Abstract: The present disclosure relates to a fine dust removal system including a conductive filter module, and more particularly, to a fine dust removal system having a conductive filter module which includes a cylindrical conductive filter to thereby implement high fine dust removal efficiency with low pressure loss and which can be easily, generally applied to and used in an air cleaner to be installed in windows or in an independent indoor air cleaner.

Abstract: The present invention relates to an electrification device and an electrical dust collecting apparatus including the same capable of adsorbing and filtering fine dust included in air in an air conditioning apparatus such as an air conditioner or an air cleaner, and more particularly, to an electrification device and an electrical dust collecting apparatus including the same capable of improving dust collecting efficiency by performing stable electrification at an accurate position using an electrification electrode in which an electrification pin and an electrode rod are formed integrally with each other.

Abstract: A semiconductor substrate measuring apparatus includes a light source to generate irradiation light having a sequence of on/off at a predetermined interval, the light source to provide the irradiation light to a chamber with an internal space for processing a semiconductor substrate using plasma, an optical device between the light source and the chamber, the optical device to split a first measurement light into a first optical path, condensed while the light source is turned on, to split a second measurement light into a second optical path, condensed while the light source is turned off, and to synchronize with the on/off sequence, and a photodetector connected to the first and second optical paths, the photodetector to subtract spectra of first and second measurement lights to detect spectrum of reflected light, and to detect plasma emission light emitted from the plasma based on the spectrum of the second measurement light.

Abstract: A coated component, along with methods of its formation and use, is provided. The coated component includes a ceramic matrix composite (CMC) substrate comprising silicon carbide and having a mullite bondcoat on its surface. The mullite bondcoat includes an oxygen getter phase contained within a mullite phase. For example, the mullite bondcoat may include 60% to 98% by volume of the mullite phase. An environmental barrier coating is on the mullite bondcoat.

Abstract: A method includes providing a first plate including a first surface, a second surface opposite to the first surface, and a first recess indented from the first surface towards the second surface; providing a semiconductor structure including a third surface, a fourth surface opposite to the third surface, and a first sidewall extending between the third surface and the fourth surface; placing the semiconductor structure over the first plate; and disposing a priming material over the third surface of the semiconductor structure, wherein a peripheral portion of the fourth surface of the semiconductor structure is in contact with the first surface of the first plate upon the disposing of the priming material.

Abstract: A cutting insert may include a base member and a coating layer thereon. The coating layer may include a first layer including a titanium compound on the base member, a second layer including alumina and an upper surface on the first layer, and a third layer including a titanium compound on the upper surface. The coating layer may include a crack at a top surface and therein. In a cross section orthogonal to the top surface, the crack may be present in the third layer and the second layer; in the third layer it may have a width of 1 ?m or more. In the upper surface it may have a width of 0.5 ?m or more—smaller than the width of the crack in the third layer. Another part may have a width of 0.2 ?m or less closer to the base member than the upper surface.

Abstract: A coated tool may include a base member and a coating layer. The coating layer may include a plurality of first AlTi layers indicated by Al1-x1Tix1 and a plurality of second AlTi layers indicated by Al1-x2Tix2. The coating layer may have alternating first AlTi layers and second AlTi layers, i.e. one upon another in a direction away from the base member, and x1 may be larger than x2. The plurality of first AlTi layers may include a first region having two or more adjacent first AlTi layers, where a first AlTi layer of the two or more adjacent first AlTi layers is located farther away from the base member and is smaller in thickness than a first AlTi layer of the two or more adjacent first AlTi layers located closer to the base member.

Abstract: A lower vehicle body structure of the vehicle may include a side member extending in a longitudinal direction of a vehicle, disposed on both sides in a width direction of the vehicle and having a closed cross-section formed therein; a connecting member connected to the side member at a front or a rear based on front and rear directions of the vehicle and having a closed cross-section formed therein; and at least one pipe unit provided inside in the longitudinal direction of the side member or the connecting member to inflow a working fluid therein.

Abstract: An apparatus and a method for forming a 3-D NAND device are disclosed. The method of forming the 3-D NAND device may include forming a plug fill and a void. Advantages gained by the apparatus and method may include a lower cost, a higher throughput, little to no contamination of the device, little to no damage during etching steps, and structural integrity to ensure formation of a proper stack of oxide-nitride bilayers.

Abstract: A coated tool according to the present disclosure includes a base member and a coating layer located on the base member. The coating layer includes a first peak located in a range of 15° to 30° and a second peak located in a range of 60° to 75° in a distribution of X-ray intensity indicated at a axis of a pole figure, the X-ray intensity regarding a plane of the cubic crystal. The coating layer includes a valley part between the first peak and the second peak, and the valley part includes the X-ray intensity smaller than the X-ray intensity at each of the first peak and the second peak. The X-ray intensity at the first peak is 0.7 times or greater of the X-ray intensity at the second peak.

Abstract: A coated tool according to the present disclosure includes a base member and a coating layer located on the base member. The coating layer includes a first peak located in a range of 0° to 90° and a second peak located at a higher angle side than the first peak in a distribution of X-ray intensity indicated at ? axis of a pole figure, the X-ray intensity regarding a plane of the cubic crystal. The coating layer further includes a valley part between the first peak and the second peak, and the valley part includes the X-ray intensity smaller than the X-ray intensity at each of the first peak and the second peak.

