Abstract: This invention relates to an apparatus and method for detecting the condition of a pipeline wall and analysis and estimate of the life of the pipeline by using an apparatus mounted externally of the pipeline and provided to be moved about and/or along at least a portion of the same. The apparatus includes at least one sensor array which includes a plurality of sensors axially offset to provide data for analysis and identification of pipeline defects.

Abstract: A tool for the primary shaping of a housing for a sensor which is designed to capture, via a sensing element, a physical area that is dependent on a variable to be measured, and to emit an electrical output signal on the basis of the captured physical area, including: —a mold cavity for receiving a material that molds the housing, and the sensing element, and —a box having a wall that bounds the mold cavity, wherein at least a part of the wall that bounds the mold cavity is mounted in a displaceable manner.

Abstract: The invention relates to a switching apparatus (1) for conducting electrical contact tests on bare and assembled printed circuit boards (12), comprising at least a flat support layer (2), a first electrode arrangement (3) and a functional layer (4), which support layer (2) is elastically restorably deformable, and the functional layer (4) is disposed on top of the first electrode arrangement (3). The functional layer (4) is made from at least one of the group comprising a layer of a photosensitive material (7), a quantum detector and a photoresistor, and at least one source for electromagnetic radiation (8) is additionally disposed above the functional layer (7), and the emitted electromagnetic radiation predominantly acts in the direction of the functional layer (4). The functional layer (4) may also be provided in the form of a transistor arrangement (9) made up of a plurality of transistors. The invention further relates to a method of producing a switching apparatus (1).

Abstract: A probe card having a configurable structure for exchanging/swapping electronic components for impedance matching is provided. In the probe card, an applied force is exerted on the electronic component so as to make the electronic component electrically connected with at least one conductive contact pad of a supporting unit. The supporting unit is a circuit board or a space transformer. In order to facilitate the exchange or swap of the electronic component, the applied force can be removed. The probe card includes a pressing plate which can be moved between a pressing position and a non-pressing position. The pressing plate has a pressing surface which is contacted with the top end of the electronic component while the pressing plate is in the pressing position. Therefore, the applied force can be generated or removed by changing the positioning of the pressing plate.

Abstract: An eddy current testing probe includes: exciter coils 2 including a first exciter coil 2a and a second exciter coil 2b identical with each other and arranged in point symmetry, and each of which generates an alternating magnetic field to generate an eddy current in a test object; and detector coils 1 including a first detector coil 1a and a second detector coil 1b identical with each other, arranged in point symmetry, arranged in phase, and differentially connected to each other. The exciter coils 2 and the detector coils 1 are arranged on a single plane. A center of symmetry O on a center line of symmetry CL2 of the coils 2a, 2b, is identical with a center of symmetry O on a center line of symmetry CL1 of the coils 1a, 1b, and the CL1 intersects with the CL2 at a right angle.

Abstract: A measuring system for a road construction machine includes a control unit which is operationally connected using a field bus to at least one field device, wherein an exclusive bus address is respectively assignable in the measuring system for each field device connected in the field bus. Furthermore, a method for addressing at least one field device is also provided.

Abstract: Test structures, methods of manufacturing thereof, and testing methods for semiconductors are disclosed. In one embodiment, a test structure for semiconductor devices includes a printed circuit board (PCB), a probe region, and a compliance mechanism disposed between the PCB and the probe region. A plurality of wires is coupled between the PCB and the probe region. End portions of the plurality of wires proximate the probe region are an integral part of the probe region.

Abstract: An illustrative example conductor monitoring device includes a generator configured to radiate a field into a conductor. A detector is configured to detect at least some of the field propagated along the conductor. A processor is configured to determine when a change in the propagated field detected by the detector indicates contact between the conductor and a conductive blade of a wire processing machine. The example conductor monitoring device is capable of providing information regarding the condition of a conductor that has gone through a wire handling process that involves cutting the wire and stripping insulation from near the end of the cut wire, for example. The information regarding the condition of the wire is obtained without making contact with the wire and without interfering with or requiring any alteration of the wire handling process or machine.

Abstract: A solar cell testing apparatus may include an illuminator for directing light energy on a solar cell under test. The solar cell testing apparatus may also include a device for selectively positioning different filters of a multiplicity of filters in an optical path between the illuminator and the solar cell under test to at least one of measure performance and detect any defects in the solar cell. The multiplicity of filters may include a first set of filters and a second set of filters. Each filter of the first set of filters is adapted for passing a predetermined percentage of intensity of the light energy from the illuminator onto the solar cell under test. The second set of filters being adapted for testing the solar cell under different spectrums of light.

Abstract: In accordance with one aspect of the present disclosure, a current sensor configured to measure an AC current of a first conductor includes an outer coil having a first portion and a second portion. Each of the first and second portions are disposed about the first conductor passing through a center of the outer coil. The current sensor further includes an inner conductor disposed within the first and second portions of the outer coil and connected to each of the first and second portions of the outer coil.

