Abstract: A nozzle for cleaning a lens surface of a camera includes a cleaning liquid path that guides a cleaning liquid to a discharge port and an air passage that guides a compressed air to a discharge port. Furthermore, a distal end portion of the cleaning liquid path and a distal end portion of the air passage are disposed so as to be proximate to each other, or are disposed so as to be merged with each other. Then, at the time of cleaning the lens surface, the compressed air is made intermittently jet from the discharge port, and the cleaning liquid is suctioned with the negative pressure occurring due to the jetting of the compressed air to make the cleaning liquid intermittently jet from the discharge port, thereby cleaning the lens surface.

Abstract: The present invention relates to an automatic cleaning apparatus (1) for cleaning facades on multi-story buildings. The apparatus comprises a rotating brush (11) arranged rotatable about its longitudinal axis, a drive mechanism (16) for rotating the brush, a container (18) for housing a cleaning fluid, and a fluid feeding device adapted to feed the rotating brush with cleaning fluid from the container by means of capillarity forces. The apparatus is designed to engage to steering guides (4) provided on the facade. The apparatus is designed so that a downward movement of the apparatus is solely powered by gravity forces acting on the apparatus.

Abstract: A robot cleaner includes a main brush to sweep or scatter dust off a floor, a main brush motor to rotate the main brush, a Revolution Per Minute (RPM) detector to detect an RPM of the main brush motor, and a control unit to determine a type of floor according to the RPM of the main brush motor acquired by the RPM detector and control an operation of the robot cleaner based on the determined type of floor. A carpet mode to clean only a carpet area and a hard floor mode to clean a hard floor area excluding the carpet area are given based on detected information relating to the material of a floor, which enables partial cleaning with respect to a cleaning area selected by a user and adjustment in the number of cleaning operations or the intensity of cleaning according to the material of the floor.

Abstract: Flash vortex brush cleaning apparatus is provided which comprises a device and method for cleaning inner channels of boreholes which have been drilled or cored within solid substrates, particularly, concrete, masonry, grout, where the boreholes are to be used to bond adhesive anchors therein. Flash vortex brush device comprises a straight tubular shaft; a coil cleaning brush. Tubular shaft includes a first end including an open inlet; opposing second end including an open outlet; first end including a connector element. Coil cleaning brush includes bristles secured in channel affixed wound proximate to second end of shaft developed of pitch to form an open wound coil. Connector element provides removable attaching means to a variety of pre-existing nozzles. For rapid efficient cleaning, first embodiment for use includes flash vortex brush removably attached with air nozzle; second embodiment for use includes flash vortex brush removably attached with water nozzle.

Abstract: An air filter reconditioning apparatus is provided for cleaning air filters. There is a vessel body with a lid and an arbor axle tube provides a source of incoming air. A two stage live arbor is provided having a first roller bearing fitted on the arbor axle tube, a spacer ring fitted on the first roller bearing, a second roller bearing fitted on the arbor axle tube, an impeller ring fitted on the second roller bearing and a housing fitted on the spacer ring and the impeller ring, with an air redirection plate disposed in the housing and fitted to the arbor axle tube. A V-grooved arbor nozzle adapter is threadably connected to the housing such that the housing and the V-grooved nozzle adapter rotate around the arbor axle tube. Nozzles defined in the V-grooved arbor nozzle adapter direct air into the air filter during rotation.

Abstract: An apparatus for processing semiconductor wafers includes at least a wet bench and an automatic handling system of a wafer carrier removably connected thereto. The wet bench includes a first processing tank, a second processing tank and a third processing tank, separated from one another, each processing tank being dedicated to a different chemical, as well as a special cleaning and drying tank for processing the automatic handling system when the wafer carrier has been removed.

Abstract: The present invention is related to a method and apparatus for cleaning a substrate, in particular a semiconductor substrate such as a silicon wafer. The substrate is placed in a tank containing a cleaning liquid, at an angle with respect to acoustic waves produced in said liquid. The angle corresponds to the angle of transmission, i.e. the angle at which waves are not reflected off the substrate surface. A damping material is provided in the tank, arranged to absorb substantially all waves thus transmitted through the substrate. A significant improvement in terms of cleaning efficiency is obtained by the method of the invention.

Abstract: A dishwasher includes a cabinet; a washing tub provided at an inside of the cabinet; a sump provided at a lower side of the washing tub to store wash water; a heater to heat the wash water; a spray nozzle configured to spray the heated wash water that is pumped from the sump toward inside of the washing tub; and a door configured to open and close a front of the washing tub, the door including a drying device configured to cool high-temperature/high-humidity air from the washing tub and then to discharge the cooled air outside of the dishwasher. The drying device includes a condensation duct to condense the high-temperature/high-humidity air from the washing tub; a first fan to draw in air from the washing tub to the condensation duct; and a second fan to draw in external air to the condensation duct.

Abstract: A substrate treatment apparatus includes: a substrate holding unit which horizontally holds a substrate; a liquid droplet nozzle which generates droplets of a treatment liquid which are sprayed on a spouting region on an upper surface of the substrate held by the substrate holding unit; and a protective liquid nozzle which spouts a protective liquid obliquely onto the upper surface of the substrate held by the substrate holding unit for protection of the substrate to cause the protective liquid to flow toward the spouting region on the upper surface of the substrate, whereby the spouting region is covered with a film of the protective liquid and, in this state, the treatment liquid droplets are caused to impinge on the spouting region.

