Abstract: Blends of novolaks and cyanates, such blends can be thermally hardened in a short time and without using a catalyst and have an excellent storage stability. The resins obtained by the blends can be used as binding agents in abradants or as chip coverings or printed circuit boards (PCB) in electronics.

Abstract: A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component wherein X is —(CH2)n- or —(CH2)1-Y—(CH2)m- , Y is —N(R1)—, —O— or —S—, R1 is alkyl having 1 to 8 carbon atoms or amino. n is a number of 2, 3, 5 to 11, 1 and m are each a number of 1 to 8.

Abstract: A powder coating composition and method of applying it to a substrate, such as medium density fibreboard, consisting of a glycidyl methacrylate resin, a dicarboxylic acid cross-linking agent, a catalyst selected from phosphines, phosphonium, ammonium 2-phenyl-2-imidazoline, substituted imidazoline and isopropyl imidazole Bis-A epoxy resin adduct and a matte texturing agent. The inventive formulation is able to create a matte texture finish on the surface of the substrate. Since the cured final coating is resistant to yellowing and moisture, it is of great utility in the kitchen cabinet making industry.

Abstract: The present invention relates to a thermally and cationically curable composition containing triarylcyclopropenylium salts and a solvent that is a Lewis base which contains acidic hydrogen and their use as thermal initiators in polymerization processes. The present invention includes the polymerization of epoxy resins, vinyl ethers and other cationically curable monomers.

Abstract: A chemical anchoring adhesive having a solid, putty-like consistency includes two parts in direct contact with each other along an interface. The first part includes about 20-45% by weight of an epoxy resin, about 10-40% by weight of a first particulate filler having an oil absorption value of at least about 30, and about 40-65% by weight of a second particulate filler, at least about 70% of which has a U.S. Sieve size between 16 and 45. The second part includes about 5-20% by weight of an aliphatic amine compound, about 0.1-15% by weight of a tertiary amine compound, about 1-23% by weight of a first particulate filler having the oil absorption described above, and about 52-87% by weight of a second particulate filler having the U.S. Sieve size described above.

Abstract: A novel aqueous resin composition for use as a sealer is provided, including an aqueous resin as a major component, and a viscosity modifier adjusting the viscosity of the aqueous resin composition to a value ranging from 5,000 to 100,000 mPa·s, the aqueous resin being an aqueous emulsion polyolefin resin which comprises a polyolefin not containing chlorine as a constituent element while exhibiting a viscosity of 1,000 mPa·s or higher in a water-dispersed state having a solid resin content of 20% to 40% by weight.

Abstract: Self-dispersing, hardenable epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, and reacting the thus formed intermediate with one or more polyepoxide compounds, are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: A cationic electrodeposition coating composition is provided which contains blocked isocyanate curing agent which is blocked with a substance not recognized as a HAPs (hazardous atmospheric pollutant). The cationic electrodeposition coating composition of the present invention contains a cationic group-containing epoxy modified base resin and a blocked isocyanate curing agent, wherein said blocked isocyanate curing agent is obtained by reacting a polyisocyanate compound with, as a blocking agent, a terminal primary OH-containing propylene glycol monoalkyl ether and expressed by the formula RO(CH(CH3)CH2O)nH (where R is an alkyl group having 1 to 8 carbons, which may be branched, and n is 1 to 3).

Abstract: An epoxy resin composition having a low viscosity around a room temperature and excellent reinforcing fiber impregnating properties provides a composite material having excellent heat resistance and mechanical properties including compressive strength. The epoxy resin composition includes an aromatic epoxy resin having at least di-functionality, an aromatic amine compound and/or an alicyclic amine compound, wherein 5 minutes after the main agent comprising the epoxy resin and the curing agent comprising the aromatic amine compound and/or the alicyclic amine compound are mixed, the composition shows a viscosity at 25° C. in the range of from 1 to 1500 mPa sec, and Tc, tc, and Tg satisfy the following equation (1): Tg≧Tc+20−k×(Tc−90)  (1), wherein k=0 when 60≦Tc<90 and k=0.35 when 90≦Tc≦200; Tc is the highest temperature (°C.

Abstract: Provided are a thermosetting resin composition for build-up method which gives a cured product excellent in heat resistance, an insulating material for build-up method using thereof and a build-up print circuit board. The thermosetting resin composition for build-up method comprises (A) an epoxy resin represented by formula (I), (B) a curing agent for epoxy resin and (C) a poly(ether sulfone), an insulating material for build-up method and a build-up print circuit board using thereof. in the formula, Gly represents glycidyl group: R represents each independently, an alkyl group having 1 to 10 carbons, and the like; i represents each independently a numeral of 0 to 4; when i is 2 or more, R may be the same or different from each other; and n represents a repeating number of 1 to 10.

