Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: A wafer processing method includes sticking an adhesive tape to the front surface of a wafer, disposing a thermocompression bonding sheet on the adhesive tape stuck to the front surface of the wafer. The thermocompression bonding sheet is heated and pressed by a flat member to execute pressure bonding of the thermocompression bonding sheet to the adhesive tape and integrate the thermocompression bonding sheet with the wafer. The processing method also includes holding the side of the thermocompression bonding sheet on a chuck table of a grinding apparatus and grinding the wafer into a desired thickness while supplying grinding water to the back surface of the wafer. The integrated wafer is separated from the chuck table and the thermocompression bonding sheet is separated from the adhesive tape.

Abstract: A substrate holding apparatus is provided, which includes a top ring main body to which an elastic film having a surface that can suck a substrate can be attached, a first line communicating with a first area of the plurality of areas, a second line communicating with a second area different from the first area of the plurality of areas, a pressure adjuster that can pressurize the first area by feeding fluid into the first area through the first line and can generate negative pressure in the second area through the second line, and a determiner that performs determination of whether or not the substrate is sucked to the elastic film based on a volume of the fluid fed into the first area or a measurement value corresponding to pressure in the first area.

Abstract: An application device is configured to clean grinding surfaces in a machine for grinding ophthalmic lenses, the application device including: a central portion having so as to mount the application device in the grinding machine; and a peripheral edge configured to receive an application surface to cooperate with the grinding surface of the grinding wheel so as to clean the grinding surface. It also relates to a cleaning kit including an application device and a cleaning solution, and to a method for cleaning grinding surfaces.

Abstract: The present invention relates to a hand tool, comprising a tool member, of a first material, an elongated shaft, of a second material and a connecting member, of a third material comprising plastic. The elongated shaft further comprises a handle portion in a first end and an insert portion in a second end. The hand tool further comprises a sealing ring arranged to surround the insert portion to prevent leakage of the third material during manufacturing. A manufacturing method for such a hand tool is also presented, said method comprising arranging a sealing ring around an insert portion, arranging the insert portion and a tool member in a mold, injecting material comprising plastic in a cavity space so as to form a connecting member and removing the hand tool from the mold.

Abstract: A hydraulically operated tool adapted to remove coatings and surfaces from a substrate. The tool may comprise a robotic machine that includes a surface removal tool, a manipulator arm, and a rotation assembly. The manipulator arm may position the surface removal tool to a location along the substrate. The rotation assembly may adjust an angular position of the surface removal tool. A first end of the manipulator arm may be coupled to the surface removal tool, and a second end of the manipulator arm may be coupled to the rotation assembly. The manipulator arm may be hydraulically extended and retracted. The rotation assembly may comprise a spindle, and may be attached to a hinge pin and an air bladder.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: This multi-product pallet device (1) includes a multi-product pallet (2) deforming a shape thereof in conformity with a shape of a workpiece; and a device main body (3) to which the multi-product pallet is attached and which stores shape restoration data for deforming the multi-product pallet and restores the shape of the multi-product pallet based on the shape restoration data, wherein the multi-product pallet is detachable from the device main body.

Abstract: A gripping assembly for a robot includes a body and a pair of jaw supports supported for slidable movement on the body toward and away from each. Each jaw support has a pair of spaced apart apertures for receiving spaced apart securing posts of a jaw. Each jaw support includes a support body and a pair of locking slides. Each locking slide has a first end configured to engage a securing post when the securing post is disposed in a corresponding aperture. At least one actuator is configured to drive the locking slides away from each other to engage the securing posts. A jaw support actuator is configured to drive the jaw supports toward and away from each other.

Abstract: A toothbrush includes an anisotropic deformation portion (70) on a rear end side from the bristle tufting surface (11), and a bending strength in a first direction orthogonal to the bristle tufting surface that is smaller than a bending strength in a second direction orthogonal to the long axis direction and the first direction. The anisotropic deformation portion includes an elastic deformation portion (90) that connects a first region on the tip end side from the anisotropic deformation portion and a second region on the rear end side from the anisotropic deformation portion. The elastic deformation portion is elastically deformable in the first direction and the second direction, and bending load when the head portion is displaced in the first direction is lower than a bending load when the head portion is displaced in the second direction.

Abstract: A nut runner, an attachment unit, and a sliding member are provided in a second arm that is a leading arm of the robot and has a leading end shaft movable along the direction of an elevation axis. The nut runner includes a screw fastening driver, a drive shaft rotationally driven by the screw fastening driver, and an extension bar that is so connected to rotate together with the drive shaft in the circumferential direction and to move in the axial direction. The attachment unit fixedly connects the screw fastening driver to the second arm so that a screw fastening axis parallel to the elevation axis serves as a rotation axis of the screw fastening driver. The sliding member is connected to the leading end shaft and supports the extension bar so as to move together in the axial direction and are rotatable relatively in the circumferential direction.

