Abstract: This invention relates to novel compositions comprising a protective polymer layer and a UV blocking agent. This is used in the fabrication of electronic devices using thick film pastes. The present invention is also an electronic device fabrication process using the compositions. The protective polymer layer is fabricated from materials, which are insoluble after irradiation in the ester-type solvents contained in the thick film paste. By appropriate selection of protective film polymers, the protective film can be compatible with the thick film paste and can be further used to shield portions of the thick film paste from UV irradiation.

Abstract: Photoresist patterns are formed using a photoresist composition, which includes water, a negative photoresist polymer having a salt-type repeating unit, and a photoacid generator, so that a developing process can be performed not by using conventional TMAH solution but by using water. Additionally, because the main solvent of the composition is water, the disclosed photoresist composition is environment-friendly, and has a low light absorbance at 193 nm and 248 nm, which is useful in a photolithography process using a light source in a far ultraviolet region when high-integrated fine circuits of semiconductor device are manufactured.

Abstract: Disclosed is a process for preparing branched polyarylene ether polymers by (A) providing a reaction mixture comprising (i) a polyfunctional phenol compound of the formula Ar(OH)x wherein x?3 and wherein Ar is an aryl moiety or an alkylaryl moiety, provided that when Ar is an alkylaryl moiety at least three of the —OH groups are bonded to an aryl portion thereof, (ii) a compound of the formula wherein m is 0 or 1, Y and Y? each, independently of the other, is fluorine or chlorine, and A is as defined herein, (iii) a compound of the formula wherein B is as defined herein, and (iv) a carbonate base; and (B) heating the reaction mixture and removing generated water from the reaction mixture, thereby effecting a polymerization reaction. Also disclosed are polymers prepared by this process and imaging members containing these polymers.

Abstract: Optical media having markings that are non-interfering, or substantially non-interfering with readout of data from the optical media are disclosed. The optical media make use of certain formulations of color forming coatings described herein. Protective coatings used to enhance the color forming coatings are also presented. Methods for incorporating the coatings into the optical media are included. In preferred embodiments, the marking is formed in a photosensitive coating that is applied to the optical media, and then cured with a first light. A second light, having a substantially separate band of wavelengths from the first light, is used to image a marking into the coating. The coating is robust to many external influences, such as ambient environmental conditions, and physical wear.

Abstract: A curable composition comprising: (A) an infrared absorber which is a cyanine dye having a structure in which hetero rings are bonded to each other via a methine chain and which has at least one substituent having a structure selected from the group consisting of an amide bond, a urethane bond, a urea bond and a sulfonamide bond on at least one of aromatic rings at both ends, nitrogen atoms present on the hetero rings at both ends and the methine chain; (B) at least one of a radical generator and an acid generator; and (C) at least one of a radical polymerizable compound and an acid crosslinking agent.

Abstract: A resist material has a base polymer containing a compound including a copolymer of a first unit represented by a general formula of the following Chemical Formula 1 and a second unit represented by a general formula of the following Chemical Formula 2: wherein R1, R2, R3, R7, and R8 are the same or different and are a hydrogen atom, a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20; R4 is a straight-chain alkylene group or a branched or cyclic alkylene group with a carbon number not less than 0 and not more than 20; R5 and R6 are the same or different and are a hydrogen atom, a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group with a carbon number not less than 1 and not more than 20, or a protecting group released by an acid; and R9 is a fluorine atom, or a straight-chain alkyl group, a branched or cyclic alkyl group or a fluoridated alkyl group

Abstract: This invention relates to novel processes comprising a protective polymer layer in the fabrication of electronic devices using thick film pastes. The protective polymer layer is fabricated from materials which are insoluble after irradiation in the ester-type solvents contained in the thick film paste. By appropriate selection of protective film polymers, the protective film can be compatible with the thick film paste.

Abstract: A lithographic printing plate precursor capable of forming an image upon irradiation with an infrared laser comprising a support, a first layer containing as the main component an alkali-soluble resin and a second layer containing as the main component an alkali-soluble resin that is different from the alkali-soluble resin contained as the main component in the first layer in this order, and at least one of the first layer and the second layer contains a mixture comprising at least two kinds of infrared absorbing agents.

Abstract: A positive photosensitive resin composition comprising (A) a polyamic acid, (B) a 1,4-dihydropyridine derivative represented by the general formula (II): wherein R2 is a monovalent organic group; each of R3, R4, R5, and R6 is independently hydrogen or a monovalent organic group; and Ar—NO2 is an aromatic hydrocarbon group having a nitro group at ortho-position, and (C) an amine compound.