Abstract: Coating composition especially for preparing automotive surfacers, comprising an anionically stabilized resin, preferably a condensation product A of a carboxyl group-containing resin A1 and a hydroxyl group-containing resin A2, and a curing agent C, which becomes active even at room temperature or slightly elevated temperature of up to not more than 120° C., and comprises a mixture of an unblocked isocyanate C1 and a hydrophilic partially etherified amino resin C2.

Abstract: A process for producing phenol resin having good color tone, which process comprises reacting hydroxyl group-containing aromatic compound and unsaturated cyclic hydrocarbon under the condition that the moisture is 100 ppm or less and the concentration of Friedel-Crafts catalyst is 0.07 mass % or less in a reaction system and a process for producing epoxy resin having good color tone, which process comprises reacting the obtained phenol resin and epihalohydrin in the presence of base catalyst, removing remaining catalyst and further removing unreacted epihalohydrin.

Abstract: A liquid epoxy-functional acrylic resin is disclosed. The resin comprises 10-90 wt % of recurring units of an epoxy-functional allylic monomer and 10-90 wt % of an acrylic monomer that has a homopolymer Tg less that 0° C. The epoxy-functional allylic monomer has the general structure: R is hydrogen, a C1-C10 aryl, or a C6-C12 aryl group; A is an oxyalkylene group; and n, which is an average number of oxyalkylene groups, is within the range of 0 to about 15.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Abstract: The fine spherical silica having a particle size distribution in which maximum particle diameter is 24 &mgr;m, average particle diameter is 1.7 to 7 &mgr;m, and the proportion X1 of particles having a particle diameter of 3 &mgr;m or less in the total particles is 100/D50 to (18+100/D50) wt %, and the viscosity at 50° C. of a mixture obtained by blending a maximum of 80 wt % of the fine spherical silica with a liquid epoxy resin or silicone resin at room temperature is 20 Pa·s or less is provided. The spherical silica is useful as a filler for sealing resin composition which has excellent gap permeability and seals slight gaps, between a substrate and an IC chip and has high reliability.

Abstract: This invention provides a thermosetting organic solvent paint comprising (A) a compound having at least two alicyclic epoxy groups in one molecule and having a number average molecular weight of less than 2000, (B) a secondary amino group-containing compound and (C) a thermolatent cationically polymerizable catalyst and further, under circumstances, (D) colloidal silica, and capable of forming a rigid coating film which is hard, tough and excellent in stain resistance, and from which pollutants, if adhered, are easily removed. This invention further provides a method to form a multi-layered top coating film which comprises applying, to a material to be coated, one or more species of colored paint and one or more species of clear paint in order, said method being characterized in that the above-mentioned paint is used as a clear paint which is to be applied on the uppermost layer.

Abstract: A resin composition for paper-coating, which comprises (A) a cross-linked amine compound which is a reaction product of (a) an aliphatic amine, (b) a glycidyl compound having at least two glycidyl groups in the molecule and (c) a compound selected from &agr;,&bgr;-unsaturated carbonyl compounds, &agr;,&bgr;-unsaturated nitrile compounds and &agr;-halocarboxylic acid groups; and (B) at least one selected from a group consisting of (B1) non-polymer nonvolatile substances and (B2) polyhydric alcohols, is provided, and the resin composition for paper-coating can realize high quality of coated paper by being mixed with a pigment and an aqueous binder and being coated on paper, which does not cause generation of formaldehyde and which does not tend to produce disadvantages such as thickening and deterioration in flowing property, and for paper using the resin composition and a coated paper produced by using the coating composition are also provided.

Abstract: A curable composition is formulated from an epoxy resin; a flame-retardant additive essentially free of phenolic groups and of epoxy groups; and a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferable is triazine. The preferred thermoplastic resin is a poly(phenylene ether). The inventive curable compositions advantageously can be combined with reinforcement in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.

Abstract: The object of the present invention is to provide an epoxy resin compositions for encapsulating of semiconductors containing no bromine compounds and no antimony oxide and excellent in flame retardancy, moisture resistance, moldability, curability and electric characteristics. This composition is an epoxy resin composition containing (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame retardant, wherein the improvement comprises the red phosphorus-based flame retardant (E) having a total content of phosphate ion and phosphite ion extracted from the retardant when subjected to extraction with water at 80° C. for 20 hours is not more than 2000 ppm, the amount of the red phosphorus in the red phosphorus-based retardant being 20-40% by weight and the red phosphorus-based retardant being contained in an amount of 0.5-5% by weight in the whole resin composition.

Abstract: An acetylide-form propargyl-containing resin composition for cationic electrocoating, which comprises a resin having a skeleton of epoxy resin and has a number average molecular weight of 500 to 20,000, and which contains, per 100 grams of the resin composition solids, 5 to 400 millimoles of sulfonium group and 10 to 495 millimoles of propargyl group, the total content of the sulfonium and propargyl groups being not more than 500 millimoles per 100 grams of the resin composition solids, said propargyl group being partly in the form of an acetylide. This resin composition may further contain unsaturated double bond.