Abstract: The present invention discloses a relay diagnostic circuit for a number of relays connected in series between an electric vehicle power supply end and a load or a charging end. The relay diagnostic circuit includes a number of voltage divider branches connected to a same reference ground, an isolation unit and a judgment unit. Each of the voltage divider branches is configured to obtain the voltage of one end of each relay and output the voltage after dividing the voltage. The isolation unit is configured to isolate and convert a number of divider voltages output from the number of voltage divider branches and output the voltages to the judgment unit. The judgment unit is configured to compare a comparison information of divided voltages at two ends of each relay with a corresponding driving state of the relay and obtain the diagnosis result of each relay.

Abstract: A strain gauge system includes a layered structure and a resistance sensor. The layered structure has an unstretched position and a range of stretched positions. The layered structure includes a multilayer thin film having alternating layers of ferromagnetic and non-ferromagnetic materials. The layered structure also includes a flexible magnet that produces a magnetic field. The resistance sensor measures a resistance of the multilayer thin film. The resistance of the multilayer thin film is lower when the layered structure is in the unstretched position than when it is in a stretched position in the range of stretched positions.

Abstract: Apparatus and methods for estimating a value of a resistivity property of an earth formation intersected by a borehole. Apparatus may include a carrier conveyable in the borehole; a tri-axial induction antenna assembly along the carrier; and a magnetically transparent sleeve enclosing the antenna assembly. The antenna assembly includes panels circumferentially arrayed about a portion of the carrier to form at least three collocated antennas. Each panel includes a magnetic core, an axially sensing coil that is transversely wound about the magnetic core, and a laterally sensing coil that is longitudinally wound about the magnetic core. The axially sensing coil of each panel may be electrically connected to the axially sensing coils of the other panels to form an axial antenna. Corresponding lateral coils may be electrically connected to form a lateral antenna. Each panel may be individually removable from the carrier, and assembled together may form a cylinder.

Abstract: A Hall Effect sensor, including a toroid including a gap having opposed surfaces, which are substantially planar and substantially parallel to one another. The toroid further includes a central plane bisecting the opposed surfaces. A first Hall element sensor defining a first sensor plane is positioned at least partially within the gap of the toroid at a first angle and a second Hall element sensor is positioned at least partially within the gap of the toroid at a second angle substantially mutually perpendicular to each of the opposed surfaces. The central plane is substantially perpendicular to the opposed surfaces.

Abstract: A measuring system having a magnetic device for generating a magnetic field and at least one magnetic field sensor for detecting a flux density of the magnetic field, at least in a first spatial direction. The magnetic device has a top side facing the magnetic field sensor, the magnetic field sensor is spaced apart from the top side of the magnetic device, the magnetic device has a main magnet, having two poles, with a main magnetizing direction for generating a main magnetic field and at least one secondary magnet, having two poles, with a secondary magnetization direction for generating a secondary magnetic field, the main magnet has larger dimensions than the at least one secondary magnet, the magnetic field is formed by superposition of the main magnetic field and the secondary magnetic field, the secondary magnetic field at least partially compensates the main magnetic field in the first spatial direction.

Abstract: Various means for improvement in signal-to-noise ratio (SNR) for a magnetic field sensor are disclosed for low power and high resolution magnetic sensing. The improvements may be done by reducing parasitic effects, increasing sense element packing density, interleaving a Z-axis layout to reduce a subtractive effect, and optimizing an alignment between a Z-axis sense element and a flux guide, etc.

Abstract: There is provided a hall sensor. The hall sensor includes a hall element disposed on a semiconductor substrate. The hall element includes: a sensing region, a first electrode, a second electrode, a third electrode and a fourth electrode, and a doped region disposed on the sensing region, and the sensing region has at least one angulated corner or rounded corner.

Abstract: A sensor comprises: an electrically comprises a switchable polymeric element. The polymeric element has at least a first electrical state and a second electrical state and is switchable between the first and second electrical states as a function of predefined environmental pH changes. The sensor comprises a pH sensitive polymeric matrix and a plurality of conductive particles embedded in the polymeric matrix.

Abstract: A sensor system comprises: a communications element and a switch configured to enable or disable the communications element. The switch comprises a switchable polymeric element. The polymeric element has at least a first electrical state and a second electrical state and is switchable between the first and second electrical states as a function of predefined environmental changes.

