Patents Examined by A. Aylward
  • Enhanced oxidation resistant polymeric insulation composition for air-cooled generators
    Patent number: 6555023
    Abstract: A high voltage capable, insulating and resinous composition is disclosed. An epoxy-anhydride resin is prereacted with an antioxidant oligomer selected from the group consisting of organophosphorus compounds, sterically-hindered alkylated phenolics, alkyl and aryl thio-esters, alkyl and aryl thio-phosphites, thiazoles, lactones, hydroxylamines, and maleimides.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: April 29, 2003
    Assignee: Siemens Westinghouse Power Corporation
    Inventor: James D. B. Smith
  • Flame-retardant resin composition, and prepregs and laminates using such composition
    Patent number: 6551714
    Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: April 22, 2003
    Assignee: Sumitomo Bakelite Company Limited
    Inventor: Akihiko Tobisawa
  • Epoxy resin composition and process for producing the same
    Patent number: 6548620
    Abstract: The present invention provides a tetramethylbiphenyl type high performance epoxy resin composition and a curable epoxy resin composition containing the epoxy resin, useful in electrical and electronic fields and the like. The tetramethylbiphenyl type epoxy resin composition comprises an epoxy resin composition obtained by reacting 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin in the presence of an alkali metal compound. The composition has a content of tetramethyldiphenoquinone of 0.5% by weight or less and a content of a glycidyl compound represented by the following structural formula (1): of 0.5% by weight or less. The curable epoxy resin composition contains the epoxy resin composition and a hardener for the epoxy resin.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: April 15, 2003
    Assignee: Japan Epoxy Resins Co., Ltd.
    Inventor: Yasuyuki Murata
  • Epoxy adhesive
    Patent number: 6548189
    Abstract: In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may further include at least one additive selected from the group including curing agents, bonding enhancers, hardeners, flexibilizers, tackifiers, and mixtures thereof.
    Type: Grant
    Filed: October 26, 2001
    Date of Patent: April 15, 2003
    Assignee: General Electric Company
    Inventors: Somasundaram Gunasekaran, Thomas Bert Gorczyca, Herbert Stanley Cole
  • Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
    Patent number: 6548576
    Abstract: A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders comprises an intimate mixture of the following components: approximately 2 to 13 per cent by weight of diglycidyl ether bisphenol A resin; approximately 40 to 70% phenol formaldehyde resin and the following further components [(2-methylphenoxy)methyl]-oxirane or o-cresol glycidyl ether) 0.5-8% by weight; polypropyleneglycol-glycidyl ether resin (plasticizer) 2-10% by weight; cycloaliphatic polyamine (catalyst) 4-15% by weight; kaolin clay (filler) 2-20% by weight; magnesium alumino silicate (filler) 2-15% by weight; Sb2O3 (filler) 4-5% by weight, and hydrated Al2O3 (filler) 0-15% by weight.
    Type: Grant
    Filed: November 7, 2001
    Date of Patent: April 15, 2003
    Assignee: Bourns, Inc.
    Inventor: Raymond L. Winter
  • Aqueous resin composition
    Patent number: 6541541
    Abstract: An aqueous resin composition comprising a polyepoxy compound represented by formula (I): wherein n represents a number of from 0.1 to 20; Z represents a single bond, an alkylidene group having 1 to 4 carbon atoms or a sulfone group; and X represents a hydrogen atom or a glycidyl group, provided that at least 10% of nX's represent a glycidyl group, and water.
    Type: Grant
    Filed: September 18, 2001
    Date of Patent: April 1, 2003
    Assignee: Asahi Denka Kogyo Kabushiki Kaisha
    Inventors: Kiyoshi Masamune, Naohiro Fujita, Ryo Ogawa, Koji Akimoto
  • Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators
    Patent number: 6538052
    Abstract: The invention relates to curable compositions comprising a) an epoxy resin, b) an aminic curing agent and c) a curing accelerator, which comprise as curing accelerator c) at least one or more than one compound selected from c1) a compound of formula (I) wherein R1 and R2 are each independently of the other a hydrocarbon radical having from 1 to 12 carbon atoms, c2) a reaction product of a compound of formula (I) with formaldehyde, and c3) a reaction product of a compound of formula (I) with formaldehyde and a phenolic compound, in an amount of from 0.1 to 25% by weight, based on the sum of components a), b) and c), and to a process for the production of cured products using those compositions.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: March 25, 2003
    Assignee: Vantico GmbH & Co.