Abstract: A planarization apparatus comprising a superstrate chuck is provided. The superstrate includes a plurality of inner lands protruding from a surface of the superstrate chuck and a peripheral land protruding from the surface of the superstrate chuck along a periphery of the superstrate chuck and encircling the inner lands therein. The peripheral land has a height smaller than a height of each of the inner lands. The peripheral land has a width sufficiently larger than a width of each of the inner lands such that a pressure leakage through the peripheral land is controlled to be less than a threshold.

Abstract: The apparatus (1) for clamping workpieces on machine tools comprises: a basic frame (2) fixable to a machine tool (M) for machining a workpiece (P); a clamping unit (3); a hydraulic actuator (22, 23) comprising a first chamber (26) which can be supplied with a first pressurized hydraulic fluid and is connectable to a first sensing device (27) for sensing the pressure of the first hydraulic fluid; a sensing channel (15) which can be supplied with pressurized air and which is connectable to a sensing sensor (16) for sensing the pressure of the air; wherein the first sensing device (27) and the sensing sensor (16) are connectable to a control system adapted to authorize the machining of the workpiece (P) when the pressure of the first hydraulic fluid and the pressure of the air are simultaneously higher than their respective threshold values.

Abstract: The replacing tool includes a first beam, a connection mechanism, a second beam, a first hook, and a second hook. The first beam is connected to the second beam through the connection mechanism. The first hook is fixedly connected to the first beam, and a portion of the first hook is configured to be engaged into a concave end of the sponge brush. The second hook is fixedly connected to the second beam, and a portion of the second hook is arranged around a convex end of the sponge brush. The first beam and the second beam are movable relative to each other, so that the first hook is engaged with or detached from the concave end of the sponge brush and the second hook is engaged with or detached from the convex end of the sponge brush.

Abstract: A decoupled XY parallel micro-positioning stage, including a central moving platform, fixed mechanisms, bridge-type micro-displacement amplification mechanisms, a four-bar symmetrical flexible guide mechanism and a piezoelectric ceramic. Each fixed mechanism is arranged between adjacent amplification mechanisms and is symmetrical about X and Y axes centered on the moving platform. The amplification mechanism is symmetrically arranged with respect to the X and Y axes, and includes two first and second longitudinal beams and multiple crossbeams. The two first longitudinal beams are provided in parallel and spaced apart. The two second longitudinal beams are arranged spaced apart between the two first longitudinal beams, and are connected to the two first longitudinal beams via the crossbeams. The crossbeams are connected to the longitudinal beams via a flexible hinge. The piezoelectric ceramic is arranged between the two first longitudinal beams.

Abstract: Disclosed are an air circulation system and a final polishing apparatus including the same. The air circulation system improves the degree of contamination in a final polishing apparatus including a housing formed to accommodate a load unit, an unload unit, and a plurality of polishing units. The air circulation system includes air purification units mounted at positions corresponding to the positions of the load unit, the unload unit, and the plurality of polishing units. The air purification units discharge contaminated air in the housing to the outside of the housing, purify the discharged air, and supply the purified air again into the housing.

Abstract: An ice blasting system comprising a hopper to receive bulk ice and a rotary crusher disposed inside the hopper, the rotary crusher having rotary crusher arms that cooperate with anvils to produce crushed ice from the bulk ice. The system includes a rotary feeder mechanism disposed below the hopper, the rotary feeder mechanism having a rotor that includes ice-receiving pockets for receiving the crushed ice. The rotor rotates against an airtight seal block and delivers the crushed ice into a high-pressure airstream passing through the rotary feeder mechanism to thereby entrain the crushed ice into the high-pressure airstream whereby the ice-entrained airstream subsequently exits the ice blasting system through an outlet.

Abstract: An elastic membrane to be used for a polishing head includes a contact portion configured to come into contact with a wafer, an annular side wall provided to stand on an outer peripheral end of the contact portion, a first partition wall linearly extending inward in a radial direction in sectional view from the side wall, and a second partition wall linearly extending inward and upward in the radial direction in sectional view from an outer peripheral end portion of the contact portion, wherein the first partition wall, the second partition wall, and the side wall constitute an edge pressure chamber for pressing an edge of the wafer.

Abstract: A cleaning tool for cleaning accumulated charred food material on grill grates. The cleaning tool is of a two-prong tuning fork shape that has a handle and a cleaning head. A shaft extends between the two prongs of the cleaning head. Several cleaning discs are slidably provided between the two prongs over the shaft wherein two adjacent cleaning discs are separated by one or more spacer discs. the cleaning discs scrap the accumulated material from the grill bars.

Abstract: An anti-pinch device for use with an insulating apparatus and an insulating apparatus that includes the anti-pinch device are provided. The anti-pinch device includes a body configured to be at least partially disposed about an insulating apparatus. The body is configured to translate relative the insulating apparatus. The device further includes a pinch prevention mechanism attached to the body of the anti-pinch device. The pinch prevention mechanism is configured to prevent ingress of at least a portion of a user's finger into the insulating apparatus in an instance in which the user actuates an input element defined by the insulating apparatus.