Abstract: A secure memory includes a bistable memory cell having a programmed start-up state, and means for flipping the state of the cell in response to a flip signal. The memory may include a clock for generating the flip signal with a period, for example, smaller than the acquisition time of an emission microscope.

Abstract: Shifts in the apparent charge stored on a floating gate (or other charge storing element) of a non-volatile memory cell can occur because of the coupling of an electric field based on the charge stored in adjacent floating gates (or other adjacent charge storing elements). To compensate for this coupling, the read or programming process for a given memory cell can take into account the programmed state of an adjacent memory cell. To determine whether compensation is needed, a process can be performed that includes sensing information about the programmed state of an adjacent memory cell (e.g., on an adjacent bit line or other location).

Abstract: A delay locked loop circuit is disclosed. The circuit includes a phase detector for comparing the phase of an input clock signal with the phase of a feedback clock signal that is fed back into the phase detector, and for outputting a detection signal. The circuit also includes a control circuit unit for controlling a delay line in response to the detection signal, a delay line for delaying the input clock by a predetermined amount of delay in response to output impedance calibration codes applied to the delay line, and a replica circuit configured to have the same delay conditions as those of an actual clock path to a circuit of the semiconductor device, to receive a delay clock signal of the delay line, and to generate the feedback clock signal.

Abstract: An integrated circuit comprises a memory array and a bias circuit. The memory array comprises a plurality of memory cells arranged in a grid of rows and columns. A first conductor is coupled to a power supply voltage terminal of each of the plurality of memory cells. A second conductor is coupled to receive a power supply voltage. The memory array also includes a plurality of dummy cells. A transistor of one or more of the plurality of dummy cells has a first current electrode coupled to the first conductor, a second current electrode coupled to the second conductor, and a control electrode. The bias circuit is coupled to the control electrode of the transistor.

Abstract: Nanoelectromechanical systems are disclosed that utilize vertically grown or placed nanometer-scale beams. The beams may be configured and arranged for use in a variety of applications, such as batteries, generators, transistors, switching assemblies, and sensors. In some generator applications, nanometer-scale beams may be fixed to a base and grown to a desired height. The beams may produce an electric potential as the beams vibrate, and may provide the electric potential to an electrical contact located at a suitable height above the base. In other embodiments, vertical beams may be grown or placed on side-by-side traces, and an electrical connection may be formed between the side-by-side traces when beams on separate traces vibrate and contact one another.

Abstract: A semiconductor memory includes a memory cell array including a plurality of memory cells arranged in rows and columns, a plurality of bit lines, each bit line connected to a corresponding column of the memory cells; a column selection circuit configured to select at least one bit line in response to a column select signal; and a read circuit configured to precharge the selected bit line in response to a precharge signal, to apply a read bias to the precharged bit line in response to a read bias provision signal, and to read data from the memory cells. A resistance level of each of the memory cells varies according to data stored therein, and the read circuit reads data from a first memory cell of the plurality of memory cells in response to the precharge signal having a first pulse width and reads data from a second memory cell of the plurality of memory cells in response to the precharge signal having a second pulse width.

Abstract: An integrated circuit includes a memory cell structure including a first cell and a second cell. The first cell includes a first storage structure and a first gate over a substrate. The first gate is over the first storage structure. The second cell includes a second storage structure and a second gate over the substrate. The second gate is over the second storage structure. The first gate is separated from the second gate. A first doped region is adjacent to the first cell and is coupled to a first source. A second doped region is configured within the substrate and adjacent to the second cell. The second doped region is coupled to a second source. At least one third doped region is between the first cell and the second cell, wherein the third doped region is floating.

Abstract: A digital design and technique may be used to implement a Manhattan Nearest Neighbor content addressable memory function by augmenting a serial content addressable memory design with additional memory and counters for bit serially accumulating in parallel and subsequently comparing in parallel all the Manhattan distances between a serially inputted vector and all corresponding vectors resident in the CAM. Other distance measures, besides a Manhattan distance, may optionally be used in conjunction with similar techniques and designs.

Abstract: A nonvolatile memory structure with pairs of serially connected threshold voltage adjustable select transistors connected to the top and optionally to the bottom of NAND series strings of groups of the dual-sided charge-trapping nonvolatile memory cells for controlling connection of the NAND series string to an associated bit line. A first of the threshold voltage adjustable select transistors has its threshold voltage level adjusted to a first threshold voltage level and a second of the threshold voltage adjustable select transistors adjusted to a second threshold voltage level. The pair of serially connected threshold voltage adjustable select transistors is connected to a first of two associated bit lines. The NAND nonvolatile memory strings further is connected to a pair of serially connected threshold voltage adjustable bottom select transistors that is connected to the second associated bit line.

Abstract: In fuse program circuits, fuse element FS is implemented using metal interconnect at third or higher layer of multilayer metal interconnect. In each fuse program circuit, program information and fuse select information are sequentially transferred using a scan flip-flops, and fuses are selectively and electrically blown one by one. The fuse program circuit provided with fuse elements that can be programmed even after packaging is implemented with low power consumption and a low occupation area.

