Abstract: A v-groove assembly is used to edge couple a lensed fiber (e.g., an optical fiber made of silica) with a waveguide in a photonic chip. The v-groove assembly is made from fused silica. Fused silica is used to so that an adhesive (e.g., epoxy resin) used in bonding the lensed fiber to the v-groove assembly and/or bonding the v-groove assembly to the photonic chip can be cured, at least partially, by light.

Abstract: A fiber optic ferrule includes a body extending from a first end to a second opposite end, with the body including an axial passage extending between the first and the second ends. The axial passage includes a first diameter portion having a diameter of at least 125 microns, a second diameter portion having a diameter of at least 250 microns and less than a diameter of a buffer, and a smooth and continuous transition between the first and the second diameter portions. The second diameter portion is positioned between the first diameter portion and the second end. The axial passage further defines a tapered shape at the second end extending inward from the second end toward the second diameter portion. In certain embodiments, another smooth and continuous transition can be provided between the taper shape and the second diameter portion. In certain embodiments, the axial passage is smooth and continuous between the first and the second ends of the body. A hub holds the ferrule.

Abstract: Techniques related to optical connectors are described. A ferrule includes an optical pathway for light transmission through the ferrule. In examples, a sub-wavelength grating (SWG) assembly is integrated in the ferrule, aligned with an end of the optical pathway.

Abstract: Fiber management assemblies, trays and network interface devices for use in telecommunications that incorporate such assemblies and trays are described. Fiber management trays can include integrated slack storage systems and mechanical fiber splice devices mounted into integrated splice holding grooves, where the mechanical fiber splice devices are actuated by a fiber splice actuation mechanism positioned over the mechanical fiber splice device, as are network interface devices incorporating such assemblies and trays.

Abstract: A modular optical fiber distribution housing is provided. The housing includes a first row of splitter modules and a second row of splitter modules both supported from the inner surface of one of the plurality of walls, and each splitter module is receives an input optical fiber and includes a splitting device configured to split a signal carried by the received input optical fiber into a plurality of signals carried by respective output optical fibers. The first row of splitter modules is located between the second row of splitter modules and the inner surface of the wall supporting the first and second rows of splitter modules.

Abstract: An optomechanical assembly for a photonic chip is disclosed. The optomechanical assembly may include a planar lightwave circuit optically coupled to a plurality of vertical coupling gratings on the photonic chip, to couple light between an optical connector abutting the planar lightwave circuit and the photonic chip.

Abstract: The multiple channel fiber optic rotary joint of this invention can transmit an increased number of optical signals simultaneously through the de-rotating mechanism without increasing the size of the de-rotating mechanism. It also allows for the recapturing of the signals with relative ease. This is accomplished through the use of an optical condenser and/or an optical expander that reduces or expands the overall all beam structure without significantly altering the relative structure. The expanders and condensers are inverse structures in that if an optical signal is condensed when passing from right to light through the condenser it is expanded when passing left to right through the same condenser.

Abstract: An optical module includes a horizontal base plate, a lens mounted on the base plate, a fiber sleeve, and a board lock. The lens has a front end face and a rear end face corresponding to the front end face. The fiber sleeve is mated with the rear end face of the lens. The fiber sleeve has a front surface and a rear surface. The board lock is mounted at a rear of the fiber sleeve. The board lock has a strain relief base and a cover locking to the strain relief base. The strain relief base has a front wall and a pogo pin forwardly extending beyond the front wall. The fiber sleeve defines a receiving hole in the rear surface for fixing the pogo pin. The cover is retained to the base plate.

Abstract: An edge coupling method comprising positioning a first photonic device such that a first edge coupler of the first photonic device is at least partially aligned with a first alignment waveguide of a second photonic device and such that a second edge coupler of the first photonic device is at least partially aligned with a second alignment waveguide of the second photonic device, wherein the first edge coupler widens towards an edge of the first photonic device and the second edge coupler widens towards the edge, and wherein the first edge coupler and the second edge coupler are optically coupled to each other by an interconnect, transmitting a light through the first alignment waveguide, detecting the light at the second alignment waveguide, and aligning the first photonic device and the second photonic device based on the detecting.

Abstract: An opto-electric hybrid board includes: an electric circuit board including an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer; an optical element mounted on a surface of the electric circuit board with the electrical interconnect lines formed thereon; and an optical waveguide including a core and formed on the back surface of the insulative layer of the electric circuit board. The core includes at its end portion a reflecting surface capable of reflecting alight beam to propagate the light beam between the core and the optical element. The insulative layer is made of a light-transmissive material. A portion of the insulative layer corresponding to an optical path between the reflecting surface of the core and the optical element is in the form of a lens portion.

