Patents Examined by A. L. Carrillo
  • Patent number: 5512339
    Abstract: This invention relates to decomposable polyamide masses for packaging materials containing 5 to 25% by weight of an addition of linear, oligomeric aliphatic polyesters or polycarbonates with molecular weights from 800 to 4000. These additives preferably consist of polyesters of aliphatic diols and dicarboxylic acids having up to 10 carbon atoms or aliphatic carbonates having up to 10 carbon atoms.The use of such mixtures for easily degradable, decomposable polyamide packages is also claimed, in particular in the form of films or thin walled injection moulded parts for (food) packaging.
    Type: Grant
    Filed: October 22, 1993
    Date of Patent: April 30, 1996
    Assignee: Bayer AG
    Inventors: Ralf Dujardin, Rolf Dhein, Martin Wandel
  • Patent number: 5510424
    Abstract: Homogeneous polymer alloys based on sulfonated, aromatic polyether ketonesHomogeneous polymer alloys comprising sulfonated, aromatic polyether ketones and at least one polyamide as the main constituents, wherein the polyamide is a completely aromatic polyamide.
    Type: Grant
    Filed: February 2, 1995
    Date of Patent: April 23, 1996
    Assignee: Hoechst Aktiengesellschaft
    Inventors: Freddy Helmer-Metzmann, Otto Hermann-Schonherr, Uwe Kampschulte
  • Patent number: 5508351
    Abstract: Disclosed is a golf ball which comprises a core and a cover covering said core, characterized by that said cover comprises a resin component of(a) 10 to 80 wt % of a saponified polymer obtained by saponifying at least a portion of the ester groups of a copolymer of an olefine having 2 to 8 carbon atoms and an unsaturated acrylate having 3 to 8 carbon atoms with an alkali metal selected from the group consisting of Li, Na, K and mixture thereof, and(b) the remaining amount of an ionomer resin.
    Type: Grant
    Filed: August 6, 1993
    Date of Patent: April 16, 1996
    Assignee: Sumitomo Rubber Industries, Ltd.
    Inventors: Kuniyasu Horiuchi, Akihiko Hamada
  • Patent number: 5506311
    Abstract: In one aspect, the present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carrying out condensation of 4,4'-bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a different diamine compound and optionally with a different tetracarboxylic acid dianhydride.In a second aspect, the present invention relates to a heat resistant resin composition consisting essentially of an aromatic polyetherimide and a defined polyimide.In a third aspect, the present invention relates to a polyimide resin composition comprised on a defined polyimide and a separate high-temperature engineering polymer.In a fourth aspect, the present invention relates to a resin composition comprised of a defined polyimide and an aromatic polyamideimide.
    Type: Grant
    Filed: November 3, 1994
    Date of Patent: April 9, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Shoji Tamai, Masahiro Ohta, Saburo Kawashima, Katsuaki Iiyama, Hideaki Oikawa, Akihiro Yamaguchi
  • Patent number: 5506291
    Abstract: A fatigue-resistant polyimide resin composition comprising 100 parts by weight of polyimide having from 0.5 (exclusive) to 1.0 (inclusive) mole ratio of recurring structural units represented by the formula (1) and from 0 (inclusive) to 0.5 (exclusive) mole ratio of recurring structural units represented by the formula (2): ##STR1## wherein X is ##STR2## in the formulas (1) and (2), and having an inherent viscosity of 0.45 dl/g or more; and 5.about.65 parts by weight of a carbon fiber, glass fiber, aromatic polyamide fiber and/or potassium titanate fiber, and an injection molded article having a high fatigue resistance.
    Type: Grant
    Filed: October 12, 1994
    Date of Patent: April 9, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Yuichi Okawa, Yoshihiro Sakata, Wataru Yamashita, Katsuaki Iiyama, Shoji Tamai, Akihiro Yamaguchi
  • Patent number: 5506298
    Abstract: Polyamide graft-modified rubbery block copolymer compositions are provided by reaction of maleated rubbery block copolymers with polymeric dimer fatty acid based polyamide wherein the molar ratio of maleated rubbery block copolymer to the dimer fatty acid polyamide is greater than 2 to 1. The compositions find use as hot melt adhesive components.
