Abstract: Embodiments of the invention are generally directed to testing of high-speed input-output devices. An embodiment of a high-speed input-output apparatus includes a transmitter and a receiver, and a loop-back connection from an output of the transmitter to an input of the receiver, the loop-back connection including a first connector and a second connector for transmission of differential signals. The apparatus further includes a first inductor having a first terminal and a second terminal and second inductor having a first terminal and a second terminal, the first terminal of the first inductor being connected to the first connector and the first terminal of the second inductor being connected to the second connector, the second terminal of the first inductor and the second terminal of the second inductor providing a test access port for direct current testing of the apparatus.

Abstract: A circuit arrangement (10) for testing a reset circuit (11) comprises the reset circuit (11) and a changeover switch (14). The reset circuit comprises a voltage input (12) for feeding an input voltage (VDD) and an output (13) for providing a reset signal (POR) as a function of the input voltage (VDD). The changeover switch (14) comprises a first input (15) for feeding a test voltage (VTM), a second input (16) for feeding a supply voltage (VBAT), a control input (17) for changing over between the first and the second input (15, 16) as a function of the test signal (TM), and an output (18) that is coupled to the voltage input (12) of the reset circuit (11).

Abstract: A battery pack includes: one or two or more secondary batteries; a charge control switch that turns on/off a charging current to the secondary battery; a discharge control switch that turns on/off a discharging current from the secondary battery; a current-detecting element for detecting the charging current and the discharging current; a voltage measuring part that measures the voltage of the secondary battery; a control unit that controls the charge control switch and the discharge control unit; and a storage unit that stores an initial internal resistance of the secondary battery. The control unit measures a closed circuit voltage and a charging current during charging, and a first closed circuit voltage after a first waiting time and a second closed circuit voltage after a second waiting time. The second waiting time is longer than the first waiting time.

Abstract: A self charging ion current sensing circuit is provided. The self charging ion current sensing circuit is coupled to spark generation circuitry, and utilizes the spark plug electrodes as the ion current sensing electrodes. The self charging is achieved by utilizing the spark current during an ignition event to charge an ion bias capacitor. After the ignition event, the charge voltage build up on the ion bias capacitor is used to provide an ion current across the spark plug gap. The ion current is passed through an offset stage that translates the ion current sense voltage to a voltage that can be buffered and amplified from a single power source available in automotive and vehicular applications. The output of the circuit provides tri-state information, including spark current, null current, and linear representation of ion sense current.

Abstract: A non-contact voltage contrast (VC) method of determining TSV joint integrity after partial assembly. A TSV die is provided including TSVs that extend from a frontside of the TSV die to TSV tips on a bottomside of the TSV die. At least some TSVs (contacting TSVs) are attached to pads on a top surface of a multilayer (ML) package substrate. The ML package substrate is on a substrate carrier that blocks electrical access to the frontside of the TSV die. Two or more nets including groups of contacting TSVs are tied common within the ML substrate. A charged particle reference beam is directed to a selected TSV within a first net and a charged particle primary beam is then rastered across the TSVs in the first net. VC signals emitted are detected, and joint integrity for the contacting TSVs to pads of the ML package substrate is determined from the VC signals.