Abstract: An optical fiber adapter according to the present disclosure includes a main body, at least one first stop block, at least one second stop block, two first hooks, a first mounting member and a second mounting member. The first and second stop blocks are respectively positioned on the first and second walls within the main body. The first hooks are configured to hook on to a first optical fiber connector. The first mounting member is placed within the main body through the first opening of the main body. The first mounting member includes two second hooks, at least one third hook and at least one fourth hook. The second mounting member is placed within the main body through the second opening of the main body.

Abstract: An optical modulator device made on large core silicon fin waveguide platform and its fabrication methods. The optical device includes two silicon optical coupling waveguides each having a lower ridge and an upper ridge, two mode transformers respectively connecting the coupling waveguides with an optical modulator waveguide. The optical modulator waveguide has a silicon fin waveguide structure with a narrower fin structure on top of a wider lower ridge structure. Each coupling waveguide and the corresponding mode transformer form a two-stage horizontal taper structure, namely a taper in the lower ridge of the coupling waveguide and a taper of the mode transformer. The light travelling in the coupling waveguide with majority of light in the upper ridge can gradually shift to the lower ridge of the optical modulator where an electro-optic region is positioned. The electro-optic region changes its optical property in response to an applied electric field.

Abstract: An optical connector includes a fiber element incorporating one or more optical fibers, the optical fiber including a plurality of cores, and an optical element including an array of optical waveguides arranged in one or more layers so as to match the geometry of the plurality of cores of the optical fiber.

Abstract: A data processing system may include: a first device; a second device; and an optical link connected between the first and second devices. The optical link may include a main optical waveguide configured to transmit an optical signal output from the second device; N sub-optical waveguides; N mode couplers, each configured to perform a mode coupling operation between the main optical waveguide and a respective one of the N sub-optical waveguides; and an optical wavelength filter connected to an output terminal of the main optical waveguide and an output terminal of each one of the N sub-optical waveguides. Each of the N sub-optical waveguides may include a first region formed at a first distance from the main optical waveguide; a second region formed at a second, greater distance from the main optical waveguide; and a third region for connecting the first and second regions.

Abstract: An optical assembly includes a circuit board including an electrically conductive path formed by printed wiring technology, a photoelectric conversion element connected to the circuit board via the electrically conductive path, a resin member made of light transmissive synthetic resin and attached to the circuit board, and a shielding member made of metal. The resin member includes a sleeve into which a ferrule attached to an end of an optical fiber is inserted and integrally includes a lens through which an optical path passes. The optical path extends between the sleeve and the photoelectric conversion element. The shielding member is connected to the circuit board and arranged to cover the photoelectric conversion element. The shielding member includes a window through which the optical path extends to the photoelectric conversion element.

Abstract: An optical sensor comprising a waveguide having a sensing layer which is molecularly imprinted such that it will receive and retain target entities to be sensed, the optical sensor further comprising a detection apparatus arranged to detect a change of an optical property of the waveguide which occurs when the target entities are received and retained in the sensing layer.

Abstract: A pre-terminated fiber optic connector is provided for coupling electronic components and devices. A multi-fiber optical cable assembly or multi-fiber interconnection module can facilitate optical coupling while maximizing available optical path bandwidth inherent to standard connectors. In an embodiment, a “2×24/24 to 2×20/24+1×8/12” configuration can be employed.

Abstract: A method of fabricating a silicon photonic device and a system including a silicon photonic device are described. The method includes forming a photoresist layer on a silicon layer and patterning a mask formed on the photoresist layer. The patterning defines a primary optical waveguide region, a first evanescent perturbation grating region on a first side of the primary optical waveguide region and a second evanescent perturbation grating region on a second side, opposite the first side, of the primary optical waveguide. The first evanescent perturbation grating region and the second evanescent perturbation grating region are defined as continuous regions along a length of the silicon photonic device. The method also includes etching the photoresist layer and the silicon layer according to a pattern of the patterned mask.

Abstract: Certain types of aggregation enclosures include cable input ports and downwardly angled cable output ports. A cover is pivotally coupled to the body so that the cover moves between an open position and a closed position. A modular component panel may be disposed within the enclosure. The component panel includes one or more distribution components (e.g., fiber distribution components or power distribution components) configured to connect at least a portion of an incoming cable to at least a portion of an outgoing cable.

Abstract: One embodiment provides an integrated circuit including a first non-planar structure and a waveguide configured to provide electromagnetic waves to the first non-planar structure. The first non-planar structure provides a first signal in response to at least some of the electromagnetic waves.