Patents Examined by A. Vortman
  • Patent number: 11576281
    Abstract: A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.
    Type: Grant
    Filed: December 2, 2020
    Date of Patent: February 7, 2023
    Assignee: Amazon Technologies, Inc.
    Inventors: Rick Chun Kit Cheung, Luke Thomas Gregory
  • Patent number: 11570924
    Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: January 31, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Everett Lyons, Daniel Linnen, Randy Gillespie
  • Patent number: 11569623
    Abstract: A busbar connector includes an insulator body, a positive power delivery contact, a negative power delivery contact, and a side band contact. The insulator body has first prong and a second prong oriented in a longitudinal direction and proximate one another with a gap therebetween. The positive power delivery contact is on a first inner surface of the first prong adjacent the gap, and the negative power delivery contact is on a second inner surface of the second prong adjacent the gap. The side band contact is positioned on the insulator body and insulated from the positive power delivery contact and the negative power delivery contact by the insulator body.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: January 31, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Chadd Nathaniel Garton, Banha Sok, Fredrick Anthony Constantino
  • Patent number: 11559239
    Abstract: An electronic device is provided. The electronic device includes a housing, a printed circuit board disposed inside the housing and including a first face and a second face that faces away from the first face, a connection member disposed on the first face and electrically connected to the printed circuit board, a switch member disposed on the first face and at least partially overlaps the connection member when viewed from above the first face, and a button member including an electrically conductive member, and disposed to be capable of operating the switch member. The electrically conductive member is electrically connected to the connection member.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: January 24, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: June Lee, Junhui Lee, Yongyi Kim, Seunghyun Cho
  • Patent number: 11557529
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • Patent number: 11557449
    Abstract: A zero-power plasmonic microelectromechanical system (MEMS) device is capable of specifically sensing electromagnetic radiation and performing signal processing operations. Such devices are highly sensitive relays that consume no more than 10 nW of power, utilizing the energy in detected electromagnetic radiation to detect and discriminate a target without the need of any additional power source. The devices can continuously monitor an environment and wake up an electronic circuit upon detection of a specific trigger signature of electromagnetic radiation, such as vehicular exhaust, gunfire, an explosion, a fire, a human or animal, and a variety of sources of radiation from the ultraviolet to visible light, to infrared, to terahertz radiation.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: January 17, 2023
    Assignee: Northeastern University
    Inventors: Matteo Rinaldi, Zhenyun Qian, Sungho Kang, Vageeswar Rajaram
  • Patent number: 11551900
    Abstract: A fusible switch disconnect device includes a housing adapted to receive at least one fuse therein, and a switchable contact for connecting the fuse to circuitry. A tripping mechanism and control circuitry are provided to move the switchable contact to an open position in response to a predetermined electrical condition.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: January 10, 2023
    Assignee: Eaton Intelligent Power Limited
    Inventors: Matthew Rain Darr, Hundi Panduranga Kamath
  • Patent number: 11536872
    Abstract: A method of operating a mechanical switching device is disclosed. The switching device includes a housing, an assembly disposed in the housing, and a body. The assembly is thermally deformable and comprises a beam held in two different places by two arms secured to edges of the housing. The beam is remote from the body in a first configuration and in contact with and immobilized by the body in a second configuration. The assembly has the first configuration at a first temperature and the second configuration when one of the arms has a second temperature different from the first temperature. The method includes exposing an arm of the assembly to the second temperature, and releasing the beam using a release mechanism. The release mechanism includes a pointed element comprising a pointed region directed towards the body. The pointed element limits an open crater in a concave part of a projection.
    Type: Grant
    Filed: June 24, 2019
    Date of Patent: December 27, 2022
    Assignee: STMICROELECTRONICS (ROUSSET) SAS
    Inventors: Abderrezak Marzaki, Yoann Goasduff, Virginie Bidal, Pascal Fornara
  • Patent number: 11540411
    Abstract: A coupling for connecting a circuit board to a mount with a fastener. The mount may be connected to a component. The fastener includes a first snap-fit connection formation for establishing a snap-fit connection with a second snap-fit connection formation provided on the mount. When connected, the fastener clamps the circuit board against the mount. The fastener further includes a first engagement formation configured to engage with a second engagement formation on the mount for bracing the snap-fit connection.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: December 27, 2022
    Assignee: Aptiv Technologies Limited
    Inventors: Ralf Slawik, Thorsten Mauff
  • Patent number: 11536292
    Abstract: A fan assembly includes a socket to receive a fan module, a fan flap coupled to a first side wall of the socket, and an anti-reflow device coupled to a second side wall of the socket. The fan flap moves in a curved path between a first position and a second position. The anti-reflow device has an attachment feature, an embossed feature, and a stopping feature. The attachment feature attaches the anti-reflow device to the second side wall. The embossed feature extends through a first aperture in the second side wall. The stopping feature extends through a second aperture in the second side wall and contacts the fan flap. When the fan module is removed, the stopping feature retains the fan flap in the first position to block the socket and prevent air from reflowing through the socket.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 27, 2022
    Assignee: QUANTA COMPUTER INC.