    Inventors: Wolfgang Scherzer, Jörg Volle
  • Flame retardant epoxy resin modified with phosphorus and silicon
    Patent number: 6534601
    Abstract: Disclosed is an epoxy resin modified with phosphorus and silicon having an synergistically improved flame retardant property, prepared by reacting an epoxy resin with phosphorus and silicon. The contents of phosphorus and silicon in the epoxy resin are 2.0 wt % to 3.2 wt % and 0.5 wt % to 2.2 wt %, respectively. The epoxy resin according to the present invention will be applicable to the preparation of electrical circuit boards.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: March 18, 2003
    Assignee: Kukdo Chemical Co., Ltd.
    Inventors: Chongsoo Park, Jaeho Choi, Bonggoo Choi, Taekyoo Shin
  • Mortar composition, curable by frontal polymerization, and a method for fastening tie bars
    Patent number: 6533503
    Abstract: A mortar composition, curable by frontal polymerization after heat initiation, is described, wherein are contained a) at least one polymerizable monomer and/or at least one curable resin, b) at least one polymerization initiator, which can be activated and/or released thermally at a temperature above 30° C., for the polymerizable monomers and/or curing accelerator for the curable resin and c) optionally at least one filler, the nature and amount of polymerizable monomer or curable resin and polymerization initiator or curing accelerator being selected so that a polymerization front velocity of at least 10 cm/min results after the polymerization is initiated, as well as a method for fastening tie bars, reinforcing steel or the like in solid substrates.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: March 18, 2003
    Assignee: Hilti Aktiengesellschaft
    Inventors: Armin Pfeil, Thomas Bürgel, Massimo Morbidelli, Anny Rosell
  • Crosslinkable polymer composition
    Patent number: 6534177
    Abstract: Crosslinkable polymer compositions are provided which can be in the form of a polymer powder which is redispersible in water or as an aqueous dispersion. The polymer composition is composed of A) a copolymer of one or more comonomers of vinyl esters of straight-chain or branched alkanecarboxylic acids having 1 to 18 C atoms, acrylates or methacrylates of branched or straight-chain alcohols having 1 to 15 C atoms, dienes, olefins, vinylaromatics and vinyl halides, and of from 0.1 to 10% by weight, based on the total weight of the comonomers, of one or more ethylenically unsaturated comonomers containing epoxide groups, and B) one or more non-copolymerizable compounds having at least two epoxide groups. The invention furthermore relates to a process for the preparation of the crosslinkable polymer compositions and their use in chemical products for the construction industry.
    Type: Grant
    Filed: January 25, 2001
    Date of Patent: March 18, 2003
    Assignee: Wacker-Chemie GmbH
    Inventors: Klaus Kohlhammer, Klaus Adler, Herbert Eck, Hermann Lutz
  • Liquid epoxy resin composition and semiconductor device
    Patent number: 6534193
    Abstract: A liquid epoxy resin composition includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) a curing accelerator, (D) an inorganic filler, and (E) an indene-styrene or indene-chroman-styrene copolymer having a Mn of 200-2,000 in an amount of 0.1-20 parts by weight per 100 parts by weight of components (A) and (B) combined. The indene polymer (E) is previously melt mixed with a part or all of the liquid epoxy resin (A) prior to compounding with the remaining components. A semiconductor device sealed with the cured product of the liquid epoxy resin composition remains reliable.
    Type: Grant
    Filed: July 26, 2001
    Date of Patent: March 18, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazuaki Sumita, Toshio Shiobara
  • Crystallized epoxy resins, their production method, and curable compositions comprising them
    Patent number: 6531549
    Abstract: A crystallized epoxy resin which is easy to blend with a hardener or the like is a crystallized product of an epoxy resin derived from 4,4′-dihydroxy-3,3′,5,5′-tetramethylbiphenyl and an epihalohydrin, and the ratio of an endotherm between 50° C. and 130° C. to an endotherm between 80° C. and 125° C., measured by raising the temperature at a rate of 10° C. per minute using a DSC device, is 1.03 or more.
    Type: Grant
    Filed: December 12, 2001
    Date of Patent: March 11, 2003
    Assignee: Japan Epoxy Resins Co., Ltd.
    Inventors: Yasuyuki Murata, Masayuki Tsutsumi, Kiyotaka Ikebata, Ken Tanaka
  • Flowable glanulates
    Patent number: 6528594
    Abstract: A process for the manufacture of a flowable granulate by means of spray granulation, which comprises using as starting material a formulation in liquid form comprising (a) a substance or a mixture of substances that is in the form of a waxy or cohesive solid at room temperature, and (b) up to 20% by weight, based on the amount of component (a), of a substance having a specific surface >3 m2/g that is insoluble in component (a), yields granulates that have a narrow particle size distribution and a low dust content and that are stable to storage.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: March 4, 2003
    Assignee: Vantico Inc.
