Abstract: A thermal management system and method for cooling a CT detector assembly of a CT imaging system. The thermal management system uses a combination of air cooling for the readout electronics of the CT detector assembly and liquid cooling for the X-ray sensors of the CT detector assembly. The hybrid air and liquid cooling systems and methods may be coupled together in the thermal management system and method to create a cooler temperature in the CT detector assembly. The CT detector assembly components may include CT detector modules, which may include X-ray sensors, readout electronics and other components.

Abstract: A flow chamber, a cooling system and a method are described. The flow chamber includes an upper chamber including a top wall, an actuator, and a lower chamber. The actuator is located distally from the top wall. The lower chamber receives fluid from the upper chamber when the actuator is actuated. The top wall includes at least one cavity therein. The cooling system utilizes cooling cells including the flow chamber. The method includes driving the actuator at a frequency that directs fluid through the flow chamber.

Abstract: The protective corner apparatus is fitted along a portable mobile device, such that the protective corner apparatus provides sufficient protection while maintaining and complementing the core aesthetic design of the portable smart device. The protective corner apparatus contains a first protective layer, and a second protective layer. The first protective layer contains a first backing, a first mounting surface, and at least one retaining hook. The second protective layer contains a second backing, a second mounting surface, a slit, and a retaining ridge. The first protective layer is connected adjacent to the second protective layer. The first mounting surface is positioned on the first backing. The at least one retaining hook is angularly connected to the first backing. The second mounting surface is positioned on the second backing. The retaining ridge is angularly connected to the second backing. The slit is positioned between the second backing and the retaining ridge.

Abstract: An electronics enclosure system includes a pressure housing with a thermally conductive material and a plurality of shells disposed within the pressure housing, wherein the plurality of shells are coupled together to form an enclosure, and wherein each shell of the plurality of shells comprises thermally conductive material. The electronics enclosure system further includes at least one circuit board secured to an inner surface of a respective shell of the plurality of shells and a plurality of electronic components secured to the at least one circuit board, the plurality of shells, or some combination thereof.

Abstract: A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.

Abstract: A thin, single-layer thermally conductive jacket surrounds a PCA. One or more living springs integrated in the jacket exert compressive force on PCA components where cooling is desired. The compressive force creates and maintains a thermal contact though which heat is conducted out of the PCA components and into the jacket. The jacket conducts the heat (either directly or indirectly) to a liquid-cooled cold plate configured as a cooling frame surrounding one or more of the jacketed PCAs. The jacket, optionally through intermediate thermal transfer devices such as heat spreaders or heat pipes, transfers heat from components on the PCA to the cooling frame. Liquid flowing through the cooling frame's internal channels convects the heat out of the electronic device. Turbulence encouraged by turbulence enhancing artifacts including bends and shape-changes along the internal channels increases the efficiency of the convection.

Abstract: In one embodiment, a liquid cooling system includes a coolant distribution device including a first set of fluid connectors to receive a cooling liquid and a second set of fluid connectors to distribute coolant to a cooling device and a cooling device coupled to the coolant distribution device. The cooling device includes an elongated chassis, a cooling plate integrated, contained, and/or prefabricated within the elongated chassis of the cooling device, and a fluid distribution channel integrated within the elongated chassis to provide cooling liquid to the cooling plate. The cooling device further includes fluid connectors to receive the cooling liquid from a coolant distribution device and a blocking channel disposed between the cooling plate and the fluid connectors, the blocking channel to mate with a blocking plate of the coolant distribution device.

Abstract: An electronic board assembly comprises a board comprising an electronic component and a connector mounted to the board and electrically connected to the electronic component. The connector is configured to receive an electronic card assembly, and the connector comprises an electrical contact and a friction contact. The electrical contact is configured to exert a first amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The friction contact is configured to exert a second amount of force on the electronic card assembly when the electronic card assembly is being seated in the connector. The second amount of force is greater than the first amount of force.

Abstract: A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid therethrough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.

Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.

