Abstract: A test probe assembly includes a first elongate electrically conductive plunger that extends from a proximal first plunger end to a distal first plunger end, and is defined in part by a central longitudinal axis. The first plunger has a first spring latch at the distal first plunger end. At least a portion of the first plunger has an arc with a first plunger outer contact point opposite the first spring latch relative to the longitudinal axis. The first plunger is disposed in a spring. The first plunger outer contact point in contact with the inner diameter of the spring, and the first spring latch engages at least a portion of the spring.

Abstract: A probe guide plate used for a semiconductor inspection apparatus that inputs and outputs an electrical signal for inspecting an object via a probe needle, the probe guide plate includes a silicon substrate provided with a through hole that penetrates the silicon substrate from one surface to another surface through which the probe needle is inserted, the through hole including a first tapered portion provided at an end portion at the one surface side such that the hole size of which increases as it approaches the one surface, and a second tapered portion provided at an end portion at the other surface side such that the hole size of which increases as it approaches the other surface; and a silicon oxide film formed on an inner wall surface of the through hole including the first tapered portion and the second tapered portion.

Abstract: An example method includes positioning a first conformable sensor proximate to a downhole element. The first conformable sensor may include a flexible material, with first and second transmitters and first and second receivers coupled to the flexible material. A first signal may be generated using the first transmitter and a second signal using the second transmitter. A first response of the downhole element to the first signal and a second response of the downhole element to the second signal may be measured at the first receiver. A third response of the downhole element to the first signal and a fourth response of the downhole element to the second signal may be measured at the second receiver. At least the first, second, third, and fourth responses may be combined into a compensated response of the downhole element. The compensated response may be processed to determine a parameter of the downhole element.

Abstract: A fault detecting apparatus, to use an output current from a drive circuit as a current value detected by a current sensor, calculates a duty ratio of a control signal to be supplied to the drive circuit to define the duty ratio as a theoretical value of the duty ratio of the control signal. The fault detecting apparatus compares a duty ratio of a control signal actually supplied to the drive circuit with the theoretical value of the duty ratio of the control signal to determine whether the current sensor (fails on the basis of a comparison result.

Abstract: In a magnetic sensor, a pinned layer covers a wiring layer on a side opposite to a substrate with respect to the wiring layer and includes a bent portion having a bent shape in cross section. Free layers are arranged on a side opposite to the substrate with respect to the pinned layer. The size of the free layers in a planar direction is set to a size smaller than the size of the pinned layer in the planar direction. A magnetic field leaking from the pinned layer may form a closed loop adjacent to the substrate, that is, on a side opposite to the free layers with respect to the substrate. Therefore, influence of the magnetic field leaking from the pinned layer on the free layers can be restricted.

Abstract: A power supply noise measurement circuit includes a multiphase filter coupled to receive a power supply signal. The multiphase filter is coupled to output a first filtered power supply signal for a first phase, and a second filtered power supply signal for a second phase. A multiphase amplifier is coupled to the multiphase filter to sample offset voltages in response to the first filter power supply signal during the first phase to set up DC operation points in the multiphase amplifier, and generate an amplified power supply noise signal during the second phase. An overshoot detector is coupled to the multiphase amplifier to detect overshoot events in the amplified power supply noise signal, and an undershoot detector is coupled to the multiphase amplifier to detect undershoot events in the amplified power supply noise signal.

Abstract: An apparatus comprises a contactless sense probe, an electro optic sensor module, and a test signal emitter circuit. The contactless sense probe includes a photoconductive switch and the signal bandwidth of the photoconductive switch is variable. The test signal emitter circuit configured to apply a test signal to a device under test (DUT) at a first location of the DUT, wherein the test signal includes a test signal frequency. The electro-optic sensor module is coupled to the contactless sense probe and configured to: generate an impulse signal at the contactless sense probe using an optical signal input to the first photoconductive switch; sense the test signal frequency in the impulse signal using the contactless sense probe at a second location of the DUT; and generate an indication of a defect in the DUT when the test signal frequency is undetected in the impulse signal.