    Inventors: Michael Bauer, Christoph Rickert
  • Method of making an aqueous dispersion of particles comprising an epoxy material for use in coatings
    Patent number: 6525115
    Abstract: The present invention relates to a method of making an aqueous dispersion of particles comprising epoxy-functional and acid-functional materials. Coating compositions made from such a dispersion can be used to protect various substrates, including imaging layers, so that the coated product resists fingerprints, common stains, and spills.
    Type: Grant
    Filed: December 5, 2000
    Date of Patent: February 25, 2003
    Assignee: Eastman Kodak Company
    Inventors: Yongcai Wang, Kurt M. Schroeder, James L. Bello, Kevin M. O'Connor
  • Method for restoring a surface on a metal substrate
    Patent number: 6524646
    Abstract: A method of restoring a damaged surface of a substrate to a functional condition through a filler material consisting essentially of tungsten disulfide and epoxy resin having a 10:1 ratio by weight. The filler material is cured after being applied to the damaged surface by uniformly raising the temperature to a cure temperature of the epoxy to allow any volatiles to evaporate without the creation of voids in the surface such that the resulting porosity prevents corrosion of the substrate when exposed to aromatic fuels at temperatures of 350 degrees F. The filler material consists of tungsten disulfide and a two part epoxy such as Hysol EA 9394/C-2.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: February 25, 2003
    Assignee: Honeywell International, Inc.
    Inventors: Betty H. Kocsis, Jimmy C. Chan
  • Process for producing cross-linked polyallylamine hydrochloride
    Patent number: 6525113
    Abstract: The present invention relates to a process for preparing a cross-linked pollyallylamine hydrochloride. The process involves mixing polyallylamine hydrochloride, water, a hydroxide or alkoxide, and a water-miscible organic solvent or co-solvents, to a reaction mixture and adding a cross-linking agent to the reaction mixture to form a cross-linked polyallylamine.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: February 25, 2003
    Assignee: Abbott Laboratories
    Inventors: Russell C. Klix, Jufang H. Barkalow, William T. Monte
  • Epoxy resin composition and semiconductor device
    Patent number: 6521354
    Abstract: An epoxy resin comprising (A) an epoxy resin, (B) a curing agent and (C) a filler, in which the epoxy resin (A) contains a bisphenol F-type epoxy compound (a), the filler (C) contains spherical silica and the filler (C) accounts for from 88 to 96% by weight of the resin composition, has good soldering heat resistance enough for high-temperature solder reflow and has good moldability. A semiconductor device encapsulated with the resin composition is useful for use in electronic appliances.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: February 18, 2003
    Assignee: Toray Industries, Inc.
    Inventors: Hiroo Shimizu, Katsuhiro Niwa, Masayuki Tanaka
  • Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition
    Patent number: 6517743
    Abstract: An epoxy resin composition which is cured transparent product having high neutron shielding capability, comprised by an epoxy resin without any not transparent inorganic substances and a hardener and characterized by said composition's viscosity at ambient temperatures is below 7000 mPa·s and said composition is curable at said temperatures.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: February 11, 2003
    Assignees: Sanoya Industry Co Ltd, Tohto Resin Products Co Ltd
    Inventors: Yoshimasa Anayama, Hiroshi Nakanishi, Kenji Watanabe, Makoto Matsuura
  • Semiconductor encapsulating epoxy resin compositions, and semiconductor devices encapsulated therewith
    Patent number: 6518332
    Abstract: Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.
    Type: Grant
    Filed: April 25, 2001
    Date of Patent: February 11, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Eiichi Asano, Kazutoshi Tomiyoshi, Masachika Yoshino, Toshio Shiobara, Shoichi Osada
  • Method of manufacturing powder coating
    Patent number: 6515046
    Abstract: A method of manufacturing a powder coating is provided which does not require a long complicated process, which enables the paint to be manufactured easily and with good conservation of energy, and moreover is free of any danger of gelling during the manufacturing process. The powder coating is manufactured by spray drying a powder coating raw materials solution comprising, as essential constituents, an epoxy group containing acrylic resin (A), a polyvalent carboxylic acid (B), and an organic solvent (C) incorporating an alcohol (C-1) of 2 to 4 carbon atoms, at a temperature at which the epoxy group containing acrylic resin (A) and the polyvalent carboxylic acid (B) undergo no substantial curing reaction.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: February 4, 2003
    Assignees: Dainippon Ink and Chemicals, Inc., Liquid Gas Co., Ltd.
    Inventors: Katsuhiko Okada, Tetsuro Agawa