Abstract: A coil component includes: first and second magnetic cores having first and second flat plate portions; a winding having a hollow core portion; first and second heat dissipation metal plates having first and second heat dissipation plane and first and second heat conduction portions, at least either one of the first and second flat plate portions has a middle leg, the middle leg is inserted into the hollow core portion of a winding, and the first magnetic core and the second magnetic core are combined in such a way that the first flat plate portion and the second flat plate portion face each other, the first heat dissipation plane portion is closely attached to the first flat plate portion and the second heat dissipation plane portion is closely attached to the second flat plate portion, the first heat conduction portion is connected to the second heat conduction portion.

Abstract: A protection structure is disclosed and is applied in a fuse link switch. The fuse link switch comprises: an insulator, a fuse tube including an upper connection portion and a lower connection portion, an upper-end fixing unit, a lower-end fixing unit, and a toggle mechanism, wherein the upper connection portion is connected with a pull hook. The protection structure comprises at least one electrically insulating shielding layer covering at least one of the upper-end fixing unit, the pull hook, the upper connection portion, the lower connection portion, the lower-end fixing unit, and the toggle mechanism through overmolding technique.

Abstract: An electronic device is provided. The electronic device includes a housing having an insertion slot, a connecting interface, and an adaptor card. The connecting interface is disposed in the housing for connecting with a first electronic module or a second electronic module separately and has a first connecting part and a second connecting part. The adaptor card is detachably disposed in the housing and includes a flow guide. When the electronic device is in a first mode, the first electronic module is connected to the first connecting part, and the adaptor card is disposed between the insertion slot and the connecting interface. The flow guide directs an airflow toward the first electronic module. When the electronic device is in a second mode, the adaptor card is removed from the housing, and the second electronic module is connected to the first connecting part and the second connecting part.

Abstract: An expansion system for temperature detection by means of thermomechanical expansion and movement has an expansion receptacle, an elongate fluid line which is connected in a fluid-conducting manner thereto, and a switching means which is mechanically operatively connected to the expansion receptacle for the purpose of actuation of a switching process of the switching means at a settable actuation point. A working fluid is contained in the expansion receptacle and in the fluid line. Furthermore, an activation material which is formed to change, upon contact with the working fluid or upon mixing with the working fluid, said working fluid with regard to its volume and/or its flowability is contained in the expansion system.

Abstract: A heating and air purifying apparatus using electronic device heat includes: a cabinet accommodating electronic devices including a central processing unit (CPU), a graphic processing unit (GPU), a power supply unit (PSU), and a main board, having an air inlet on a side, and having an air outlet on a top; one or more partition plates disposed vertically, horizontally, or diagonally across the inner surface of the cabinet; and a discharge fan installed at the air outlet and discharging air in the cabinet to the outside, in which a cooling fan of the GPU is disposed on a side of the one or more partition plate, a GPU body including a graphic card of the GPU is disposed on the opposite side, and the CPU, the PSU, and the main board are accommodated in a space facing a side of the one or more partition plate.

Abstract: A cooling structure for an electronic control unit which is mounted in a vehicle, includes: a duct having a flow channel on which the electronic control unit is disposed; and a blower configured to take air in the inside of the vehicle and to emit the air to the flow channel of the duct, wherein the duct is configured to: cool the electronic control unit with the air emitted from the blower; and discharge air which has been used to cool the electronic control unit to the outside of the vehicle.

Abstract: A modular power overlay architecture includes at least two sets of power overlay tiles arranged to provide for or meet a desired power overlay architecture demand. The power overlay assembly can include a base having seats to receive the power overlay tiles. The power overlay tiles can include power switching components arranged relative to a conductive surface commonly arranged relative to each of the at least two sets of power overlay tiles.

Abstract: A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.

Abstract: An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.

Abstract: An arc flash mitigation system includes a main circuit protector such as a high amperage overcurrent protection fuse, and an arc flash mitigation network connected in parallel to the main circuit protector. The arc flash mitigation network includes at least one semiconductor switch operable to provide a shunt current path to a low amperage arc mitigation fuse for a faster response time to certain circuit conditions than the main circuit protector otherwise provides. The semiconductor switch may be a silicon controller rectifier operatively responsive to a voltage drop across the main circuit protector in use.