Patents Examined by Ana L. Carrillo
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Patent number: 5338588Abstract: The present invention contemplates a method of making a hollow section fiber reinforced composite assembly useful as a structural component wherein a first rigid, fiber reinforced, EB (electron beam) curable-thermoplastic composite member is formed by liquid castable molding (LCM) thermoplastic-forming material about a fiber reinforcement and a second rigid, fiber reinforced, EB curable-thermoplastic composite member is similarly formed. An EB-curable adhesive material is provided at an interface between the assembled composite members. The composite members are then partially fusion bonded (e.g. ultrasonic tack welded) together at regions of the interface devoid of adhesive to form a hollow section for subsequent curing. The hollow section is subjected to irradiation by high energy electrons effective to cure the adhesive material and the partially bonded first and second fiber reinforced, EB curable-thermoplastic members to a thermoset condition useful in structural applications.Type: GrantFiled: November 12, 1992Date of Patent: August 16, 1994Assignee: Ticom CorporationInventor: Charles R. Billiu
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Patent number: 5338806Abstract: A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing a thermosetting polyimide with a thermoplastic monomer precursor solution (NR-150B2) and allowing them to react upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene endcapped polyimides which were previously inherently brittle and difficult to process.Type: GrantFiled: January 31, 1992Date of Patent: August 16, 1994Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: Ruth H. Pater
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Patent number: 5338797Abstract: Copolyetherimide ester thermoplastic elastomers having low modulus can be improved with respect to modulus and tensile properties by incorporation therein of certain effective multistage, rubbery interpolymers comprising a crosslinked (meth) acrylate phase and an interpenetrating, crosslinked styrenic phase.Type: GrantFiled: May 14, 1993Date of Patent: August 16, 1994Assignee: General Electric CompanyInventors: Warren J. Peascoe, John A. Tyrell
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Patent number: 5336540Abstract: A connector comprising a housing comprising a resin composition comprising:(A) from 50 to 95 parts by weight of a semi-aromatic polyamide comprising (A1) an adipate of hexamethylenediamine and (A2) a terephthalate of hexamethylenediamine, where the weight ratio of the adipate of hexamethylenediamine (A1) to the terephthalate of hexamethylenediamine (A2) is from 80/20 to 50/50; and(B) from 5 to 50 parts by weight of a modified polyolefin comprising (B1) a polyolefin copolymer comprising (B11) propylene and (B12) ethylene where the molar ratio of propylene (B11) to ethylene (B12) is from 90/10 to 99/1, the polyolefin copolymer (B1) being graft-modified with (B2) from 0.05 to 5 parts by weight of an .alpha.,.beta.-unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof per 100 parts by weight of the polyolefin copolymer (B1).Type: GrantFiled: December 28, 1992Date of Patent: August 9, 1994Assignees: Yazaki Corporation, UBE Industries, Ltd.Inventors: Tetsuo Kato, Masahiro Kanda, Tatsuo Tsumiyama, Satoru Nakamoto
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Patent number: 5332782Abstract: An acrylic additive polymer containing free carboxylic acid groups is added to a core-shell impact-property modifier containing free carboxylic acid groups to produce an improved physical-property modifier for polyamide resins.Type: GrantFiled: February 26, 1993Date of Patent: July 26, 1994Assignee: Rohm and Haas CompanyInventors: Wan-Li Liu, Susan M. Liwak
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Patent number: 5331060Abstract: A single or multi-stage process for providing compatible thermoplastic blends of polyphenylene ether resins and polyamide resins is provided by combining such resins with a compatiblizing amount of an agent having in its molecule both acyl-functionality as well as at least one of the following functional groups: carboxylic acid or acid anhydride, acid amide, imido, carboxylic acid ester, amino or hydroxyl group.Type: GrantFiled: February 22, 1993Date of Patent: July 19, 1994Assignee: General Electric CompanyInventors: David F. Aycock, Sai-Pei Ting
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Patent number: 5331063Abstract: This invention is a semi-interpenetrating polymer network which includes a high performance thermosetting polyimide having a nadic end group acting as a crosslinking site and a high performance linear thermoplastic polyimide having the following repeating unit. ##STR1## wherein Z=C or SO.sub.2. Provided is an improved high temperature matrix resin which is capable of performing in the 200.degree. to 300.degree. C. range. This resin has significantly improved toughness and microcracking resistance, excellent processability, mechanical performance and moisture and solvent resistances.Type: GrantFiled: October 27, 1992Date of Patent: July 19, 1994Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventors: Ruth H. Pater, Norman J. Johnston
