Patents Examined by A. Dexter Tugbang
  • Patent number: 11915841
    Abstract: A method of manufacturing a wire harness having an electric wire and a protection tube covering, one end side of the electric wire being provided with a large-dimension portion greater than an inner dimension of the protection tube, including shaping the electric wire protection tube made of shape-memory polymer into a tube shape; expanding the protection tube by heating to a temperature equal to or higher than a glass-transition point such that the inner dimension of the protection tube becomes larger than the large-dimension portion; cooling the protection tube to a temperature below the glass-transition point and solidifying the protection tube; passing the large-dimension portion and the electric wire inside the protection tube; and reheating the electric wire protection tube to a temperature equal to or higher than the glass-transition point such that the electric wire protection tube is restored to the inner dimension obtained after the step of shaping.
    Type: Grant
    Filed: January 19, 2022
    Date of Patent: February 27, 2024
    Assignee: YAZAKI CORPORATION
    Inventors: Hirotaka Kiyota, Masaru Kiuchi
  • Patent number: 11903137
    Abstract: A clinch mechanism for assembling a printed circuit board with electronic components includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: February 13, 2024
    Assignee: UNIVERSAL INSTRUMENTS CORPORATION
    Inventors: Koenraad Alexander Gieskes, Joan Sorin Nicolescu
  • Patent number: 11903319
    Abstract: The present invention is directed to improving an insulating property of a backing in which a lead array is buried. The method includes a coating forming process, in which insulating coatings are formed with respect to at least a plurality of lead rows included in a plurality of lead frames; after the forming of the insulating coatings, a plate manufacturing process, in which a plurality of backing plates are manufactured by pouring a backing material towards a lead row in each of the plurality of lead frames so that the lead row and the backing material are integrated with each other; and a laminating process, in which the plurality of backing plates are laminated.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: February 13, 2024
    Assignee: FUJIFILM Healthcare Corporation
    Inventors: Hidetsugu Katsura, Yoshihiro Tahara, Kazuhiro Kobayashi
  • Patent number: 11895921
    Abstract: A preparation method for a piezoelectric fiber is provided including a piezoelectric functional layer and an insulating layer coated on the piezoelectric functional layer. The piezoelectric functional layer includes a piezoelectric composite layer of a spiral winding structure, and the piezoelectric composite layer includes a first piezoelectric layer, a conductive layer and a second piezoelectric layer that are sequentially stacked. The preparation method includes taking one end of the piezoelectric composite layer as a winding axis, winding the piezoelectric composite layer in a direction perpendicular to the winding axis to form the piezoelectric functional layer, wherein turns of winding the piezoelectric composite layer are greater than 5, coating the piezoelectric functional layer with the insulating layer, and vacuum heating to consolidate, to prepare a preform rod.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: February 6, 2024
    Assignees: NANTONG TEXTILE & SILK IND TECH RES INST, SOOCHOW UNIVERSITY
    Inventors: Yuqing Liu, Yuting Wang, Jing Hu, Xin Yang, Ranran Li, Jian Fang
  • Patent number: 11894648
    Abstract: A dieless crimp head is provided that includes a frame, an indentor, and a first positioning device. The frame has a first frame shell and a second frame shell, which define a frame opening. The indentor converges on a crimp center within the frame opening. The first positioning device has a connector slot defining a connector receipt area. The first positioning device is removably secured in the frame opening of the first frame shell at a use position in which the connector receipt area and the crimp center are aligned with, but offset along, a longitudinal axis of the crimp head.
    Type: Grant
    Filed: September 15, 2020
    Date of Patent: February 6, 2024
    Assignee: Hubbell Incorporated
    Inventor: Cameron Michael-Daniel Torrey
  • Patent number: 11895780
    Abstract: A method of manufacturing package structures includes providing a carrier including a supporting layer, a metal layer, and a release layer between the supporting layer and the metal layer at first. Afterwards, a composite layer of a non-conductor inorganic material and an organic material is disposed on the metal layer. Then, a chip embedded substrate is bonded on the composite layer. Afterwards, an insulating protective layer having openings is formed on the circuit layer structure and exposes parts of the circuit layer structure in the openings. Afterwards, the supporting layer and the release layer are removed to form two package substrates. Then, each of the package substrates is cut.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: February 6, 2024
    Assignee: Unimicron Technology Corp.
