Patents Examined by A. Dexter Tugbang
  • Patent number: 11121516
    Abstract: A crimping machine having a multiplicity of magazines for contact elements which are transportable to a transfer position via a conveyor device. A component to be crimped is then brought from the transfer position into a crimping position by means of a transport device. This transport device is assigned to all of the storage arrangements.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: September 14, 2021
    Assignee: ZOLLER & FRÖHLICH GMBH
    Inventors: Christoph Fröhlich, Steffen Hartinger, Hans Leupolz
  • Patent number: 11121610
    Abstract: A method of manufacturing a laminated core includes supplying a stator material to a punching device and obtaining an electromagnetic steel plate corresponding to a rectangular processed body by punching the stator material. To obtain the electromagnetic steel plate ES, a slit is formed outside a processed body forming area in the stator material along a long side of the processed body forming area, and a center portion of the processed body forming area is punched out in a circular shape. Additionally, the processed body forming area is punched out after the slit is formed and the center portion is punched out. The laminated core is obtained by laminating and fastening a plurality of the electromagnetic steel plates.
    Type: Grant
    Filed: October 12, 2018
    Date of Patent: September 14, 2021
    Inventors: Akihiro Hashimoto, Takahiro Shimizu
  • Patent number: 11122693
    Abstract: Described are processes for developing laminated circuit boards, as well as the resulting circuit boards themselves. Accordingly, at least two circuit boards at least partially overlap each other, and at least one through-hole is formed in an overlapping region thereof. The through-hole is filled with an electrically-conductive material, forming a through-via that enables the circuit boards to be electrically connected. When a circuit on each circuit board is laid out so that a part thereof reaches a region in which the through-via is to be formed, then that part of the circuit can be electrically connected to the through-via. Thus, portions of the circuits on the circuit boards can be electrically connected to each other via common through-vias to realize an integrated device in which the circuits on the laminated circuit boards function.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: September 14, 2021
    Assignee: Pi-Crystal Incorporation
    Inventors: Junichi Takeya, Seiichiro Yamaguchi, Masataka Itoh
  • Patent number: 11116070
    Abstract: Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: September 7, 2021
    Assignee: CELLINK CORPORATION
    Inventors: Kevin Michael Coakley, Malcolm Parker Brown, Dongao Yang, Michael Lawrence Miller, Paul Henry Lego
  • Patent number: 11083433
    Abstract: Methods of manufacturing high frequency ultrasound transducers configured for use with high frequency ultrasound diagnostic imaging systems are disclosed herein. In one embodiment, methods of manufacturing an ultrasound transducer includes providing a concave lens having an average thickness in a center portion that that is substantially equal to an odd multiple of a ¼-wavelength of the center frequency of the ultrasound transducer.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: August 10, 2021
    Assignee: FUJIFILM SONOSITE, INC.
    Inventor: Nicholas Christopher Chaggares
  • Patent number: 11088502
    Abstract: A wire harness assembly work cell includes a wire harness assembly work table with a pneumatically powered or spring-fed universal applicator tool for mass terminating sets of wires into insulator wafers. The insulator wafers may be assembled in stacks to form cable-end connector headshells. Insulation displacement terminals (IDT) are designed to receive wide ranges of wire diameters so that larger varieties of wire sizes may be received into these connector assemblies while using fewer different sizes of terminals, thus reducing the number of items in a bill of material (BOM) and substantially reducing the volumes and overhead costs of testing and quality control documentation dedicated to each individual BOM item.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: August 10, 2021
    Inventor: John D Tillotson, Jr.
  • Patent number: 11083121
    Abstract: A component mounting apparatus includes a nozzle that sucks a component supplied from a feeder, conveys the component to a predetermined position on a substrate, and mounts the component in the predetermined position. The component mounting apparatus controls an XY-robot to perform repeatedly the component mounting operation while performing a thermal correction from a start of the component mounting operation as a result of a power supply being turned on until an amount of positional deviation due to heat from the XY-robot reaches a steady state. After the steady state is achieved, the component mounting apparatus controls the XY-robot to perform repeatedly the component mounting operation while performing a steady state correction using a correction amount resulting immediately after the steady state is achieved without performing the thermal correction and controls the XY-robot to perform a dummy operation for maintaining the steady state during a standby period.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: August 3, 2021
    Assignee: FUJI CORPORATION
    Inventor: Takeshi Sakurayama
  • Patent number: 11073434
    Abstract: Provided are a method of manufacturing a shear and normal force sensor including fabricating raised and sunken polymers having a plurality of bent parts of bent shapes, forming an electrode pattern on one surface of a piezoelectric element, and embedding the piezoelectric element between the raised and sunken polymers, and a shear and normal force sensor including raised and sunken polymers having a plurality of bent parts of bent shapes, a piezoelectric element embedded between the raised and sunken polymers and having an electrode pattern on one surface, and a flexible printed circuit board (FPCB) embedded between the sunken polymer and the piezoelectric element and electrically connected to the electrode pattern.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: July 27, 2021
    Assignee: Korea Institute of Science and Technology
    Inventors: Youngsu Cha, Ye Rim Lee
  • Patent number: 11069462
    Abstract: A system is provided for wire processing. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: July 20, 2021
    Assignee: THE BOEING COMPANY
    Inventor: John Porter
  • Patent number: 11056760
    Abstract: A method of making an electrical structure having a foam housing is set forth. The foam housing includes an interior surface forming a conductive cavity adapted to carry energized waveforms therethrough. An electrical component of the electrical structure is integrally formed with the interior surface as the foam housing of the structure is assembled. The method includes the steps of depositing a plating material into a mold, pouring a foam polymer into the mold and removing the plated foam structure from the mold without etching the section from the mold. The method further includes steps of forming a metallic form into a planar structure, filling the open pores of the foam with a material such as photo-resist, machining a cavity from the foam, electroplating the cavity in the foam then removing the photo-resist material.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: July 6, 2021
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Steven J. Mass, Anthony L. Long, Mansoor K. Siddiqui, Marijan D. Grgas, Gershon Akerling
  • Patent number: 11050329
    Abstract: A mother substrate that enables winding cores to be obtained in a manner in which the mother substrate is divided along x-direction division lines and y-direction division lines is prepared. Subsequently, x-direction division grooves are formed along the x-direction division lines on a first main surface of the mother substrate, y-direction division grooves are formed along the y-direction division lines on the first main surface, and shallow bottom surface exposure grooves, for exposing surfaces that are to be core portion bottom surfaces, are formed on the first main surface. The mother substrate is divided by performing a flattening process on a second main surface of the mother substrate that is opposite the first main surface until the second main surface reaches the x-direction division grooves and the y-direction division grooves to obtain the winding cores that are separated from each other.