Abstract: The magnetometers possess detector part with a magnetic wire sensitive to magnetic field consisting of a domain structure of the surface domain with circular spin alignment and core domain with longitudinal spin alignment and micro coil surrounding its magnetic wire to pick up the change of longitudinal magnetizing caused by spin rotation in surface domain with circular spin alignment called as GSR effect excited by pulse with frequency of 0.5 GHz to 4 GHz. Peak coil voltage is detected by a circuit characterized with pulse generator, GSR element, Buffer circuit, sample holding circuit, amplifier circuit and means to invert it to external magnetic field. The induced coil voltage caused by parasitic coil capacitance and wiring loop is vanished by combination coil of right and left turn coil. The magnetometers can provide lower noise, wide measuring range with a small size detector part and is applied to smartphones, wearable computer and so on.

Abstract: External conditions, e.g., smoke, temperature, humidity, humidity, pressure, flow rate, etc., affects a sensor's characteristics, wherein the sensor provides a current output representative of its characteristics as affected by the external conditions. The current output of the sensor is coupled to a sample and hold capacitor for a precision time period thereby charging the sample and hold capacitor to a voltage proportional to current provided by the sensor over the precision time period. The voltage on the sample and hold capacitor is converted to a digital representation and a determination is made whether the external condition represents an alarm situation, e.g., smoke detected from a fire.

Abstract: Probe tip formation is described for die sort and test. In one example, the tips of wires of a test probe head are prepared for use as test probes. The wires are attached to a test probe head substrate. The end opposite the substrate has a tip. The tips of the wires are polished when attached to the test probe head to form a sharpened point.

Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

Abstract: Systems and methods for calibrating resistivity tools in environments with radio-frequency (RF) noise are described herein. The method may include receiving a first measurement from a resistivity tool. The measurement may be taken with the resistivity tool elevated to reduce ground effects on the measurements. The first measurement may be altered by excluding at least some RF noise from the first measurement. The RF noise may be a by product of the resistivity tool being elevated. Additionally, the resistivity tool may be calibrated using the altered first measurement.

Abstract: A method and a device for detecting defects in a packaging laminate having at least one conductive layer are provided. The method comprises the steps of grounding the conductive layer of the packaging laminate, arranging an electrode adjacent to the packaging laminate, applying a high voltage to the electrode by ramping the voltage from an initial value towards an upper predetermined value, and detecting a defect in the packaging material by registering dielectric breakdown between the electrode and the conductive layer of the packaging laminate.

Abstract: A magnetic field sensor with a plurality of magnetic field sensing elements is provided herein. The magnetic field sensor includes a circular vertical Hall (CVH) sensing element comprising a plurality of vertical Hall elements arranged over a common implant and diffusion region in a substrate, wherein the plurality of vertical Hall elements is configured to generate a plurality of magnetic field signals, each magnetic field signal responsive to a magnetic field.

Abstract: A system for connecting a test pin of automatic test equipment (ATE) to devices for testing includes a first handler for manipulating a first portion of the devices and a second handler for manipulating a second portion of the devices. The system includes a first socket for testing devices of the first portion, which is connected to a first wire, and a second socket for testing devices of the second portion, which is connected to a the second wire. A controller multiplexes the two handlers, or dual manipulators of a single handler, to operate the handlers asynchronously in coordination with testing, such that while the ATE is testing devices for one handler, the other handler presents next devices to the ATE for immediate switch of testing between devices for each handler. The system is suitable for conventional handlers and ATE.

Abstract: A system for communicatively connecting devices for testing to respective test pins of a test head of an automatic test equipment (ATE). The system includes a tester interface device for communicative connection to the test pins of the ATE. The tester interface device includes a first connector and a second connector. The first connector is communicatively connected by the tester interface device to a first group of the test pins and the second connector is communicatively connected by the tester interface device to a second group of the test pins. The first group and the second group can be different test pins, same test pins, or combinations of some same and some different test pins. The system may also include a first pogo pin block device and a second pogo pin block device.

Abstract: A position sensor includes a variable capacitor assembly and a circuit board. The variable capacitor assembly includes a baseboard and a dielectric coupling element. The baseboard includes a baseboard body, a grounding electrode and two power electrodes. The grounding electrode is disposed nearby one side of the baseboard body. The two power electrodes are disposed separately near the other side of the baseboard body. The dielectric coupling element is spaced with the two power electrodes and the grounding electrode, and operable to be moved along a moving path. A covering condition is varied when the dielectric coupling element is operated to move along the moving path. When a power is alternatively applied to the power electrodes, a pair of capacitance values between the grounding electrode and the power electrodes is varied with the covering condition to accordingly determine a relative position of the coupling element along the moving path.