    Inventors: Kai-Ming Yang, Chen-Hao Lin, Wang-Hsiang Tsai, Cheng-Ta Ko
  • Patent number: 11889632
    Abstract: A feeder includes a sprocket that feeds a tape accommodating multiple components; a motor that rotates the sprocket; a storage section to store the rotational position of the sprocket detected by a sensor as an initial rotational position when the tape is set in the feeder and store a cumulative feeding amount of the tape fed by the rotation of the sprocket; and a control section to control the motor such that the sprocket rotates in a forward direction based on a feeding amount of the tape required for a supply when supplying the components to the component mounting machine, and control the motor such that the sprocket does not rotate in a reverse direction in excess of the initial rotational position based on the initial rotational position and the cumulative feeding amount when rewinding the tape.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: January 30, 2024
    Assignee: FUJI CORPORATION
    Inventors: Akira Hara, Yuichi Shimamoto
  • Patent number: 11887755
    Abstract: A device for marking a conductor includes: a gripper for gripping the conductor extending in a longitudinal direction; a heating jaw assembly having two jaws spaced from each other in an open position in a first transverse direction transverse to the longitudinal direction; and a transport mechanism for dispensing a foil tape extending along the first transverse direction on a first side of the heating jaw assembly, a foil side of the foil tape facing away from the heating jaw assembly being weldable by heat and a foil side of the foil tape facing the heating jaw assembly including a marking of the conductor; and a gripper mechanism for moving the gripper along a second transverse direction transverse to the longitudinal direction and transverse to the first transverse direction when the heating jaw assembly is in the open position. The gripper moves the gripped conductor.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: January 30, 2024
    Assignee: PHOENIX CONTACT GMBH & CO. KG
    Inventor: Jens Ruppert
  • Patent number: 11881329
    Abstract: A fire resistant coaxial cable and method of making is described that has a 2-part dielectric made of a polymer foam and a ceramifiable silicone rubber. The polymer foam, which can be polypropylene or other polymers, leaves little-to-no residue in the cable that causes electromagnetic loss when upon burning. The polymer foam can be extruded over a center conductor using an inert gas, such as nitrogen, to propagate the foam, ensuring little-to-no residue in the cable. The ceramifiable silicone rubber can be extruded over the polymer foam. The ceramifiable silicone rubber can have a polysiloxane matrix with inorganic flux and refractory particles that ceramify under high heat, such as temperatures specified by common fire test standards (e.g., 1850° F./1010° C. for two hours). The cable is configured to maintain a relatively coaxial relation between a center conductor and an outer conductor even under aforementioned fire tests.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: January 23, 2024
    Assignee: American Fire Wire, Inc.
    Inventor: William E. Rogers
  • Patent number: 11876358
    Abstract: A method for creating a flexible transition joint between HVDC-MI cables having different diameters. The central wires of the conductors are thermally joined by a conical connection piece. The strands of the layers of stranded wires surrounding the central wires are rewound, cut and thermally joined along their respective lay lengths. The stranded are sanded/ground along the lay length of the strands to form a smooth uniform transition having the same slope as the conical connection piece. A paper lapping machine is used to form an insulation patch over the transition joint.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: January 16, 2024
    Assignee: NEXANS
    Inventors: Gard Nielsen, Ben Kristian Johansen
  • Patent number: 11849545
    Abstract: A circuit formation method includes: a protruding portion formation step of forming a protruding portion by applying a curable viscous fluid onto a base and curing the curable viscous fluid; a wiring formation step of forming a wiring extending toward the protruding portion by applying a metal-containing liquid containing nanometer-sized metal fine particles onto a base and making the metal-containing liquid conductive; a paste application step of applying a resin paste containing micrometer-sized metal particles different from the metal-containing liquid on the protruding portion and the wiring, such that the protruding portion and the wiring are connected to each other; and a component placement step of placing a component having an electrode on the base, such that the electrode is in contact with the resin paste applied on the protruding portion.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: December 19, 2023
    Assignee: FUJI CORPORATION
    Inventors: Kenji Tsukada, Ryojiro Tominaga
  • Patent number: 11837381
    Abstract: A method of manufacturing a cable includes at least one elongated electrically conducting element and at least one composite layer surrounding the elongated electrically conducting element. The composite layer is obtained from at least one step of impregnation of a non-woven fibrous material with a geopolymer composition.