    Type: Grant
    Filed: December 3, 2018
    Date of Patent: June 29, 2021
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Eiji Yamauchi
  • Patent number: 11037725
    Abstract: A method of making an inductor includes forming a plurality of first metal layers on a substrate and an ILD. The method includes patterning a plurality of trenches in the ILD, depositing a magnetic material, and depositing another layer of ILD. The method further includes patterning a plurality of vias adjacent to the trenches filled with the magnetic material, and patterning trenches in the another layer of ILD. The trenches in the another layer of ILD include first portions arranged over, adjacent to and substantially parallel the plurality of first metal layers, and the second portions arranged substantially perpendicular to the first portions, extending from both ends of the first portions, and oriented in opposite directions such that the second portions are continuous with the plurality of vias. The method includes depositing a metal in the plurality of vias and the trenches in the another layer of ILD.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: June 15, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kangguo Cheng, Juntao Li, Geng Wang, Qintao Zhang
  • Patent number: 11038314
    Abstract: An electronic device assembling apparatus has a cable holder and a lock member operator. The cable holder holds a cable and inserts the cable into a connector. After the cable is inserted into the connector by the cable holder, the lock member operator operates a lock member to lock the cable to the connector. The lock member operator starts an operation with respect to the lock member in a state where the cable inserted into the connector is held by the cable holder.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: June 15, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ken Takano, Yuji Takahashi, Kazu Wagatsuma
  • Patent number: 11014361
    Abstract: A manufacturing method of a liquid supply component in which a liquid supply path is formed between a first constituent component and a second constituent component that are joined with molten resin. The method includes a first step of preparing these constituent components, a second step of causing the constituent components to face each other and forming an orifice portion and a reservoir portion between a mold and a surface of either of the constituent components, and a third step of pouring the molten resin between the constituent components so that it flows into the reservoir portion through the orifice portion.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 25, 2021
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yasuaki Kitayama, Yukuo Yamaguchi, Kyosuke Toda, Keiichiro Tsukuda, Kazuhiko Okito
  • Patent number: 11014203
    Abstract: A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: May 25, 2021
    Inventors: Mark D. Kittel, Jason L. Strader
  • Patent number: 11011195
    Abstract: A multi-layer piezoelectric microactuator assembly has at least one poled and active piezoelectric layer and one poled but inactive piezoelectric layer. The poled but inactive layer acts as a constraining layer in resisting expansion or contract of the first piezoelectric layer.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: May 18, 2021
    Assignee: Magnecomp Corporation
    Inventors: Kuen Chee Ee, Long Zhang, Peter Hahn, David Glaess
  • Patent number: 11005235
    Abstract: A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.
    Type: Grant
    Filed: August 10, 2016
    Date of Patent: May 11, 2021
    Assignees: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION, SMART ELECTRONICS INC.
    Inventors: Chang-Koo Kim, Hae-Min Lee, Doo Won Kang, Hyun Chang Kim
  • Patent number: 11004602
    Abstract: A flat coil, a manufacturing method thereof and an electronic apparatus are disclosed. The manufacturing method comprises: rolling a metal foil lamination onto a carrier roller to form a foil rod, wherein the metal foil lamination includes at least one layer of metal foil; sliding the foil rod from the carrier roller; slicing the foil rod into thin disks; and processing the thin disks to form at least one flat coil, wherein a pressing roller is pressed against the carrier roller via the metal foil lamination with a controlled pressing force as the metal foil lamination is rolled.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: May 11, 2021
    Assignee: Goertek Inc.
    Inventor: Quanbo Zou
  • Patent number: 11001061
    Abstract: Methods for manufacturing a microfluidic delivery device comprising a semiconductor structure, such as silicon, are provided. In particular, the structure for delivering fluid may be formed from polycrystalline silicon, also called polysilicon, or epitaxial silicon. The microfluidic delivery device that predominantly uses semiconductor material, such as silicon, to form the structures that are in contact with the dispensed fluid results in a device that is compatible with a wide set of fluids and applications.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: May 11, 2021
    Assignee: STMICROELECTRONICS S.R.L.
    Inventors: Dino Faralli, Laura Maria Castoldi, Paolo Ferrari, Marta Carminati
  • Patent number: 10984948
    Abstract: A method for forming an inductor device. The method comprises forming a trench within a central core region of a conductive coil formed within a dielectric material. The method further comprises forming a composite region within the trench. The composite region including a polymer matrix having a plurality of particles with magnetic properties dispersed therein with the central core region to reduce eddy current loss and increase energy storage.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: April 20, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Chandrasekharan Kothandaraman, Eugene J. O'Sullivan, Naigang Wang