Abstract: A semiconductor leadframe structure (11,41) includes a die bond portion (12) and a plurality of leads (13) coupled to the die bond portion (12). The leadframe structure (11) comprises a metal (23) such as copper or a copper alloy. At least one lead (28,29) includes a bond post (31) that has a major surface (32) for forming a wire bond. The major surface (32) includes an exposed area (33) of leadframe metal (23) and a covered area (34) of another metal (24) deposited onto the leadframe metal (23).

Abstract: A submersible bus type connector using hollow posts or flat pad posts is machined from conductive metal bar stock extrudate in a continuous machining line, to form the posts and the drilled and tapped holes for the conductor connection hardware before being cut-to-length to form a connector having the desired number of side-by-side posts all machined from one block. The process produces an improved and yet low cost connector.

Abstract: An encapsulated microelectronic device (100) including a base (101) and a semiconductor device (305) having a top and a bottom. The bottom is attached to the base (101). The semiconductor device (105) has a thickness in the range from one-fourth to three-fourths of a millimeter and has a bottom metallization consisting of aluminum (407)/chromium (405)/nickel (403)/gold (401). The semiconductor device (305) has a contact (115) attached to the top. The encapsulated microelectronic device (100) has a molded top (120) surrounding the semiconductor device (305). The molded top (120) is made from low stress molding material.

Abstract: The present invention is directed to a method for making a connector 20 having co-planar contact surfaces including the steps of: providing a housing 22 having a plurality of contact-receiving slots 30, each having stop surfaces 32 that are precisely co-planar to define a referenced datum in the housing 22; selecting a plurality of contacts 40 having cooperating stop surfaces 44 and a surface mountable connecting portion 50 bent from a first connecting portion 42 and defining a contact surface facing away from the stop surface 44, the contacts 40 being bent at an angle slightly less than 90.degree.; inserting the contacts 40 into respective slots 30; and striking the surface mountable contact portions with a tool having a precisely planar surface and applying force thereto until the respective stop surfaces 32,44 engage each other and the second connecting portions 50 are at precisely right angles to the respective first connecting portions 42 such that the surface mountable contact surfaces are co-planar.

Abstract: An improved current mode coupler comprising a base (100), a housing (300) mountable to a panel. The coupler base (100) includes a pair of wire retainers (200) for securing the wires (230,231) of a twisted pair cable within wire receiving channels (204,205) of a wire nest (202) of the coupler base (100). Each wire retainer (200) has an arm (232), a strut (236) extending from one end thereof to a cylindrical hinge (234) disposed in a pivot region of the coupler base (100), a vertical section (240) proximate the other end including a latch (242), and a wedge (244) on the lower surface of the arm (232). Upon rotation of the wire retainer about hinge (234) to a closed position, wedge (244) is engageable with a lower one of the conductors (230) to urge it fully into a deeper one of the channels (204) adjacent a channel intersection proximate a conductor crossover.

Abstract: A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer.

Abstract: A thermal conduction module comprises a base plate for holding a chip substrate, an integrated circuit chip substrate mounted in the base plate and a cover plate having a surface facing the chip substrate. A movable spacer is secured adjacent to the periphery of the cover plate or the base plate, and is adjustable to a predetermined distance away from the cover plate or base plate. A gap for insertion of a thermally conductive paste may be created between chips mounted on the substrate and the cover plate surface facing the chip substrate by adjustment of the spacer to a desired distance from the cover plate or base plate.