Abstract: A component of a turbine, in particular a gas turbine, wherein the component has a coating for increasing the erosion and corrosion resistance, wherein the coating is preferably applied directly to the component, wherein the coating consists of a functional layer and an intermediate layer, wherein the intermediate layer is arranged between the turbine blade substrate and the functional layer and wherein the functional layer consists of the elements Al, Cr, O and N.

Abstract: A method of manufacturing an augmented LED array assembly is described which comprises providing an LED array assembly configured for inclusion in an LED lighting circuit, the LED array assembly comprising a micro-LED array mounted onto a driver integrated circuit, the driver integrated circuit comprising contact pads configured for electrical connections to a circuit board assembly; providing an essentially planar carrier comprising a plurality of contact bridges, each contact bridge extending between a first contact pad and a second contact pad; and mounting the contact bridge carrier to the LED array assembly by forming solder bonds between the first contact pads of the contact bridge carrier and the contact pads of the driver integrated circuit.

Abstract: A body for a vehicle includes a first member provided at a lower portion of a front floor module extending to a front of a second member provided at a center floor module, and a third member provided at a lower portion of a rear floor module extending to a rear of the second member provided at the center floor module to form a main load path along the first, second, and third members extending from a foremost end of the vehicle to a hindmost end of the vehicle.

Abstract: A coated tool may include a base member and a coating layer located on the base member. The coating layer may include a first section located on the base member and a second section located on the first section. The first section may include an AlTi portion including aluminum and titanium, and an AlCr portion including aluminum and chromium, and each of the AlTi portion and the AlCr portion may be in contact with the base member. The second section may include a plurality of AlTi layers including aluminum and titanium, and a plurality of AlCr layers including aluminum and chromium, and the AlTi layers and the AlCr layers may be located alternately one upon another.

Abstract: Provided is a coated cutting tool having improved wear resistance and fracture resistance and a long tool life. The coated cutting tool includes a substrate, and a coating layer formed on a surface of the substrate. The coating layer has a laminated structure in which a first layer and a second layer are alternately laminated for one or more layers. The first layer is a compound layer having a composition represented by Ti(CxN1-x). The second layer is a compound layer having a composition represented by (TiyAl1-y)N. The laminated structure includes first to third laminated structures in this order from a substrate side to a surface side of the coating layer. An average thickness per layer of each of the first layer and the second layer in the first to third laminated structures is in a specific range. An average thickness of the first to third laminated structures is in a specific range.

Abstract: Provided is a coated cutting tool having a base material side single layer portion and a laminated portion provided as a hard coating in order from a base material side. The base material side single layer portion is formed of a nitride-based hard coating in which a proportion of Al is highest among metal (including metalloid) elements, a sum of Al and Cr in a content ratio (atomic ratio) is 0.9 or more, and at least B is contained. In the laminated portion, a nitride-based a layer in which a proportion of Ti is highest among metal (including metalloid) elements and at least B is contained, and a nitride-based b layer in which a proportion of Al is highest among metal (including metalloid) elements and at least Cr and B are contained are alternately laminated.

Abstract: A cutting tool comprising a base material and a coating arranged on the base material; wherein: the coating comprises an ?-Al2O3 layer composed of a plurality of ?-Al2O3 particles; the average particle diameter a of the ?-Al2O3 particles in a first region of the ?-Al2O3 layer is 0.10 ?m or more and 0.30 ?m or less; the average particle diameter b of the ?-Al2O3 particles in a second region of the ?-Al2O3 layer is 0.30 ?m or more and 0.50 ?m or less; the average particle diameter c of the ?-Al2O3 particles in a third region of the ?-Al2O3 layer is 0.10 ?m or more and 0.30 ?m or less; and the ratio b/a is 1.5 or more and 5.0 or less.

Abstract: A semiconductor device is provided. The device includes a first pair and a second pair of source/drain features over a semiconductor substrate. The first pair of source/drain features are p-type doped. The second pair of source/drain features are n-type doped. A first stack of semiconductor layers connect the first pair of source/drain features along a first direction. A second stack of semiconductor layers connect the second pair of source/drain features along a second direction. A first gate is between vertically adjacent layers of the first stack of semiconductor layers. The first gate has a first portion that has a first dimension along the first direction. A second gate is between vertically adjacent layers of the second stack of semiconductor layers. The second gate has a second portion that has a second dimension along the second direction. The second dimension is larger than the first dimension.

Abstract: The present invention provides a powdered vinegar that comprises partly neutralized vinegar, i.e. vinegar derived acid that is partly neutralized with e.g. sodium and/or potassium hydroxide, and free vinegar derived acid. The invention also provides a process for producing such a powdered vinegar and the use of this powdered vinegar in a foodstuff or a beverage, e.g. as a preservative. The present process offers the advantage that it yields a stable, free flowing powdered vinegar that can suitably be used as a preservative in e.g. processed meat products. The powdered vinegar has a high content of free acid, is easy to dissolve and acts as an acidulant.