Abstract: A resonant inductive sensing system includes in the drive current signal path of the resonator a pulse shaper for noise reduction, including reducing noise resulting from down modulation of signal energy around harmonics of the oscillator (multiples of the resonance frequency), and from uncertainty in the duration of the oscillation period. The pulse shaper is configured so that, for each modulation period of the drive current, consecutive drive current pulses are substantially identical. In example embodiments, an inductance-to-digital conversion (IDC) unit includes drive circuitry configured to drive excitation current pulses to the resonator with a modulation period synchronized with a resonator oscillation frequency, and pulse shaping circuitry configured to pulse shape the drive current pulses so that each pair of drive current pulses within a modulation period are substantially identical.

Abstract: The disclosure provides a magnetic field sensor for sensing the magnetic field caused by a current to be measured, which includes: substrate; a first drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured; and a second drive electrode with a path for flowing a reference current supplied from the substrate arranged so as to be moveable by the magnetic field of the current to be measured, thus measuring the variation of a capacitance caused by the movement of the first drive electrode and the second drive electrode. Hence, the sensing is achieved by the two drive electrodes with no reference electrode, thus maximizing the mechanical displacement to improve the sensing capability.

Abstract: Systems and techniques for a detecting a magnetic target that reduce output signal jitter are disclosed. A system includes a magnetic target. The magnetic target has a plurality of regions having juxtaposed edges and opposing ends. Adjacent ones of the plurality of regions have different magnetic polarities. The magnetic target includes a first magnetic strip, having a first magnetic polarity disposed at one end of the regions, and a second magnetic strip having a second magnetic polarity opposite to the first magnetic polarity disposed at a second end of the regions to generate a magnetic bias across at least a portion of the regions. The system includes at least one magnetic field sensing element placed in proximity to the magnetic target and configured to produce an output signal responsive to the magnetic target.

Abstract: An electromagnetic exploration device minimizes signal interference due to a metal body or electronic components that constitute an air vehicle by installing a transmission coil and a receiving coil in an envelope of an airship, and enables a batch arrangement of the optimized transmission coil and receiving coil in accordance with various exploration purposes using the envelope shape, thereby acquiring exploration data from one flight. The device in an airship having an envelope includes: a transmission coil along the periphery of the horizontal axial direction of the envelope, for generating a primary magnetic field; at least one receiving coil along the periphery of the envelope, for detecting a secondary magnetic field induced by the primary magnetic field; and an analyzing device for applying an electric current to the receiving coil and analyzing a measurement value of the secondary magnetic field detected by the receiving coil, thereby performing air electromagnetic exploration.

Abstract: A system for a capacitive sensing device includes transmitter electrodes configured to transmit transmitter signals, receiver electrodes configured to receive resulting signals including effects corresponding to the transmitter signals. The system further includes dual nodes corresponding to a first capacitive coupling between the transmitter electrodes and the receiver electrodes, and primary nodes corresponding to a second capacitive coupling between the transmitter electrodes and the receiver electrodes. The first capacitive coupling is less than the second capacitive coupling.

Abstract: A battery simulator can operate to provide different outputs. These outputs provide different characteristics related to how a device under test operates. In an example, a controller such as an electronic control module (ECM) or battery energy control module (BECM) can be tested. The battery simulator may provide different modes, e.g., a high current mode or a voltage change over time mode. A traction battery simulator may include a controller, analog output circuitry being controlled by the controller to output test current and test voltage, and switching circuitry connected to the analog output circuitry that has a first state and a second state. The first state is to provide an increased change in voltage over change in time relative to the second state. The second state is to provide an increased capacitance over the first state.

