Abstract: An optical access network includes an optical hub having at least one processor. The network further includes a plurality of optical distribution centers connected to the optical hub by a plurality of optical fiber segments, respectively, and a plurality of geographic fiber node serving areas. Each fiber node serving area of the plurality of fiber node serving areas includes at least one optical distribution center of the plurality of optical distribution centers. The network further includes a plurality of endpoints. Each endpoint of the plurality of endpoints is in operable communication with at least one optical distribution center. The network further includes a point-to-point network provisioning system configured to (i) evaluate each potential communication path over the plurality of optical fiber segments between a first endpoint and a second endpoint, and (ii) select an optimum fiber path based on predetermined path selection criteria.

Abstract: An optical transceiver includes a housing, a rib structure mounted on an inner surface of the housing, an optical communication module accommodated in the housing, and a heat conductive module. A gas flow passage is formed between each pair of adjacent ribs of the rib structure. The optical communication module includes a substrate and an optical communication component, and the optical communication component is in thermal contact with the housing. The heat conductive module is in thermal contact with the rib structure and the optical communication component.

Abstract: An optical module includes a circuit board, an optical emission chip array, an optical receiver chip array, an optical fiber array, and a lens assembly. The lens assembly includes a body with a step provided at a bottom portion thereof, an emission lenses array, an optical fiber lenses array, and a receiving lenses array. The emission lenses array and the receiving lenses array are respectively arranged on two step surfaces of the step, such that focal points thereof respectively fall on an emission surface of the optical emission chip array and a light sensitive surface of the optical receiver chip array. A first groove for forming a first reflective surface and a second groove for arranging a light filter that refracts light towards the optical fiber lenses array or reflects light to the receiving lenses array are provided at a top portion of the body.

Abstract: A DFB laser DC-coupled output power configuration scheme belongs to the field of laser drivers in optical communication integrated circuits. The present invention solves the existing problems in the conventional DFB laser power supply configuration scheme. The power configuration scheme of the present invention utilizes an external or internal power configuration unit to provide two electric DC power supplies with a fixed voltage difference for the transmitting unit TX of the DFB laser and the optical transceiver integrated chip, and at the same time optimizes the transmitting unit TX. The optimization scheme is that: the transistors in the transmitting unit TX are all low-voltage high-speed tubes, the transmitting unit TX includes a negative capacitance structure composed of capacitors C1 and C2, serving as an auxiliary structure for improving bandwidth. After optimization, the minimum voltage of the power supply voltage port TVCC of the transmitting unit TX is 2.7V.

Abstract: An example system includes a hub transceiver and a plurality of edge transceivers. The hub transceiver is operable to transmit, over a first communications channel, a first message to each of the edge transceivers concurrently, including an indication of available network resources on an optical communications network. Each of the edge transceiver is operable to transmit, transmit, over a second communications channel, a respective second message to the hub transceiver including an indication of a respective subset of the available network resources selected by the edge transceiver for use in communicating over the optical communications network. Further, the edge transceiver is operable to receive, from the hub transceiver, a third message acknowledging receipt of a selection and a fourth message confirming an assignment of the selected subset of the available network resources to the edge transceiver.

Abstract: A coupling device (9) for light guides (8), including a light entrance (11) and a light-guide space (12) aligned at the light entrance (11), and including a clamping device with a first roller pair (20) with two opposing rollers (21; 32), between which an inserted light guide (8) can be clamped. The coupling device (9) has a second roller pair (26) with two opposing rollers (21), and the second roller pair (26) is arranged closer to the light entrance (11) than the first roller pair (20).

Abstract: A method for removing offset in a receiver of an integrated circuit (IC) includes: determining digital codes of differential input voltages of an amplifier in a first receiving lane of the receiver; comparing the digital codes to a digital code corresponding to an optimum common mode voltage (VCM) of the receiver; according to the comparison, determining a bias code for adjusting both the differential input voltages to match the optimum VCM; and inputting the bias code to a bias circuit of the receiver. The first receiving lane of the receiver includes a plurality of amplifiers. The method steps are repeated for each amplifier of the plurality of amplifiers, and then repeated for all receiving lanes of the IC.

Abstract: A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

Abstract: In some implementations, a device may include a first flexible barrier that is configured to prevent dust from passing through a cable slot of a network device. The device may further include a second flexible barrier that is configured to absorb at least a portion of an amount of electromagnetic energy generated by the network device.

Abstract: A coupling alignment device and method for a laser chip and a silicon-based optoelectronic chip are disclosed. The device comprises a transfer mold which includes a substrate, first protrusions, and second protrusions. The first protrusions are provided with through holes and are used for being clamped into first recesses in the laser chip; and the second protrusions are used for being clamped into second recesses in the silicon-based optoelectronic chip. The coupling alignment is achieved by etching the first recesses in the laser chip, etching the second recesses in the silicon-based optoelectronic chip, etching the first protrusions, the second protrusions, and the through holes in the transfer mold. A flip-chip suction nozzle is connected with the transfer mold, which is in alignment with the laser chip, and picks up the laser chip by means of the through holes.