Abstract: Methods of fabricating an OLED and a donor substrate are provided. The method includes: preparing a base substrate of a donor substrate; forming a light to heat conversion layer and a transfer layer on the base substrate; preparing a donor substrate including performing a dry cleaning process after forming the transfer layer; preparing a substrate, on which the transfer layer of the donor substrate is to be transferred; laminating the donor substrate and the substrate; and patterning the transfer layer by irradiating a laser to transfer the transfer layer on the substrate.

Abstract: The invention relates to a process for the production of a multi-layer image, preferably a multi-color image. A transfer film which is applied to a paper ubstrate and which is treated with laser irradiation is used. The transfer film has a laser-sensitive layer and a background layer arranged therebeneath. The laser-sensitive layer comprises laser-sensitive material, for example laser-sensitive pigments or other laser-sensitive coloring agents. The laser-sensitive material in the layer is region-wise bleached by laser irradiation. That results in a so-called laser-induced image component. As it is transparent or partly transparent, the background layer which is arranged therebeneath and which can have a printed image then becomes visible from above in that region. That therefore gives a multi-layer image which is formed by the laser-induced image component and by the background layer jointly.

Abstract: Photoresist cleaning solutions are used to clean semiconductor substrates before or after an exposing step when photoresist patterns are formed. The cleaning solutions include H2O and a nonionic surfactant compound represented by Formula 1. By spraying the disclosed cleaning solutions on a surface of the semiconductor substrate before or after exposing step to form a photoresist pattern, the desired pattern only is obtained and unnecessary patterns generated in undesired regions by ghost images are avoided as excess acid generated by the photoacid generator is neutralized and removed and damage to unexposed portions of the photoresist polymer is avoided. wherein R1 and R2 are independently H, C1-C20 alkyl, C5-C25 alkyl aryl or C1-C10 ester; m is 1 or 2; n is an integer ranging from 10 to 300; and o is 0 or 1.

Abstract: Photoresist polymers and photoresist compositions containing the same. Photoresist patterns of less than 50 nm are achieved with EUV (Extreme Ultraviolet) as an exposure light source with photoresist compositions comprising (i) a photoresist polymer comprising a polymerization repeating unit of Formula 2 or (ii) a photoresist polymer comprising a polymerization repeating unit of Formula 3 with polyvinylphenol. As a result, excellent etching resistance can be secured although the photoresist patterns have a very small thickness. wherein R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, a, b, c, d, e, f and g are as defined in the specification.

Abstract: In an immersion lithography process, a pattern is formed by forming a photoresist layer on a wafer, forming a protective coating on the photoresist layer from an overlay material, exposing the layer structure to light in water, and developing. A water-insoluble, alkali-soluble material is used as the overlay material.

Abstract: An imprinting method is disclosed which involves irradiating a photo-curable imprintable medium in a flowable state on a substrate with radiation to initiate curing of the medium, after the irradiating, contacting the medium with a template to form an imprint in the medium, allowing the medium to substantially cure such that the medium is in a substantially non-flowable state while the medium is contacted by the template, and separating the template from the medium while the medium is in the substantially non-flowable state.

Abstract: The present invention relates to methods of use for photocatalytic cleaning compositions and photocatalytic cleaning compositions effective to degrade soils deposited on a surface, to reduce the accumulation of soils on a surface, and to act as an antimicrobial agent.

Abstract: A composition is specified which forms an electrically conductive resist layer and comprises a resin that can be crosslinked to form a base polymer, an organic compound that can be crosslinked to form an electrically conductive substance, a crosslinking agent having an oxidative or reductive action, and at least one solvent. An electrically conductive resist layer of this type may be used for example for dissipating electrical charges when patterning a photoresist by means of electrically charged particles.

Abstract: A lithographic printing plate precursor comprises: an aluminum support that has been subjected to an alkali metal silicate treatment; and an image-recording layer comprising (A) an infrared absorbent, (B) a polymerization initiator and (C) a polymerizable compound, the image-recording layer being removable with at least one of a printing ink and a fountain solution, wherein the aluminum support has a surface where the amount of the Si element attached to the surface in the alkali metal silicate treatment is 1 mg/m2 to less than 10 mg/m2.

Abstract: A method of forming an underlayer of a bi-layer resist including forming a blended material by blending a polymer having an aromatic group and a methacrylate polymer, and coating a substrate with the blended material. The blended material coated on the substrate is irradiated to form an underlayer. The polymer having the aromatic group may be a novolac polymer or a naphthalene polymer.

Abstract: The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.