Patents Examined by A. Dexter Tugbang
  • Patent number: 11457532
    Abstract: A method for manufacturing a circuit board comprises steps of providing a single-sided board comprising a first insulating base, a copper layer, and at least one first conductive structure; providing a laminated board comprising a metal layer, a third insulating base, a metal shielding layer, and a second insulating base; forming a wiring layer by the metal layer comprising at least one signal wire and at least one connecting pad; defining at least one second through hole each passing through the second insulating base, the metal shielding layer, and the third insulating base; forming a second conductive structure in each second through hole; providing a double-sided board comprising a wiring layer, a fourth insulating base, a first copper foil; and at least one third conductive structure; pressing the single-sided board, at least one middle structure, and the double-sided board in that sequence to form the circuit board.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: September 27, 2022
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited.
    Inventors: Fu-Yun Shen, Ming-Jaan Ho, Hsiao-Ting Hsu, Lin-Jie Gao
  • Patent number: 11448825
    Abstract: A method for forming a side-pumped optical fiber combiner includes ablating a cladding of a signal fiber to form an angled notch in the cladding. The signal fiber includes a core and the cladding surrounding the core. The method further includes inserting a cladding-free end of a pump fiber into the angled notch. The pump fiber includes a core and a cladding, the cladding-free end including the core of the pump fiber and free from the cladding of the pump fiber. The method further includes fusing the cladding-free end to the signal fiber.
    Type: Grant
    Filed: December 19, 2018
    Date of Patent: September 20, 2022
    Assignee: AFL Telecommunications LLC
    Inventors: Wenxin Zheng, Mohamed Amine Jebali, Gongwen Zhu
  • Patent number: 11432449
    Abstract: A system including multiple inspection machines and an NG board discharge machine which moves an NG board to a checking position visible to a worker. The system acquires positional information of a circuit board during conveyance, and stores the NG board by associating a work result for the NG board with the positional information. In this manner, the positional information of the NG board is acquired. Based on the positional information, it is determined whether or not the circuit board conveyed to the NG board discharge machine is the NG board. When the circuit board conveyed to the NG board discharge machine is the NG board, a checking-purpose working machine discharges the NG board to the checking position.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: August 30, 2022
    Assignee: FUJI CORPORATION
    Inventors: Teruyuki Ohashi, Toshiya Suzuki
  • Patent number: 11425848
    Abstract: A carrier assembly configured to facilitate manufacture of a printed circuit board assembly includes a bottom frame defining a generally rectangular configuration and having a length and a width. The bottom frame is adjustable to vary at least one of the length or the width thereof. The assembly further includes a core releasably positionable on the bottom frame and configured to support a circuit board thereon. A carrier assembly system includes the bottom frame and a plurality of cores.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: August 23, 2022
    Assignee: FLEX LTD.
    Inventors: Zohair Mehkri, Anwar Mohammed, Jesus Tan, David Geiger, Murad Kurwa
  • Patent number: 11419217
    Abstract: A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: August 16, 2022
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Yusheng Lin, Sadamichi Takakusaki
  • Patent number: 11411362
    Abstract: A compression tool for fastening a cable to a connector comprising an elongated tool frame, an anvil secured to one end of the tool frame, a compression plunger slidable along a portion of the tool frame, a handle set adapted to move the compression plunger toward and away from the anvil and a spacer block for securing the connector a distance from the anvil. The handle set may include a first handle movable from a first position wherein the plunger is a first distance from the anvil to a second position wherein the plunger is a second distance from the anvil. The spacer block may include a first end and a second end having a different depth from the first end and be rotatable so that the first end when rotated to the active position secures the connector a first distance from the anvil and the second end, when rotated to the active position secures the connector a second distance from the anvil.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: August 9, 2022
    Assignee: Ripley Tools, LLC
    Inventor: Paul Phillips
  • Patent number: 11397327
    Abstract: A method of manufacturing an optical engine includes bonding a plurality of laser diodes directly or indirectly to a base substrate and coupling at least one laser diode driver circuit to the laser diodes. In operation the at least one laser diode driver circuit selectively drives current to the laser diodes. The method further includes bonding a plurality of collimation lenses to the base substrate proximate the plurality of laser diodes and bonding a cap including at least one wall and at least one optical window to the base substrate. The method also includes bonding a grating waveguide combiner proximate the optical window of the cap. In operation, the grating waveguide combiner receives a plurality of beams of light at a respective plurality of input grating couplers and combines the plurality of beams of light to provide a collimated aggregated beam of light at an output grating coupler.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: July 26, 2022
    Assignee: Google LLC