    Inventors: Yaw-Tzorng Tsorng, Chun Chang, Ting-Kuang Pao, Chih-Hao Chang
  • Patent number: 11532448
    Abstract: A laser remote control switching system comprises a laser source and a control circuit. The control circuit comprises a power, an electronic device, a first electrode, a second electrode, and a photosensitive element electrically connected in sequence to form a loop. Each of the two nanofiber actuators comprises a composite structure and a vanadium dioxide layer. The composite structure comprises a carbon nanotube wire and an aluminum oxide layer. The aluminum oxide layer is coated on a surface of the carbon nanotube wire, and the aluminum oxide layer and the carbon nanotube wire are located coaxially with each other. The vanadium dioxide layer is coated on a surface of the composite structure, and the vanadium dioxide layer and the composite structure are located non-coaxially with each other.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: December 20, 2022
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Guang Wang, He Ma, Xiang Jin, Hua Yuan, Yang Wei, Qun-Qing Li, Kai-Li Jiang, Shou-Shan Fan
  • Patent number: 11527458
    Abstract: A 2-in-1 power electronics assembly includes a frame with a lower dielectric layer, an upper dielectric layer spaced apart from the lower dielectric layer, and a sidewall disposed between and coupled to the lower dielectric layer and the upper dielectric layer. The lower dielectric layer includes a lower cooling fluid inlet and the upper dielectric layer includes an upper cooling fluid outlet. A first semiconductor device assembly and a second semiconductor device assembly are included and disposed within the frame. The first semiconductor device is disposed between a first lower metal inverse opal (MIO) layer and a first upper MIO layer, and the second semiconductor device is disposed between a second lower MIO layer and a second upper MIO layer. An internal cooling structure that includes the MIO layers provides double sided cooling for the first semiconductor device and the second semiconductor device.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: December 13, 2022
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Ercan Mehmet Dede, Shailesh N. Joshi
  • Patent number: 11521909
    Abstract: This document describes a passive thermal-control system that can be integrated into an electronic speaker device and associated electronic speaker devices. The passive thermal-control system uses an architecture that combines heat spreaders and thermal interface materials to transfer heat from heat-generating electronic devices of the electronic speaker device to a housing component of the electronic speaker device. The housing component dissipates the heat to prevent a thermal runaway condition.
    Type: Grant
    Filed: October 7, 2020
    Date of Patent: December 6, 2022
    Assignee: Google LLC
    Inventors: Ihab A. Ali, Emil Rahim, Truong Ho Cong
  • Patent number: 11522359
    Abstract: A power distribution panel for distributing power to a plurality of components. A modular frame may removably attach in an aperture of a side of a chassis. A first module may be removably attached in an opening of the modular frame. A second module, different from the first module, may be removably attached in the opening of the modular frame.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: December 6, 2022
    Assignee: Telect, Inc.
    Inventors: Steven Kyle Witkoe, Timothy Andrew Meyer, Timothy McBrien Turpin
  • Patent number: 11516949
    Abstract: A power converter (100) includes a power converter circuit (1), a cooler (2), and a cover member (3). The power converter circuit is configured to convert input electric power into DC power or AC power. The power converter circuit is placed on the cooler. The cooler is configured to cool the power converter. The power converter circuit is housed between the cooler and the cover member. The cooler (2) includes a main body (20), a coolant flow passage (21), and a coolant input/output portion (22). The coolant flow passage is formed inside the main body. A coolant is circulatable through the coolant flow passage. The coolant input/output portion is coupled to the coolant flow passage. The coolant input/output portion includes a coolant introduction pipe (22a) and a coolant discharge pipe (22b). The coolant introduction pipe introduces the coolant from outside the cooler. The coolant discharge pipe discharges the coolant to outside the cooler. The coolant input/output portion (22) is joined to the main body.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: November 29, 2022
    Assignee: Nissan Motor Co., Ltd.
    Inventors: Tomohiro Umino, Soichi Ishii
  • Patent number: 11513568
    Abstract: A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: November 29, 2022
    Assignee: Dell Products L.P.
    Inventors: Ching Wei Chang, Suresh Ramasamy, Allen B. McKittrick, Jeffery D. Kane
  • Patent number: 11516939
    Abstract: A method, apparatus, and system for stopping a flow of a liquid coolant into, and drawing away a residual portion of the liquid, a portion of a cooling system, e.g., for resistance welding electrodes. The disclosed system does not require more than a single actuator, and in one case uses only a single actuator, coupled to both i) one or more liquid shutoff valves and ii) one or more liquid drawback apparatus. The liquid drawback apparatus draws on the liquid at approximately a same time that the one or more liquid shutoff valves shut off the flow of the liquid from the coolant supply. The liquid drawback apparatus includes a non-return check valve, disposed in the fluid passageway and biased against a normal flow of the liquid from the coolant supply.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: November 29, 2022
    Assignee: PROTEUS INDUSTRIES INC.
    Inventor: Mark Nicewonger
  • Patent number: 11516326
    Abstract: A sensor module includes: a flexible printed circuit board; a temperature sensor disposed on the flexible printed circuit board to measure the temperature of a measurement object; a distance sensor disposed on the flexible circuit board adjacent to the temperature sensor to measure the distance to the measurement object; a terminal cover disposed above the temperature sensor and the distance sensor and including a first hole exposing a top surface of the temperature sensor and a second hole exposing a top surface of the distance sensor; and a window disposed in the second hole of the terminal cover.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: November 29, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Won Seo, Ki Chul Chang, Jeong Gi Seo
  • Patent number: 11510341
    Abstract: An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: November 22, 2022
    Assignee: Frore Systems Inc.
    Inventors: Vikram Mukundan, Suryaprakash Ganti, Ananth Saran Yalamarthy, Seshagiri Rao Madhavapeddy, Prabhu Sathyamurthy
  • Patent number: 11503742
    Abstract: An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: November 15, 2022
    Assignee: Frore Systems Inc.
    Inventors: Vikram Mukundan, Suryaprakash Ganti, Ananth Saran Yalamarthy, Seshagiri Rao Madhavapeddy, Prabhu Sathyamurthy