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Patent number: 5331061Abstract: Thermoplastically processable elastomeric block copolyetheresteretheramides from recurring units of the formula ##STR1## in which ##STR2## represents a polyamide segment containing terminal carboxyl groups and having an average molar mass of 700 to 10 000, --O--E--O-- is a poly-(oxytetramethylene)-segment having an average molar mass of 600 to 3 500, --NH--F--NH-- represents a poly-(oxy-1,2-propylene)-segment containing terminal amino groups and having an average molar mass of 350 to 2 500, x and y are integers from 3 to 35 and indicate the number of the respective, randomly arranged, recurring units, the ratio x:y of components A and B varying between 5:1 and 1:5.The ether amides of the present invention can optionally be mixed with additives, fillers, modifiers, or other compatible polymers normally used in the processing of polyamides and which are suitable for the production of molded articles, for example by injection molding, coinjection, extrusion, blow molding, etc.Type: GrantFiled: December 9, 1992Date of Patent: July 19, 1994Assignee: EMS-Inventa AGInventor: Hanns-Jorg Liedloff
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Patent number: 5331053Abstract: Polymeric fibrids reinforce elastomers to yield well-blended products of high modulus and elongation.Type: GrantFiled: December 14, 1990Date of Patent: July 19, 1994Assignee: E. I. Du Pont de Nemours and CompanyInventors: Dexter L. Atkinson, Arnold Frances, Lee J. Hesler
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Patent number: 5328767Abstract: A resin composition comprising a polyester and a modified polyolefin, wherein said polyester has an amide bond in polymer main chain and said modified polyolefin has a carboxylic acid group or a derivative thereof.Type: GrantFiled: April 15, 1992Date of Patent: July 12, 1994Assignee: Mitsubishi Kasei CorporationInventors: Yasuaki Miki, Shoji Takano, Junichi Goto, Takayuki Ota
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Patent number: 5324780Abstract: The invention thus provides a core-shell polymer comprising a core phase which is rubbery polymer and a shell phase which is a glassy polymer with an unsaturated dicarboxylic acid or its mono-alkyl ester as a constituent thereof, wherein the toluene-soluble fraction of the core-shell polymer accounts for not more than 10% by weight.It also provides polyamide resin compositions comprising said core-shell polymer and molded articles produced by molding said compositions.The resin compositions and molded articles which comprises the core-shell polymer as an impact modifier have good features, especially a high impact strength at temperature ranging from room temperature to -30.degree. C.Type: GrantFiled: March 26, 1993Date of Patent: June 28, 1994Assignee: Takeda Chemical Industries, Ltd.Inventors: Junji Oshima, Tatsuo Fujii, Minoru Yamada
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Patent number: 5322898Abstract: The invention relates to polymers containing units of the structure ##STR1## or mixtures of A with more than one of B, B-1 and B-2; wherein R and R.sup.1 are each independently C.sub.1 to C.sub.18 alkyl;R.sup.2 is oxygen, sulfur or --NR.sup.5 --;R.sup.5 is hydrogen or lower alkyl;R.sup.3 is alkylene having from 3 to 6 carbon atoms, optionally mono- or di- substituted with lower alkyl;W is hydrogen, --NH.sub.4, an alkali metal or an alkaline earth metal;Y is alkylene;Z is hydrogen, --NH.sub.4, an alkali metal or an alkaline earth metal or mixtures thereof;X is lower alkyl, a hydroxy phenyl radical or mixtures thereof;t has a value of from 2 to 8 andm, m', m" and n independently have a value of from 30 to 3,500 and n represents at least 5 mole percent of the polymeric product. The invention is also releated to the synthesis of the above polymers and to their use as superior adhesives which have significantly improved bond strength.Type: GrantFiled: August 30, 1993Date of Patent: June 21, 1994Assignee: ISP Investments Inc.Inventors: Ratan K. Chaudhuri, Jenn S. Shih
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Patent number: 5321079Abstract: A thermoplastic polyamide comprising a copolyamide and a modified copolyolefin. The copolyamide is the reaction product of a hexamethylene diamine, which may be substituted with one or more alkyl groups, and a his (4-aminocyclohexyl) alkane which is substituted adjacent to the amino groups, and a dicarboxylic acid.Molded bodies made therefrom have high rigidity, excellent impact resistance over a broad temperature range, low water uptake, high dimensional stability, low permeability to oxygen, and high shape retention on heating. They are particularly suitable for injection molding and extrusion, especially for the preparation of thin walled or large surface area shapes.Type: GrantFiled: August 5, 1992Date of Patent: June 14, 1994Assignee: Ems - Inventa AGInventors: Hans D. Torre, Manfred Hoppe
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Patent number: 5321119Abstract: A thermoplastic polyamide comprising a copolyamide which is the reaction product of a hexamethylene diamine unsubstituted or substituted with at least one alkyl group, and a bis(4-aminocyclohexyl) alkane which is substituted adjacent to the amino groups, and a dicarboxylic acid. Molded bodies made therefrom have high rigidity and tensile strength over a broad temperature range, low water uptake, high dimensional stability, low permeability to oxygen, and high distortion temperatures. They are particularly suitable for injection molding and extrusion particularly when they are modified to improved impact strength, especially for the preparation of thin walled or large surface area shapes.Type: GrantFiled: March 8, 1993Date of Patent: June 14, 1994Assignee: Ems-Inventa AGInventors: Hans D. Torre, Manfred Hoppe