Abstract: This invention describes a method and apparatus to cancel the mutual inductance between mutually coupled transmit coils, each of the transmit coils fed by individual power amplifiers, and the transmit coils all sharing a common ground with the power amplifiers. The methods and systems disclosed consist of coupling the return legs of each transmit coil to a mutual inductance cancellation circuit near a common ground return connection. The cancellation circuit uses a combination of inductors and capacitors to bridge various combinations of the transmit coils without physically connecting the “bridged” transmit coils. Transmit coils “bridged” using inductors have positive mutual inductance added to them, while transmit coils “bridged” using capacitors have negative mutual inductance added to them.

Abstract: A power detector for detecting an output power of a power amplifier is provided. The power amplifier is used to transmit signal power to the antenna. The power detector includes a phase shifter, a multiplier and a calibration unit. The phase shifter sequentially applies a plurality of candidate phase calibration amounts to the output voltage of the power amplifier to generate a plurality of adjusted signals with different phases in a calibration mode. The multiplier sequentially mixes the replica current and each of the plurality of adjusted signals, to generate a plurality of analog signals with different phases. The calibration circuit determines a target phase calibration amount of the phase shifter from the candidate phase calibration amounts according to the plurality of analog signals.

Abstract: A method for accurately electrically measuring a width of a fin of a FinFET, using a semiconductor fin quantum well structure is provided. The semiconductor fin quantum well structure includes a semiconductor substrate and at least one semiconductor fin coupled to the substrate. Each of the semiconductor fin is sandwiched by an electrical isolation layer from a top and a first side and a second side across from the first side, to create a semiconductor fin quantum well. At least one gate material is provided on each side of the electrical isolation layer. A dielectric layer is provided over the top of the electrical isolation layer to further increase the electrical isolation between the gate materials. The width of the semiconductor fin is measured accurately by applying a resonant bias voltage across the fin by applying voltage on the gate materials from either side. The peak tunneling current generated by the applied resonant bias voltage is used to measure width of the fin.

Abstract: A system and method for locating an object within a structure includes a magnetically-responsive member coupled to the object. A magnetic field generator generates a magnetic field in the presence of the structure. The generated magnetic field causes the magnetically-responsive member to output a signal when the magnetically-responsive member is in the presence of the magnetic field. A detector may include a sensor coupled to a control unit. The sensor detects the signal output by the magnetically-responsive member. The control unit locates the object based on detection of a third harmonic of the signal.

Abstract: A method of testing semiconductor devices includes contacting bond pads coupled to integrated circuitry on a first die of a plurality of interconnected die on a substrate using a probe system having probes and probe tests including parametric tests, continuity tests, and a kill die subroutine. Probe tests using the probe program are performed. Die are binned into a first bin (Bin 1 die) for being a good die for all probe tests, or a second bin (Bin 2 die) for failing at least one of continuity tests and parametric tests. The Bin 2 die are divided into a first sub-group that failed the continuity tests and a second sub-group that do not fail the continuity tests. A kill die subroutine is triggered including applying power sufficient to selectively cause damage to the second sub-group of Bin 2 die to generate a continuity failure and thus generate kill die.

Abstract: A glazing having a device for detecting a crack in the glazing comprises a sensor, substantially circumscribing a ply of glazing material. A surface contact, bonded to the glazing, is configured with a portion of the sensor to form a capacitive coupling for transferring AC signals in a frequency range. Preferably the sensor is frangible and voltage may be applied by a second surface contact. Alternatively, the glazing further comprises an electrically resistive element, such as a coating for heating the glazing, and voltage may be applied to the sensor by a spur from a busbar such that damage to coating, busbar or sensor resulting in arcing is detectable at the surface contact. An electronics module attached to the surface contact generates an alarm.

Abstract: A method for making downhole electromagnetic logging while drilling measurements includes rotating an electromagnetic logging while drilling tool in a subterranean wellbore. The logging tool includes first and second transmitters, each of which includes a tilted antenna, and a receiver axially spaced apart from one another. Electromagnetic voltage measurements are made at the receiver while the tilted transmitting antenna in the first transmitter fires during tool rotation. The electromagnetic voltage measurements are mathematically rotated through at least the arbitrary angle to obtain rotated measurements, selected ratios of which are processing to compute gain compensated measurement quantities.