Patents Examined by Anatoly Vortman
  • Thermal buffering module for equipment rack
    Patent number: 10952353
    Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: March 16, 2021
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: John H. Bean, Jr., James William VanGilder, Roy L. Grantham
  • Mobile display device
    Patent number: 10945331
    Abstract: Embodiments of the disclosure relate to the technical field of display, and in particular, to a mobile display device, comprising: a housing; a battery and a circuit board both provided within the housing, the battery being interposed between the circuit board and the housing, or alternatively, the battery and the circuit board being arranged side by side; a chip provided on the circuit board; a heat dissipation unit which is also provided on the circuit board and is configured to dissipate heat from the chip; and a first thermally-conductive connector which connects the heat dissipation unit with the housing.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: March 9, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongda Ma, Yong Qiao, Jianbo Xian
  • Cooling system in a hybrid electric propulsion gas turbine engine for cooling electrical components therein
    Patent number: 10934936
    Abstract: A cooling system is provided in a hybrid electric propulsion gas turbine engine for cooling electrical components therein. The cooling system includes an electrical component disposed in proximity to a power generation component in the hybrid electric propulsion gas turbine engine. The cooling system further includes a vapor chamber having an evaporator portion and a condenser portion, wherein the evaporator portion is disposed adjacent to and in thermal communication with the electrical component to transfer heat away from the electrical component. The vapor chamber includes biphasic working fluid therein that transitions between liquid and gaseous states as the working fluid flows proximal to the condenser portion and the evaporator portion respectively.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: March 2, 2021
    Assignee: Rolls-Royce North American Technologies, Inc.
    Inventors: Douglas J. Snyder, Andrew M. Bollman
  • Fixing structure of electronic component
    Patent number: 10939585
    Abstract: An electronic component unit includes a heatsink, a substrate on which electronic component is installed, a fixing metal fitting that fixes the electronic component and the substrate to the heatsink, and a fastening member that fixes the fixing metal fitting to the heatsink, and the heatsink includes a body portion, and a fixing portion that is projecting from the body portion toward the substrate side and to which the fixing metal fitting is fixed, and the substrate includes a through-hole that the fixing portion penetrates through, and the fixing metal fitting includes a base portion that contacts the fixing portion and is fixed to the fixing portion by the fastening member, and a pressing portion that extends from one end of the base portion, elastically deforms with respect to the base portion, and presses the electronic component toward the substrate side.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: March 2, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Chiaki Chida, Michito Enomoto
  • Fan tray system
    Patent number: 10939578
    Abstract: A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: March 2, 2021
    Assignee: Dell Products L.P.
    Inventors: Darren Burke Pav, Jake Hill Lavallo
  • Heat exchanger structure for a rack assembly
    Patent number: 10939586
    Abstract: Heat exchanger structure for a rack assembly formed by a shaped body of thermally conductive material. The heat exchanger structure comprises a first heat exchanging portion adapted to provide a mechanical support for one or more power electronic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electronic components. The heat exchanger structure comprises a second heat exchanging portion adapted to provide a mechanical support for one or more power electromagnetic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electromagnetic components.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: March 2, 2021
    Assignee: ABB Schweiz AG
    Inventors: Clemens Christiaan Van Der Veer, Fabio Tombelli, Filippo Chimento, Mauro Piazzesi, Daniel Gerber
  • Heat dissipating assembly and electronic device using the same
    Patent number: 10928868
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: February 23, 2021
    Assignee: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Dock with actively controlled heatsink for a multi-form factor Information Handling System (IHS)
    Patent number: 10928855
    Abstract: Embodiments of a dock with an actively controlled heatsink for a multi-form factor Information Handling System (IHS) are described. In some embodiments, a dock may include: a base, a plateau configured to receive an IHS, and an arm coupling a distal edge of the base to a proximal edge of the plateau, where the plateau comprises a heatsink configured to cool a heatpipe disposed within the IHS via a bottom surface of the IHS.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: February 23, 2021
    Assignee: Dell Products, L.P.
    Inventor: Michiel Sebastiaan Emanuel Petrus Knoppert
  • Printed circuit board assembly
    Patent number: 10925148
    Abstract: A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok-hun Kang, In-beom Kim, Bo-ram Kim, Soo-hong Kim
  • Modular power distribution panel
    Patent number: 10916934
    Abstract: A power distribution panel for distributing power to a plurality of components. A modular frame may removably attach in an aperture of a side of a chassis. A first module may be removably attached in an opening of the modular frame. A second module, different from the first module, may be removably attached in the opening of the modular frame.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: February 9, 2021
    Assignee: Telect, Inc.