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Patent number: 5317059Abstract: Blended polymer compositions are described which comprise(I) from about 1% to about 98% by weight of at least one olefin polymer;(II) from about 1% to about 98% by weight of at least one polyamide;(III) an effective amount of a compatibilizing agent which comprises at least one terpolymer of an alpha-olefin, at least one acrylic ester, and an alpha,beta-olefinically unsaturated dicarboxylic acid reagent, or a glycidyl acrylate; and(IV) from 0 to about 25% by weight of at least one auxiliary compatibilizing agent selected from the group consisting of(IVa) at least one selectively hydrogenated block copolymer of a vinyl aromatic hydrocarbon and a conjugated diene to which has been grafted, an alpha,beta-olefinically unsaturated carboxylic acid reagent;(IVb) at least one polymer which is the product of the reaction of an alpha-olefin polymer and an alpha,beta-olefinically unsaturated carboxylic acid reagent; and(IVc) a mixture of (III) and (IVa) and/or (IVb) reacted in the presence of a radical initiatorprovidedType: GrantFiled: July 9, 1990Date of Patent: May 31, 1994Assignee: Ferro CorporationInventors: Deenadayalu Chundury, Bernard G. J. Bitsch
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Patent number: 5310827Abstract: Novel polyamide copolymers having skeletons of a specific structure are disclosed. The polyamide copolymers have excellent resistance to hydrolysis, low temperature characteristics (low temperature softness), heat aging resistance and mechanical properties as compared to conventional polyamide copolymers. The polyamide copolymers also show excellent efficiencies in fabrication properties and transparency. In particular, the polyamide copolymers having a branched structure in the molecule thereof provide good results.Type: GrantFiled: November 13, 1991Date of Patent: May 10, 1994Assignee: Kuraray Co., Ltd.Inventors: Yukiatsu Komiya, Masao Ishida, Koji Hirai, Setuo Yamashita, Shinji Komori, Takuji Okaya
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Patent number: 5306784Abstract: A high temperature semi-interpenetrating polymer network (semi-IPN) was developed which had significantly improved processability, damage tolerance and mechanical performance, when compared to the commercial Thermid.RTM. materials. This simultaneous semi-IPN was prepared by mixing the monomer precursors of Thermid.RTM. AL-600 (a thermoset) and NR-150B2 (a thermoplastic) and allowing the monomers to react randomly upon heating. This reaction occurs at a rate which decreases the flow and broadens the processing window. Upon heating at a higher temperature, there is an increase in flow. Because of the improved flow properties, broadened processing window and enhanced toughness, high strength polymer matrix composites, adhesives and molded articles can now be prepared from the acetylene end-capped polyimides which were previously inherently brittle and difficult to process.Type: GrantFiled: January 31, 1992Date of Patent: April 26, 1994Assignee: The United States of America as represented by the administrator of the National Aeronautics and Space AdministrationInventor: Ruth H. Pater
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Patent number: 5304597Abstract: Thermoplastic compositions having improved mechanical characteristics and particularly an improved impact resistance, especially when measured on test pieces having high thickness, comprising:(A) an impact resistant vinyl aromatic graft copolymer containing an amount comprised between 0.1 and 2% by weight of an ethylenically unsaturated compound having a carboxylic group or one of its derivatives in the molecule; and(B) a polyamide resin.Type: GrantFiled: July 8, 1993Date of Patent: April 19, 1994Assignee: ECP Enichem Polimeri S.R.L.Inventors: Dario Ghidoni, Gian C. Fasulo, Anna G. Rossi, Luigi Bonetti, Italo Borghi
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Patent number: 5296563Abstract: In order to prepare thermoplastic molding materials ofA) 5-95% by weight of a modified polyphenylene ether,B) 5 to 95% by weight of a thermoplastic polyamide,C) 0 to 25% by weight of an impact-modifying rubber, andD) 0 to 50% by weight of auxiliaries and/or additives,the components A and B and if necessary the components C and D are fed individually at one or more points into an extruder, mixed with one another, and melted. The component A present in a pulverulent consistency is compacted and/or sintered under pressure and if necessary with the addition of heat, preferably at a pressure corresponding to a nip pressure of 1 to 100 kn/cm to form a porous compact before it is fed into the extruder. The compact is then modified and added as granules to the feed zone of the extruder. In this way the proportion of the fines in the polyphenylene ether is considerably reduced, so that there is virtually no further danger of dust explosions.Type: GrantFiled: December 21, 1992Date of Patent: March 22, 1994Assignee: BASF AktiengesellschaftInventors: Axel Gottschalk, Robert Weiss, Klaus Muehlbach, Carola Hedtmann-Rein, Robert Heinz
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Patent number: 5296558Abstract: A polymeric composition comprises:(i) an aromatic polyimide or an aromatic carboxylic ester polymer,(ii) a substantially wholly aliphatic polyamide, and(iii) a polyamide that contains both aromatic aliphatic moieties.It is found that the mechanical properties of blends of the aromatic polymers (i) and the polyamides (iii) can be significantly improved by the incorporation of a quantity of the aliphatic amides (ii), even though the miscibility of polymers, as observed by their glass transition temperatures may remain unchanged.Type: GrantFiled: August 5, 1993Date of Patent: March 22, 1994Assignee: Raychem LimitedInventors: Kathleen A. Hood, Stephen Day, Richard J. Penneck