Abstract: A sensor comprises: an electrically comprises a switchable polymeric element. The polymeric element has at least a first electrical state and a second electrical state and is switchable between the first and second electrical states as a function of predefined environmental changes. The sensor comprises a polymeric matrix and a plurality of conductive particles embedded in the polymeric matrix.

Abstract: A sensor comprises: an electrically comprises a switchable polymeric element. The polymeric element has at least a first electrical state and a second electrical state and is switchable between the first and second electrical states as a function of predefined environmental changes. The sensor comprises a polymeric matrix and a water soluble electrolyte embedded in the polymeric matrix.

Abstract: Circuits for monitoring a socket are disclosed, including a circuit comprising a first node arranged to be electrically connected to a first pole of an electrical plug when the electrical plug is inserted into a corresponding socket, a second node arranged to be connected to a first voltage, wherein the first node is arranged to be connected to the first pole when the electrical plug is inserted into the socket, a variable resistance connected between the first node and a third node, wherein the third node is arranged to receive a second voltage, detection circuit arranged to detect the presence of the electrical plug or moisture in the socket based on a voltage at the first node, and a control circuit arranged to control the variable resistance to a first resistance value and, in response to the detection circuit detecting the presence of the electrical plug or moisture in the socket when the variable resistance is at the first resistance value, to a second resistance value, whereby the detection circuit dis

Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.

Abstract: Embodiments of the present application provides an array substrate, testing method and display apparatus. The array substrate comprises a testing circuit, pixel units and data lines connecting to the pixel units. The data lines are used for providing data signals to the pixel units and are arranged to extend along a first direction. The testing circuit comprises a switching unit and testing units. The switching unit comprises a first number of first switching elements parallelly arranged along the first direction, and the testing units are parallelly arranged along a second direction perpendicular to the first direction. By using the present application, performance of substrate testing can be ensured while achieving narrow boarder, and user experiences could be easily improved.

Abstract: In some aspects, a method of operating a magnetic resonance imaging system comprising a B0 magnet and at least one thermal management component configured to transfer heat away from the B0 magnet during operation is provided. The method comprises providing operating power to the B0 magnet, monitoring a temperature of the B0 magnet to determine a current temperature of the B0 magnet, and operating the at least one thermal management component at less than operational capacity in response to an occurrence of at least one event.

Abstract: A method is disclosed for determining the speed of a rolling stock, for example the belt speed of a rolling belt, wherein electromagnetic radiation in the microwave range is transmitted to the rolling stock by at least one transmitting and receiving device and the belt speed is determined on the basis of the reflected and received reflection signal in an evaluation device. A device for carrying out such method is also disclosed.

Abstract: The invention provides a printed circuit board and a detection method for detecting a connection between the printed circuit board and a flexible circuit board, and a display panel. The printed circuit board, through a connector provided thereon, is connected to a flexible circuit board, the printed circuit board is provided thereon with at least one first detection structure for matching with at least one second detection structure provided on the flexible circuit board, and whether or not a connection between the printed circuit board and the flexible circuit board is correct is determined by detecting matching between the first detection structures and the second detection structures. Pins of the printed circuit board may be correctly connected to pins of the flexible circuit board, and a case that short circuit occurs and thus the signal lines are damaged and burned can be avoided.

Abstract: A test probe for testing a chip package is provided, wherein the test probe comprises a test probe body comprising a conductive material; and a probe tip arranged on an end of the test probe body and comprising carbon nano tubes.

Abstract: A repairable rigid test probe system includes an annular gimbal supported by an annular gimbal bearing of a probe card assembly, a test substrate seated and aligned within the annular gimbal, a rigid die including thick periphery and a thin center containing an array of through holes that is aligned above the test substrate, and an array of rigid probes inserted into each of the array of through holes, where each rigid probe includes: a tail end that contacts a connection on a facing surface of the test substrate, a collar limiting a distance of insertion, and a tip that contacts a corresponding contact on a facing surface of a device under test.

Abstract: Provided is an evaluation apparatus of a semiconductor device suppressing a discharge occurring in a part of a semiconductor device at a time of evaluating its electrical characteristics. The evaluation apparatus of a semiconductor device includes a stage to support a semiconductor device; a plurality of probes located above the stage; an insulating body having a frame shape to surround the plurality of probes and located above the stage; and an evaluation part injecting a current into the semiconductor device via the plurality of probes. The insulating body includes a tip portion having flexibility and facing the stage. The tip portion includes, in one side surface of the tip portion, a contact surface to come in contact with the semiconductor device by a deformation of the tip portion toward an inner side or an outer side of the frame shape.