Abstract: Setting method for microplate washing devices has a receptacle for receiving a microplate and a washing head having washing cannulas. The cannulas are in an array corresponding to a well array with lowermost ends define a work plane. This work plane is parallel to a reference plane. In a first phase, the receptacle and/or washing head are moved together until the lowermost ends of the cannulas touch a surface defining the reference plane. A sensor device has a controller linked thereto and from the sensor device is registered using the controller and a relative altitude value is determined therewith, which indicates touching of the surface by the lowermost ends of the cannulas or for determining the position of this surface. Based on this, an active altitude of the lowermost ends of the washing cannulas in relation to an inner surface of the well bottoms of a microplate is determined.

Abstract: Soak vessels for impregnating biomass with a liquid such as a dilute acid and methods for impregnating biomass are disclosed. In some embodiments, the soak vessel includes an impeller assembly with impellers that create a vortex to submerge the biomass, that agitate and separate contaminants from the biomass and that direct biomass and contaminants to separate vessel outlets.

Abstract: A chemical liquid process is performed on a substrate. Then, a rinse process that supplies a rinse liquid to the substrate is performed. Thereafter, a drying process that dries the substrate is performed while rotating the substrate. The drying process includes a first drying process that rotates the substrate at a first rotational speed; a second drying process that decreases the rotational speed of the substrate to a second rotational speed lower than the first rotational speed after the first drying process. In the second drying process, the rinse liquid and a drying solution are agitated and substituted while generating braking effect. In a third drying process, the rotational speed of the substrate is increased from the second rotational speed to a third rotational speed after the second drying process. Thereafter, in a fourth drying process, the drying solution on the substrate is scattered away by rotating the substrate.

Abstract: A plating apparatus includes a vessel for holding a bath of plating liquid. A head is adapted to hold a work piece, such as a silicon wafer, in the vessel, with a seal on the head sealing against the work piece. A component cleaner assembly may be used to automatically clean a component of the plating apparatus, such as a seal or a contact ring. The cleaner assembly has a component contactor, such as a brush, on an arm. An arm actuator is linked to the arm for moving the arm from a retracted position, to a deployed position, where the contactor is in physical contact with the component. A method for cleaning a component of a plating apparatus includes moving a scrubber or contactor into contact with the component and applying a cleaning liquid onto the component adjacent to the contactor.

Abstract: A cleaning device for cleaning respirators, in particular breathing regulators and/or breathing masks, is proposed. The cleaning device comprises at least one cleaning chamber for receiving at least one respirator. The cleaning device also has at least one fluid device for applying at least one cleaning fluid to the respirator. The cleaning device also has at least one pressure application device with at least one pressure connection. The pressure connection can be connected to at least one gas carrying element of the respirator. The pressure application device is set up for applying pressurized gas to the gas carrying element.

Abstract: The present subject matter provides a dishwasher appliance that measures the amount of ozone in a wash chamber of the appliance. The appliance is also configured for adjusting the amount of ozone in the wash chamber based upon such measurements. The appliance may adjust the amount of ozone by, e.g., adjusting the flow rate of wash fluid to the wash chamber, adjusting the flow rate of air in the wash chamber, and/or adjusting the temperature of wash chamber. Related methods are also provided.

Abstract: A wash-out container has a collection basin, a filter and a pump. Water used for washing tools is filtered and re-used so the wash-out container is stand-alone.

Abstract: A method of washing polycrystalline silicon is provided. The method includes a step of acid cleaning in which the polycrystalline silicon is cleaned with an acid solution and a step of a water cleaning in which the polycrystalline silicon is cleaned by pure water after the step of acid cleaning. In the step of water cleaning, residual acid solution on the surface of the polycrystalline silicon is removed by immersing the polycrystalline silicon in pure water held in a water cleaning bath, and replacing the pure water in the water cleaning bath at least once. The electrical conductivity (C) of the pure water in the water cleaning bath is measured. Based on the reading of the electrical conductivity (C), the timing for finishing the step of water cleaning is decided.

Abstract: Semiconductor wafers are cleaned, dried, and hydrophilized the following steps in the order stated: a) treating the semiconductor wafer with a liquid aqueous solution containing hydrogen fluoride, the semiconductor wafer rotating about its center axis at least occasionally, and b) drying the semiconductor wafer by rotation of the semiconductor wafer about its center axis at a rotational speed of 1000 to 5000 revolutions per minute in an ozone-containing atmosphere, the liquid aqueous solution containing hydrogen fluoride flowing away from the semiconductor wafer on account of the centrifugal force generated by the rotation, and the surface of the semiconductor wafer being hydrophilized by ozone.

Abstract: A liquid processing method is provided for performing a liquid process on a front surface of a substrate by using a processing solution and then performing a rinse process on the front surface of the substrate by using a rinse solution having a temperature lower than a temperature of the processing solution. The method includes performing an intermediate process between the liquid process and the rinse process, for adjusting a temperature of the front surface of the substrate to a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution. In the intermediate process, an intermediate processing solution having a temperature higher than the temperature of the rinse solution and lower than the temperature of the processing solution is supplied only to a rear surface of the substrate.

Abstract: An air filter reconditioning apparatus is provided for cleaning air filters. There is a vessel body with a lid and an arbor axle tube provides a source of incoming air. A two stage live arbor is provided having a first roller bearing fitted on the arbor axle tube, a spacer ring fitted on the first roller bearing, a second roller bearing fitted on the arbor axle tube, an impeller ring fitted on the second roller bearing and a housing fitted on the spacer ring and the impeller ring, with an air redirection plate disposed in the housing and fitted to the arbor axle tube. A V-grooved arbor nozzle adapter is threadably connected to the housing such that the housing and the V-grooved nozzle adapter rotate around the arbor axle tube. Nozzles defined in the V-grooved arbor nozzle adapter direct air into the air filter during rotation.