Abstract: A nonvolatile memory device includes resistive memory devices in a three-dimensional structure. A block select circuit generates a block select signal for selecting a memory block. In response to the block select signal, local word line selection units connected to each memory block connect global word lines connected to a word line decoder and local word lines, and local bit line selection units connected to each memory block connect global bit lines connected to a sense amplifier and local bit lines. Each memory block includes local word lines which extend in a first direction and are stacked in a second direction perpendicular to the first direction on a second plane perpendicular to a first plane. Local bit lines extend in the second direction to cross local word lines. Memory cells are formed at cross-points where local word lines and local bit lines cross one another.

Abstract: A multi-bit cell of magnetic random access memory comprises a magnetic tunnel junction element including a first and second free layer comprising a changeable magnetization oriented substantially perpendicular to a layer plane in its equilibrium state and a switching current, a first and second tunnel barrier layer, and a pinned layer comprising a fixed magnetization oriented substantially perpendicular to a layer plane, the pinned layer is disposed between the first and second free layers and is separated from the free layers by one of the tunnel barrier layers, a selection transistor electrically connected to a word line, and a bit line intersecting the word line. The magnetic tunnel junction element is disposed between the bit line and the selection transistor and is electrically connected to the bit line and the selection transistor, wherein the first and second free layers have substantially different switching currents.

Abstract: To provide a semiconductor memory device including a mode register in which a mode signal is set, a data amplifier that amplifies read data read from a memory cell array, a data bus onto which the read data amplified by the data amplifier is transmitted, a data input/output circuit that outputs a signal on the data bus to outside, and a mode signal output circuit that outputs the mode signal set in the mode register onto the data bus. Because the mode signal is not caused to interrupt halfway along the data input/output circuit, but supplied onto the data bus that connects the data amplifier to the data input/output circuit, no collision of the read data with the mode signal occurs in the data input/output circuit.

Abstract: A semiconductor integrated circuit device includes a memory cell array including a plurality of planes each including a plurality of memory cells, a power supply voltage generating circuit including a voltage generating circuit configured to generate a power supply voltage common to the plurality of planes, a select number detection circuit configured to detect a number of selected planes of the plurality of planes, and a resistance variable circuit configured to vary a wiring resistance between the plurality of planes and the voltage generating circuit in accordance with the number of selected planes, which is reported from the select number detection circuit, and a control circuit configured to control the power supply voltage generating circuit.

Abstract: A method of performing an operation on a flash memory cell device, used when a gate coupling ratio between a floating gate and a control gate of less than 0.4. A potential is required to be applied across the control gate. Electrons are either injected to the floating gate from the control gate or ejected from the floating gate to the control gate. The operation associated with the injection or the ejection is determined by the nature of a silicon channel provided in the device. Devices using a bulk-tied FinFET-like structure are particularly suited to this method. The method is also particularly suited for use on cells in a NAND array.

Abstract: An inverter device includes a first nanowire connected to a voltage source node and a ground node, a first p-type field effect transistor (pFET) device having a gate disposed on the first nanowire, and a first n-type field effect transistor (nFET) device having a gate disposed on the first nanowire.

Abstract: A memory module is provided comprising a substrate having an interface to a host system, volatile memory, non-volatile memory, and a logic device. The logic device may receive the indicator of an external triggering event and copies data from the volatile memory devices to the non-volatile memory devices upon receipt of such indicator. When the indicator of the triggering event has cleared, the logic device restores the data from the non-volatile to the volatile memory devices. The memory module may include a passive backup power source (e.g., super-capacitor) that is charged by an external power source and temporarily provides power to the memory module to copy the data from volatile to non-volatile memory. A voltage detector within the memory module may monitor the voltage of an external power source and generates an indicator of a power loss event if voltage of the external power source falls below a threshold level.

Abstract: A single-ended sense amplifier circuit of the invention comprises first and second MOS transistors and first and second precharge circuits. The first MOS transistor drives the bit line to a predetermined voltage and switches connection between the bit line and a sense node and the second MOS transistor whose gate is connected to the sense node amplifies the signal via the first MOS transistor. The first precharge circuit precharges the bit line to a first potential and the second precharge circuit precharges the sense node to a second potential. Before sensing operation, the bit line is driven to the predetermined voltage when the above gate voltage is controlled to decrease. The predetermined voltage is appropriately set so that a required voltage difference at the sense node between high and low levels can be obtained near a changing point between charge transfer/distributing modes.

Abstract: An information storage device includes a storage node, a write unit configured to write information to a first magnetic domain region of the storage node, and a read unit configured to read information from a second magnetic domain region of the storage node. The information storage device further includes a temporary storage unit configured to temporarily store information read by the read unit, and a write control unit electrically connected to the temporary storage unit and configured to control current supplied to the write unit. The information read from the second magnetic domain region is stored in the temporary storage unit and written to the first magnetic domain region.

Abstract: A semiconductor memory device includes a first data input circuit configured to align data inputted to a first data pad in parallel for transferring the aligned data to a first global bus and for transferring the aligned data to a second global bus in a test mode; and a second data input circuit configured to align data inputted to a second data pad in parallel for transferring the aligned data to the second global bus and to not receive data in the test mode.