Abstract: An optical IQ modulator includes: Y branching elements, which are cascade-connected, each of which has one input and two outputs; QPSK modulators configured to perform QPSK modulation on continuous light branched by the Y branching elements to generate signal light; and Y combining elements, which are cascade-connected, each of which has two inputs and one output.

Abstract: Various apparatus are disclosed for lifting heat sinks during insertion of optical modules into transceiver cages (e.g., housings). The apparatus also provide for lifting of the heat sink during removal of the optical modules from the transceiver cages. While the heat sink is lifted during insertion or removal, the heat sink is in contact with the surface of the optical module when the optical module is fully inserted in the transceiver cage. Lifting of the heat sink during insertion and removal of the optical module allows a thermal interface material (TIM) to be placed on the surface of the heat sink in contact with the optical module to improve thermal conduction between the optical module and the heat sink.

Abstract: A cell site test tool provides field technicians with resources to support multiple aspects of cell site testing. The cell site test tool includes multiple, integrated and removably connectable modules such as a base module, a user interface module, and a battery module. Additional modules include a CPRI module to provide Common Public Radio Interface testing, an OTDR module to provide dedicated Optical Time-Domain Reflectometer testing, a CAA module to provide Cable Antenna Analysis testing, a fiber inspection module to visually inspect optical fiber, and an SA/CPRI module to provide Radio Frequency over Common Public Radio Interface testing.

Abstract: An I/O connector includes a body comprising a first surface, a second surface, side surfaces extending between the first surface and the second surface, and a cable entrance port at a rear end of the body extending toward a front end of the body. The I/O connector includes a printed circuit board (PCB) positioned between the first surface and the second surface of the body. The PCB includes a first set of one or more electrical components mounted on a first side of the PCB. A first heatsink is disposed on the first surface. The I/O connector includes first heatpipe thermally coupled with the first heatsink and the first set of one or more electrical components, positioned between the first surface and the first side of the PCB.

Abstract: There is provided a highly convenient package for an optical module in which a device can be mounted as it is even when the number and mounting position thereof are different according to the device to be mounted. The package includes a base plate having a top surface on which devices are assembled, an optical fiber mounting component mounted on the top surface of the base plate, a direct current electrical interface component and a high frequency electrical interface component mounted on the top surface of the base plate. The optical fiber mounting component and the electrical interface components are separately manufactured, separately assembled on the top surface of the base plate, and fixed in different modes. The optical fiber mounting component is fixed by fastening with screws and fixed by soldering, and the electrical interface components are fixed by fastening with the screw.

Abstract: An optical receptacle includes an optical receptacle main body and a cylindrical fixing member. The optical receptacle main body includes a first optical surface, a second optical surface, and an annular groove disposed to surround a first central axis of the first optical surface or disposed to surround a second central axis of the second optical surface. The fixing member is configured with a material with a smaller linear expansion coefficient than that of the optical receptacle main body, and is fit to the groove so as to be in contact with at least a part of an inner surface of the groove.

Abstract: Multi-chip modules in different semiconductor packages may be optically data coupled by way of LEDs and photodetectors linked by a multicore fiber. The multicore fiber may pass through apertures in the semiconductor packages, with an array of LEDs and photodetectors in the semiconductor package providing and receiving, respectively, optical signals comprised of data passed between the multi-chip modules.

Abstract: A butterfly-type packaged optical transceiver with multiple transmission and reception channels includes a box-shaped housing, a cover plate, an optical receiving module, an optical emitting module, a polarizing prism module, an optical fiber connector and electrical connection elements. The sealed housing encloses the optical receiving module, the optical emitting module, and the polarizing prism module. Electrical connection elements penetrate both side surfaces of the housing and are in contact with the optical fiber connector and the optical receiving module and the optical emitting module. A first incoming optical signal is transmitted to the optical receiving module via the optical fiber connector, the through hole, and the prism module, and the optical emitting module emits an outgoing second optical signal through the prism module, the through hole, and the optical fiber connector.

Abstract: A method of calibrating a collimating lens system includes transmitting, using an optical transmitter, a beam out of an optical fiber and through a collimating lens of the collimating lens system. The beam is reflected off a perfect flat mirror positioned at an output of the collimating lens and back towards the collimating lens, and received, via the collimating lens, at a power meter connected to the optical fiber. The method also includes adjusting a position of a tip of the optical fiber proximal to the collimating lens while tracking a power reading using the power meter, selecting a calibration position of the optical fiber corresponding to a highest power reading, and securing the optical fiber relative to the collimating lens using the calibration position.

Abstract: An optical port shielding and fastening apparatus is configured to be installed in the optical module. The optical module includes a housing assembly and an optical component located in the housing assembly. The optical port shielding and fastening apparatus includes a fastener and an electromagnetic wave absorbing piece. The fastener is fastened in the housing assembly. The electromagnetic wave absorbing piece is fastened on a side that is of the fastener and that faces an outside of the housing assembly. A first mounting hole and a second mounting hole are correspondingly provided on the fastener and the electromagnetic wave absorbing piece. The optical component passes through the first mounting hole and the second mounting hole in sequence. This application provides an optical port shielding and fastening apparatus, an optical module, and a communications device, to resolve poor optical port shielding performance of an optical module in the related technology.