    Inventors: Jörg Pierer, Rony Jose James, Stefan Mohrdiek, Martin Joseph Kiik, Syed Moez Haque, Douglas Raymond Dykaar
  • Patent number: 11394280
    Abstract: A device for bending a plurality of winding segments to form a winding of a winding carrier of an electric machine is provided. The device includes: a holding device designed for holding in place the winding carrier in which the winding segments are arranged; a main bending device, including a number of main locking elements, which point towards the holding device, are arranged along first sections of a circumferential line and are designed to lock exposed end sections of first winding segments; and a partial bending device, including a number of partial locking elements, which point towards the holding device, are arranged along second sections of the circumferential line and are designed to lock exposed end sections of second winding segments. The holding device on the one hand and the main bending device and the partial bending device on the other hand are rotatable relative to each other.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: July 19, 2022
    Assignee: Vitesco Technologies GmbH
    Inventors: Christoph Radtke, Axel Gohs
  • Patent number: 11387718
    Abstract: A method of removing an insulating coating layer of coil wiring includes: a fragmentation step in which a line-shaped region of the insulating coating layer, which separates a removal-planned portion and a remain-planned portion of the insulating coating layer, is removed; a laser irradiation step in which laser light which transmits through the insulating coating layer but which is absorbed by a coil wiring is irradiated from a side of an outer surface of the removal-planned portion toward a boundary of the coil wiring with the insulating coating layer, to carbonize a boundary portion between the insulating coating layer and the coil wiring of the removal-planned portion by generation of heat of the coil wiring; and a coating turn-over step in which air is blown onto the removal-planned portion to turn over and blow off the removal-planned portion.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: July 12, 2022
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Ken Shirai, Yasuyuki Hirao, Masashi Matsumoto, Hiroaki Takeda, Ryosuke Maruyama
  • Patent number: 11376820
    Abstract: A method of fabrication of a laminated glazing unit, includes cutting out a first through-hole in a first glass sheet; positioning a conducting wire and a film of thermoplastic polymer between the first glass sheet and a second glass sheet so that a first extremity and a second extremity of the conducting wire extend outside the laminated glazing unit to be formed, and feeding out the first extremity of the conducting wire via the first through-hole so that the first extremity exits the laminated glazing unit to be formed via the first through-hole, the conducting wire extending continuously from the first extremity to the second extremity, and after the positioning and feeding out, assembling the conducting wire, the film of thermoplastic polymer, the first glass sheet and the second glass sheet all together to form the laminated glazing.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: July 5, 2022
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Dominique Bureloux, Adeline Girod, Alexandre Hennion, Andreas Schlarb, Bernd Stelling
  • Patent number: 11382249
    Abstract: A component supply device comprises: a main body including a tape path which guides a component supply tape being sent in a longitudinal direction to a component supply position, and an introducing region which communicates with the tape path on a side opposite to the supply position in the longitudinal direction and introduces the supply tape into the tape path; and a tape position switching mechanism which switches the position of the supply tape in a vertical direction with respect to the tape path on the side opposite to the supply position. The tape position switching mechanism includes a supporter movable between a supporting position for supporting the supply tape from below and a non-supporting position separated from the supporting position in a width direction of the supply tape. The supporter releases the supply tape to move the supply tape downward from the supporting position to the non-supporting position.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: July 5, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Tomoharu Kurayama, Tomokazu Ohnuki, Hiroko Kakiuchi
  • Patent number: 11350959
    Abstract: A method of fabricating an ultrasonic medical device is presented. The method includes machining a surgical tool from a flat metal stock, contacting a face of a first transducer with a first face of the surgical tool, and contacting a face of a second transducer with an opposing face of the surgical tool opposite the first transducer. The first and second transducers are configured to operate in a D31 mode with respect to the longitudinal portion of the surgical tool. Upon activation, the first transducer and the second transducer are configured to induce a standing wave in the surgical tool and the induced standing wave comprises a node at a node location in the surgical tool and an antinode at an antinode location in the surgical tool.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: June 7, 2022
    Assignee: Cilag GmbH International
    Inventors: Jeffrey D. Messerly, Brian D. Black, William A. Olson, Frederick Estera, William E. Clem, Jerome R. Morgan, Jeffrey L. Aldridge, Stephen M. Leuck
  • Patent number: 11357105
    Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: June 7, 2022
    Assignee: NextGin Technology BV
    Inventor: J. A. A. M. Tourne
  • Patent number: 11357144
