive results of operations of the NTT/INTT coefficient multiplier circuit prior to the results being stored in a memory.

Abstract: Various embodiments herein provide techniques for reference signal (RS) configuration for high frequency bands (e.g., frequency above 52.6 GHz). For example, embodiments may include techniques for configuration of a demodulation reference signal (DM-RS), a channel state information reference signal (CSI-RS), and/or a sounding reference signal (SRS). The RS configuration may provide a low peak-to-average power ratio (PAPR) compared to prior techniques. Other embodiments may be described and claimed.

Abstract: Embodiments disclosed herein include semiconductor devices and methods of forming such devices. In an embodiment, a semiconductor device comprises a semiconductor substrate and a source. The source has a first conductivity type and a first insulator separates the source from the semiconductor substrate. The semiconductor device further comprises a drain. The drain has a second conductivity type that is opposite from the first conductivity type, and a second insulator separates the drain from the semiconductor substrate. In an embodiment, the semiconductor further comprises a semiconductor body between the source and the drain, where the semiconductor body is spaced away from the semiconductor substrate.

Abstract: Representative implementations of devices and techniques provide communication between networked nodes operating on a communication network medium. In an implementation, a node generates a broadcast frame that includes at least a preamble and a payload. The preamble of the broadcast frame may include auxiliary information. The auxiliary information may be associated with one or more symbols of the preamble. The auxiliary information may contain power boost information.