    Type: Grant
    Filed: April 12, 1994
    Date of Patent: April 9, 1996
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Charles W. Paul, Jules E. Schoenberg
  • Patent number: 5504185
    Abstract: A process for the production of a polyamide, which comprises polycondensing adipic acid prepared by nitric acid oxidation and containing 1 ppm by weight or less of a free mineral acid as an impurity with a diamine represented by formula (1)H.sub.2 N--CH.sub.2 --R--CH.sub.2 --NH.sub.2 . . . (1)wherein R denotes a linear or branched alkylene group having 2 to 10 carbon atoms, a m-phenylene group, a p-phenylene group, a 1,3-cyclohexylene group or a 1,4-cyclohexylene group; a polyamide produced by said process; and a film or sheet made of the above polyamide.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: April 2, 1996
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Tsukasa Toki, Masahiro Harada, Yasuo Inaba
  • Patent number: 5504151
    Abstract: This invention is the polycapped oligomer adduct of a long chain fatty acid with a multi hydroxy functional or multi epoxy functional compound. This polycapped oligomer is useful in resin compositions to enhance the performance of thermoplastic low profile additives which improve the surface quality of molded composites such as automotive body panels.
    Type: Grant
    Filed: November 8, 1994
    Date of Patent: April 2, 1996
    Assignee: Ashland Inc.
    Inventors: Dennis H. Fisher, Timothy A. Tufts, C. Timothy Moss
  • Patent number: 5500478
    Abstract: Thermoplastic resin compositions consisting of 1 to 40 wt % a polyether ester amide (A) and 99 to 60 wt % of at least one thermoplastic resin (B) selected from styrene based resins, further containing (C) 0.1-10% of a modified vinyl polymer containing carboxyl groups, are permanently antistatic, excellent in mechanical properties represented by impact resistance, heat resistance moldability and also in the appearance and gloss of the moldings, and suitable for housings of optical or magnetic recording media.
    Type: Grant
    Filed: May 10, 1994
    Date of Patent: March 19, 1996
    Assignee: Toray Industries, Inc.
    Inventors: Tadao Fukumoto, Masatoshi Iwamoto, Akihiko Kishimoto
  • Patent number: 5496876
    Abstract: Improved thermoplastic compositions adopted for easy conversion, e.g., by injection molding or extrusion techniques, into useful shaped articles having high flexibility, and good tear resistance and elasticity, include a polyetheramide, advantageously a polyetheresteramide, and a styrene/diene copolymer, e.g., a copolymer of styrene with butadiene or isoprene, notably a linear or branched chain styrene/butadiene/styrene or styrene/isoprene/styrene copolymer.
    Type: Grant
    Filed: September 28, 1994
    Date of Patent: March 5, 1996
    Assignee: Atochem
    Inventors: Jean-Pierre Jacquemin, Gerard Deleens
  • Patent number: 5496888
    Abstract: Resin compositions, comprising (A) a styrene/acrylic polymer and (B) a polyester dispersed therein with an average particle size of not more than 3 .mu., are obtained by quenching a mixture of (A) and (B) melted at 150.degree.-200.degree. C., below the glass transition temperature of the polymer (A) within 5 minutes, and are of good thermal shelf stability and electrical properties and provide toner binders of high hot offset causing temperature and improved low temperature fixing properties.
    Type: Grant
    Filed: March 15, 1994
    Date of Patent: March 5, 1996
    Assignee: Sanyo Chemical Industries, Ltd.
    Inventors: Masaharu Nishida, Tohru Ohhama
  • Patent number: 5494980
    Abstract: A water-dispersible hybrid polymer comprises an ethylenically unsaturated polyurethane (core) onto which an addition polymer chain (shell) has been provided by polymerization, with the unsaturation of the polyurethane being achieved by the incorporation therein of dimethyl-m-isopropenyl benzyl isocyanate, and the acid number of the shell polymer being in the range of 30 to 120 (mg KOH/g). Aqueous dispersions of these hybrid polymers are pre-eminently suitable for use in aqueous coating compositions of the so-called clear coat type, particularly when stringent demands are imposed with regard to the acid resistance of the topcoats applied using these compositions.
    Type: Grant
    Filed: April 6, 1995
    Date of Patent: February 27, 1996
    Assignee: Akzo Nobel NV
    Inventors: Roelof Buter, Andreas H. J. Roelofs
  • Patent number: 5492980
    Abstract: Thermoplastic molding resin composition comprising 70-95 weight % of aliphatic polyamide, 5-30 weight % of phenolic resin, and 0-20 % of semi-aromatic amorphous polyamide, and further high density polyamide composition comprising 100 parts by weight of the mixture of 60-95 parts by weight of aliphatic crystalline polyamide, 5-30 parts by weight of phenolic resin, and 200-1000 parts by weight of metal powder or metal oxide powder or inorganic filler having specific gravity of more than 2.6.