    Type: Grant
    Filed: June 18, 2020
    Date of Patent: December 5, 2023
    Assignee: NEXANS
    Inventors: Franck Gyppaz, Thierry Auvray, Nicolas Estreboou
  • Patent number: 11817235
    Abstract: The device and the method are used for the automatic assembly of an in particular twisted pair of wires, wherein the pair of wires has two wire elements each with a contact element arranged at one end of a wire end. The respective contact elements are brought into a predetermined rotary position by gripping the wire pair with a main gripper which has an axis of rotation about which it can rotate, and wherein the wire ends are each gripped by a gripping element. The respective contact element is brought into the predetermined rotary position by rotating the pair of wires by way of the main gripper.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: November 14, 2023
    Assignee: LEONI Bordnetz-Systeme GmbH
    Inventors: Tim Herrmann, Roland Jaecklein, Sarah Kopp, Paulo Martins, Ana Carolina Roquez Buitrago
  • Patent number: 11805632
    Abstract: Provided is an electronic part package body including a carrier tape having a plurality of electronic part housing portions arranged in a longitudinal direction, and a cover tape covering at least the electronic part housing portions by being laminated to the carrier tape. The carrier tape includes a first bonded portion and a second bonded portion that are arranged on outsides of both end portions of the plurality of electronic part housing portions, both end portions being end portions in a width direction of the carrier tape, and are arranged in the longitudinal direction of the carrier tape. One of or both the first bonded portion and the second bonded portion include a reentrant part disposed so as to be continuous from the outside of an electronic part housing portion to a region between electronic part housing portions.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: October 31, 2023
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kazuo Sugai, Atsushi Satori
  • Patent number: 11799436
    Abstract: A method of forming a resonator includes forming top and bottom dielectric structures over a substrate. A piezoelectric layer is formed between the top and bottom dielectric structures. A bottom electrode is formed between the piezoelectric layer and the bottom dielectric structure, and a top electrode is formed between the piezoelectric layer and the top dielectric structure. A metal layer is formed over the top dielectric structure and is patterned, thereby forming a first contact pad making electrical contact to the top electrode, a second contact pad making electrical contact with the bottom electrode, and a mass bias located over the top dielectric structure.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: October 24, 2023
    Assignee: Texas Instruments Incorporated
    Inventors: Byron Neville Burgess, William Robert Krenik, Stuart M. Jacobsen
  • Patent number: 11791067
    Abstract: Bundled cables and methods for preparing bundled cable are disclosed herein. In the method, a plurality of subunits is wound about a central member. The subunits include a subunit jacket made of a first thermoplastic composition and has a first outer surface, and the central member includes a central member jacket made of a second thermoplastic composition and has a second outer surface. A metal element is provided at an interface of the second outer surface and the first outer surface of the subunits. The metal element is heated such that at least one of the first thermoplastic composition or the second thermoplastic composition forms bonds with the other of the first thermoplastic composition or the second thermoplastic composition.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: October 17, 2023
    Assignee: CORNING RESEARCH & DEVELOPMENT CORPORATION
    Inventors: David Ralph Maack, Lars Kristian Nielsen, James Arthur Register, III, William Taylor Rowell
  • Patent number: 11785675
    Abstract: A method of forming a plurality of individual heating cables sets includes creating at least a portion of a master cable set by coupling alternating sections of cold and hot cable section, each section of cold cable section having a length twice a model cold cable section length and each section of hot cable section having a length twice a model hot cable section length. A continuous metallic ground sheath is applied about substantially all of the master cable set and a continuous outer jacket is applied about the continuous metallic ground sheath. The master cable set is segmented at defined locations to create a plurality of individual heating cable sets having an overall length of the model hot cable section length plus the model cold cable section length.
    Type: Grant
    Filed: August 29, 2019
    Date of Patent: October 10, 2023
    Assignee: Schluter Systems L.P.
    Inventor: Gilles Gagnon
  • Patent number: 11764547
    Abstract: A method for manufacturing a surge absorbing device is provided. The method includes providing an elongate ceramic tube having a hollow space defined therein and having open and opposite first and second end; forming a first plating layer and a second plating layer on the first end and the second end, respectively; placing a surge absorbing element within the hollow space within the ceramic tube; disposing first and second brazing rings on the first plating layer and the second plating layer, respectively; disposing first and second sealing electrodes on the first and second brazing rings respectively; and melting the first and second brazing rings in an inert gas atmosphere to attach the first and second sealing electrodes onto the first plating layer and the second plating layer, respectively.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: September 19, 2023
    Assignees: AJOU UNIVERSITYINDUSTRY-ACADEMIC COOPERATION FOUNDATION, SMART ELECTRONICS INC.
    Inventors: Chang-Koo Kim, Hae-Min Lee, Doo Won Kang, Hyun Chang Kim
  • Patent number: 11765839
    Abstract: A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.
    Type: Grant
    Filed: October 10, 2018
    Date of Patent: September 19, 2023
    Assignee: SCHLUMBERGER TECHNOLOGY CORPORATION
    Inventors: Steven O. Dunford, Mark Kostinovsky, Lweness Mazari
  • Patent number: 11744022
    Abstract: A method of forming a multi-layer circuit on a curved substrate includes forming, by a laser direct structuring process, a first layer of the multi-layer circuit on a first surface of the curved substrate. The method includes applying a first layer of paint to the first layer of the multi-layer circuit. The method includes forming, by the laser direct structuring process, a second layer of the multi-layer circuit on the first layer of the paint and electrically coupled to the first layer of the multi-layer circuit. The method includes applying a second layer of paint over the second layer of the multi-layer circuit and forming, by the laser direct structuring process, a third layer of the multi-layer circuit on the second layer of the paint and electrically coupled to the second layer of the multi-layer circuit.
    Type: Grant
    Filed: November 29, 2021
    Date of Patent: August 29, 2023
    Assignee: Kyocera AVX Components (San Diego), Inc.
    Inventors: Seung Hyuk Choi, Hyun Jun Hong, Tae Wook Kim, Cheong Ho Ryu, Young Sang Kim, Sung Jun Kim