    Inventors: Steven Kyle Witkoe, Timothy Andrew Meyer, Timothy McBrien Turpin
  • Circuit device and power conversion device
    Patent number: 10916367
    Abstract: A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 9, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazuaki Fukui, Koji Nakajima, Shota Sato, Kenta Fujii
  • Electronic circuit board and power conversion device
    Patent number: 10912232
    Abstract: In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: February 2, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Yuji Shirakata, Kenta Fujii, Shota Sato
  • Radar sensor housing design
    Patent number: 10910706
    Abstract: Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: February 2, 2021
    Inventors: Chih-Ming Hung, Yu Chun Lu, Yen-Ju Lu, ChiaYu Lin
  • Liquid-cooled electric drive component, powertrain, vehicle and method
    Patent number: 10905033
    Abstract: A liquid-cooled electric drive component for a powertrain of a vehicle includes a first housing part and a second housing part. The first and second housing parts are joined to one another by a fluid-tight welded joint and configured such as to form at least a segment of a cooling duct. The vehicle can be a hybrid vehicle or an electric vehicle.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: January 26, 2021
    Assignee: SIEMENS AKTIENGELLSCHAFT
    Inventor: Matthias Schmitt
  • Vehicular circuit body
    Patent number: 10882476
    Abstract: A vehicular circuit body includes a plurality of backbone control boxes, a backbone trunk line portion connecting the backbone trunk line portions to each other, and a branch line sub-harness. A trunk includes has a power source line and a communication line, and a control includes a trunk line connection portion and a branch line connection portion.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: January 5, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Yukinari Naganishi, Yasuyuki Saito, Taku Furuta, Noriaki Sasaki
  • Fuse holder and associated method
    Patent number: 10886089
    Abstract: A holder for receiving fuses is provided. The holder includes a housing and a fuse shuttle. The fuse shuttle is slidably cooperable with the housing in a first portion of the housing and pivotally cooperable with the housing in a second portion of the housing. The fuse shuttle and the housing define a fuse loading position and a fuse operational position.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: January 5, 2021
    Assignee: Regal Beloit America, Inc.
    Inventor: Timothy Joseph Brakefield
  • Thermal management assemblies for electronic assemblies circumferentially mounted on a motor
    Patent number: 10888036
    Abstract: An electronic assembly includes a PCB coupled to a mounting surface of a cooling jacket circumferentially mounted on a motor and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on a first surface of the PCB proximate to the motor. The TMA includes the cooling jacket, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: January 5, 2021
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Shailesh N. Joshi, Shohei Suenaga
  • Vehicular circuit body
    Patent number: 10875479
    Abstract: A vehicular circuit body provided in a vehicle includes a trunk line that extends in at least a front-and-rear direction of the vehicle and a plurality of control boxes that are provided in the trunk line. The trunk line includes a power source line having a predetermined current capacity and a communication line having a predetermined communication capacity. The communication line is routed so that at least a part of the plurality of control boxes are connected in a ring form.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: December 29, 2020
    Assignee: YAZAKI CORPORATION
    Inventors: Masahiro Takamatsu, Koichi Uezono, Kousuke Kinoshita, Atsushi Nakata, Yasuyuki Saito, Kazuyuki Oiwa, Terumitsu Sugimoto, Taku Furuta, Noriaki Sasaki, Yukinari Naganishi, Sadaharu Okuda, Kunihiko Yamada
  • Thermal interface assembly
    Patent number: 10881022
    Abstract: A thermal interface assembly for transferring heat from a heat generating component to a heat dissipating component. The thermal interface assembly includes a plurality of discrete thermal sheets attached to a resilient pad.
    Type: Grant
    Filed: July 11, 2018
    Date of Patent: December 29, 2020
    Assignee: TRW AUTOMOTIVE U.S. LLC
    Inventor: Darryl J. Edwards
  • Cooling device
    Patent number: 10881033
    Abstract: A cooling device includes a fan for blowing air to a control board arranged on the downstream side by rotation of a rotator. The cooling device further includes a bypass structure provided so as to avoid the rotator and configured to oil liquid to flow, at least, from the upstream side of the fan to the downstream side of the fan, and a gutter provided on the upstream side of the fan to lead the oil liquid to the bypass structure.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: December 29, 2020
    Assignee: FANUC CORPORATION
    Inventors: Takeshi Sawada, Fuyuki Ueno