    Abstract: A component supply device includes a transport path that guides a component connected body from a component insertion port on an upstream side in a component feeding direction to a component supply position on a downstream side, the component connected body including a plurality of axial components arranged and connected at a predetermined pitch, the plurality of axial components each having a lead, and a feed mechanism that pitch-feeds the component connected body along the transport path to the downstream side. The feed mechanism includes a feed member which has a plurality of feed hooks disposed at the predetermined pitch along the component feeding direction, a rotating shaft which is connected to one end side of the feed member, and a moving mechanism which is connected to the feed member through the rotating shaft and reciprocates the rotating shaft along the component feeding direction.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: June 7, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Hideaki Watanabe, Dai Yokoyama, Shigeki Imafuku, Yosuke Nagasawa, Satoshi Matsuoka, Kazuo Nagae
  • Patent number: 11342821
    Abstract: In a method for manufacturing a rotor, each of adhesive placement portions that are provided between a surface of a permanent magnet on the radially inner side and grooves is formed so as to cover a part of an adhesive applied to the permanent magnet on the radially inner side and parts of the adhesive on both sides in the circumferential direction.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: May 24, 2022
    Assignee: AISIN CORPORATION
    Inventors: Hideharu Ushida, Tetsuya Matsubara, Tetsuya Takahashi
  • Patent number: 11329440
    Abstract: A crimping tool exchange device exchanges a first crimping tool for a second crimping tool, wherein each crimping tool, when at a processing position in a crimping press, produces a crimp connection connecting a conductor end of a cable to a crimp contact. The device includes first and second exchange units retaining the first and second crimping tools respectively. When one of the exchange units is arranged in an exchange position the retained crimping tool can be moved in a first direction between the processing position and the one exchange unit. The first exchange unit is moved linearly from the exchange position in a second direction, and the second exchange unit is moved linearly from the exchange position in a third direction that is different from the second direction, the second direction being at an angle relative to the third direction.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: May 10, 2022
    Assignee: KOMAX HOLDING AG
    Inventors: Marco Della Torre, Stefan Viviroli
  • Patent number: 11322278
    Abstract: A system is provided for wire processing. The wire processing system may include a wire transport, a processing station that may provide wire to the wire transport, a processing station that may move an electrical component threaded onto the wire, and a processing station that may move the electrical component to a position on the wire for further processing.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 3, 2022
    Assignee: THE BOEING COMPANY
    Inventor: John Porter
  • Patent number: 11317519
    Abstract: Fabrication of superconducting devices that combine or separate direct currents and microwave signals is provided. A method can comprise forming a direct current circuit that supports a direct current, a microwave circuit that supports a microwave signal, and a common circuit that supports the direct current and the microwave signal. The method can also comprise operatively coupling a first end of the direct current circuit and a first end of the microwave circuit to a first end of the common circuit. The direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a capacitor. Alternatively, the direct current circuit can comprise a bandstop circuit and the microwave circuit can comprise a bandpass circuit. Alternatively, the microwave circuit can comprise a capacitor and the direct current circuit can comprise one or more quarter-wavelength transmission lines.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: April 26, 2022
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Baleegh Abdo, Markus Brink
  • Patent number: 11316395
    Abstract: A method of manufacturing an armature coil includes steps of arranging a plurality of coil conductors of the armature coil between an end metal die and a back portion metal die on a lower metal die; pressing, with the upper metal die in a pressing direction, the plurality of the coil conductors arranged between the end metal die and the back portion metal die on the lower metal die; and removing coil conductors that become formed in a convex shape and a concave shape from the lower metal die. The upper metal die may be provided with an inclined portion on a lower metal die side of the upper metal die, and the upper metal die may be configured to be pressed such that a space is formed by the dies, the space having a width that gets gradually narrower.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: April 26, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Koji Tamura, Shuichi Tamura, Akihiro Yamamura, Issei Doi, Hiroyuki Matsuo, Yasukazu Nishimura, Sachiko Kawasaki, Akihiko Mori
  • Patent number: 11304303
    Abstract: Methods for forming electrical circuitries on three-dimensional (3D) structures and devices made using the methods. A method includes forming selectively shaped 3D structures using additive manufacturing. The method includes forming undercuts on upper-level pedestals of the 3D structures that effectively act as overhanging deposition masks for selectively preventing deposition of a selected material on a corresponding portions of lower levels. The method includes simultaneously forming and electrically isolating materials directionally deposited on the 3D structure.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: April 12, 2022
    Assignee: DUJUD LLC
    Inventor: Reza Abbaspour