    Type: Grant
    Filed: October 7, 1993
    Date of Patent: February 20, 1996
    Assignee: Kishimoto Sangyo Co., Ltd.
    Inventor: Takeshi Moriwaki
  • Patent number: 5492979
    Abstract: A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-15082) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.
    Type: Grant
    Filed: April 4, 1994
    Date of Patent: February 20, 1996
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Patent number: 5482997
    Abstract: Impact resistant polyamide composition containing more than 45 wt. % polyamide and relatively minor amounts of an impact modifier. The impact modifier is an elastomer with groups that are reactive with respect to the polyamide. The impact modifier has an adverse effect on the high-temperature properties, which were already poor. According to the invention, compositions of polyamide, impact modifier and a copolymer of a vinylaromatic compound, in particular styrene, and maleic anhydride have improved high-temperature properties while maintaining good impact resistance.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: January 9, 1996
    Assignee: Stamicarbon B.V.
    Inventors: Wilhelmus A. M. Debets, Herman A. J. Schepers
  • Patent number: 5480945
    Abstract: Novel orientable single and multilayer thermoplastic flexible films utilizing blends comprising an amorphous nylon copolymer such as nylon 6I/6T and a nylon copolyamide having a melting point of at least about 145.degree. C. having improved processability, shrinkage and optical properties.
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: January 2, 1996
    Assignee: Viskase Corporation
    Inventor: Stephen J. Vicik
  • Patent number: 5480944
    Abstract: This invention relates to polymeric interpenetrating blends comprising a polymer matrix having dispersed therein a branched fractal three dimensional polymer species which comprises rigid aromatic recurring units linked by electrophilic or nucleophilic reactive moieties or derivatives thereof.
    Type: Grant
    Filed: August 23, 1993
    Date of Patent: January 2, 1996
    Assignee: AlliedSignal Inc.
    Inventor: Shaul M. Aharoni
  • Patent number: 5480937
    Abstract: In accordance with the present invention, there are provided thermoplastic resin compositions comprising 80-40 parts by weight of specific aromatic polyamides (A) containing 30-100 mol% of terephthalic acid component units and 20-60 parts by weight of modified polyolefins (B) graft modified with .alpha.,.beta.-unsaturated carboxylic acid, anhydride or derivative thereof and having a crystallinity index of at least 35% or a glass transition temperature of at least 90.degree. C. and an intrinsic viscosity [.eta.]of 0.4-35 dl/g. With these compositions, there are prepared sliding parts such as gear and cam and electrical molding parts such as connector.
    Type: Grant
    Filed: January 24, 1994
    Date of Patent: January 2, 1996
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventor: Yukio Yoshihara
  • Patent number: 5478880
    Abstract: The present invention is directed to a printable release composition used for pressure sensitive labels and the like. The invention is also directed to an article, such as a label, that comprises a substrate such as paper, optionally a thermal transfer primer coating coated onto the substrate and a release layer coated onto the transfer primer coating or onto the substrate. The printable release composition of the present invention may be used with labels having permanent, repositionable or removable adhesives. The particular composition of the release layer depends on the type of adhesive that is appropriate for the desired end use.
    Type: Grant
    Filed: February 1, 1994
    Date of Patent: December 26, 1995
    Assignee: Moore Business Forms, Inc.
    Inventors: Adele C. Shipston, David K. Rice, II
  • Patent number: 5476892
    Abstract: Polyols are conditioned and stabilized by mixing them at 0 to 150.degree. C. with from about 0.0001 to about 1% by weight, based on the quantity of polyol, of a silylated acid corresponding to the formula:X--[Si(CH.sub.3).sub.3 ].sub.nin whichX represents a neutral acid residue obtained by removal of the acidic hydrogen atoms from an n-basic acid having a maximum pKa value of 3, provided that the n-basic acid is not a hydrohalic acid andn represents an integer of from 1 to 3.The resultant polyol is characterized by good color and activity properties. The stabilized polyols are particularly useful in the production of polyurethanes, particularly polyurethane foams.
    Type: Grant
    Filed: December 9, 1993
    Date of Patent: December 19, 1995
    Assignee: Bayer Aktiengesellschaft
    Inventors: Hans J. Scholl, Hartmut Nefzger, Helmut Reiff, Bernd Quiring