Abstract: An overvoltage protection device has a plurality of overvoltage arresters and a disconnecting apparatus. For each of the overvoltage arresters a blocking element is present, each of which is arranged so as to block the path of movement of a mechanically preloaded wedge slide having a wedge bevel. A rocker lever arrangement has first lever arms corresponding to the number of wedge slides and at least one second lever arm for blocking or releasing a displacement element, wherein ends of the first lever arms each have a surface for contacting the respective wedge bevel of the wedge slides in such a way that, when the respective path of movement is released, at least one of the wedge slides lifts the corresponding first lever arm with its wedge bevel, as a result of which the second lever arm releases the displacement element.

Abstract: This disclosure provides a switch assembly structure and a display device. The switch assembly structure comprises: a switch assembly (100); an assembly housing (400) provided with a first groove (410); a first clamping member (500) provided with a second groove (510), wherein the first clamping member (500) has a first state of being securely connected with the assembly housing (400) and a second state of being separate from the assembly housing (400); wherein, in the second state, the switch assembly (100) is able to mate with the first groove (410) or the second groove (510); and in the first state, the first groove (410) and the second groove (510) combine to form a switch mounting hole (10), and the switch assembly (100) is secured in the switch mounting hole (10) by a securable connection of the first clamping member (500) with the assembly housing (400).

Abstract: Disclosed is a storage-type modular data center. The storage-type modular data center includes a box, a dust removing module, an evaporative cooling module, and an air supply module. The box is provided with an air inlet and an air outlet. A server is disposed between the air inlet and the air outlet. The dust removing module is disposed between the server and the air inlet. The evaporative cooling module is disposed between the server and the air inlet, and includes an evaporative media and a water sprinkling tray module. One end of the evaporative media is immersed in liquid contained in the water sprinkling tray module. The air supply module is operative to drive air to flow between the air inlet and the air outlet.

Abstract: A modular power distribution system for use on a vehicle having an electric power source. The system includes a power distribution block having a switch socket with a first format, a device socket having a second format, associated with the switch socket to form a socket pair, a relay electrically coupling the switch socket to the device socket, and input power terminals electrically coupled to the socket pair and the relay, and configured to be electrically coupled to the electric power source. A switch wire harness includes a switch plug having a first complemental format configured to be removably received by the first format of the switch socket. A device wire harness includes a device plug having a second complemental format configured to be removably received by the second format of the device socket.

Abstract: In one embodiment, an electronics enclosure for housing a data processing system includes a number of enclosure panels forming a fully enclosed container to contain electronics, including a first enclosure panel having a liquid cooling component therein and a second enclosure panel having an air cooling component therein. The enclosure is thermally managed by implementing these panels. The first enclosure panel includes an inlet port to receive cooling liquid from an external cooling liquid source, a cooling plate disposed on an inner surface of the first enclosure panel to receive a motherboard of the data processing system and to extract heat from the motherboard using the cooling liquid and an outlet port to return the cooling liquid back to the external liquid source. The second enclosure panel includes a liquid to air heat exchanger to cool air flowing through an air space within the fully enclosed container using at least a portion of the cooling liquid.

Abstract: A switchgear assembly includes a plurality of gas insulated switches arranged in at least one row and a plurality of enclosures arranged in at least one row forming at least one channel extending parallel to the at least one row of switches. The switchgear assembly further includes at least one bus assembly disposed in the at least one channel and including a plurality of interconnected bus sections having an insulating covering and electrically connected to the gas insulated switches.

Abstract: Disclosed are layouts, arrangements, and configurations of room airflow, server racks and cooling delivery subsystems that support data centers having system architectures with segregated compute and storage point of deliveries (PoDs). A cooling row is arranged in the rear side of racks housing a PoD to supply the PoD with the cooling delivery subsystem, which includes a recirculating loop supplying cooling fluid to the PoD and returning warm fluid to the cooling source. Modular cooling units of the cooling row includes cooling coils used to cool the airflow leaving the racks. The cooling capacity of the cooling liquid supplied to the cooling delivery subsystem for a PoD may be independently adjusted and controlled in a feedback loop based on the temperature of the air of the PoD after it has been cooled by the cooling coils, such as the outlet air temperature from the cooling row housing the PoD.

Abstract: An electrical cabinet includes a frame hinge fixed to a frame of the cabinet and a door hinge fixed to a door of the cabinet. The frame hinge forms an insertion window for receiving the door hinge. A hinge pin is inserted through aligned seats of the frame hinge. The door hinge is inserted into the insertion window around the hinge pin. A blocking screw or pin is inserted through a third seat in a direction substantially perpendicular to the hinge pin to block the hinge pin and secure the door to the frame.

Abstract: A fluid-cooled re-entrant cold plate for thermal management of heat dissipating electronic devices or assemblies. The fluid leaves the cold plate's outer perimeter, fills a sealed cavity between the cold plate outer perimeter and the mating component/assembly, provides direct cooling of the electronic component, then re-enters the cold plate.

Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.

Abstract: The invention involves a busbar distributor for electrical energy, and uses at least one consumer terminal (CT) for at least one consumer for supplying the consumer with electrical energy, as well as at least one connecting element for connecting a building energy supply (BES) to at least one high-voltage busbar, which connecting element connects the consumer to the BES. The distributor further has at least one line element which is provided between the connecting element and the CT, and a connector which is arranged between the CT and the connecting element. The connecting element has at least two conductors for supplying power to the CT. Also, the connector is connected, on an energy supply side, to the line element, which is formed having two conductors for energy supply which can be connected to the BES. The line element is exchangeable depending on the actual voltage and/or the power system of the building energy supply.

Abstract: The subject-matter of the invention is an electrical device comprising: a casing comprising a cavity receiving an electrical component, and at least two conductors connected to the electrical component so as to supply it with electric energy, both conductors being superimposed with each other and extending in parallel, said device being characterised in that it comprises an electric insulating film folded on itself around a fold, and a first part of which located on a side of the fold comes against a surface of the first conductor so as to electrically insulate it, and a second part of which located on the other side of the fold is inserted between both conductors so as to electrically insulate them from each other.

Abstract: A temperature-dependent switch comprises first and second stationary contacts and a temperature-dependent switching mechanism having a movable contact member and a temperature-dependent snap-action part, which transitions between geometric low- and high-temperature configurations based on a temperature of the switch. Switching the snap-action part from its geometric low- to high-temperature configuration moves the switching mechanism from a first to a second switching position and thereby opens the switch. A closing lock prevents the switch once having opened from closing again by keeping it in its second switching position. The closing lock comprises a fusible medium which melts when a melting temperature of the medium is exceeded, contacts, in a molten state, a part of the switching mechanism when it is in its second switching position, and solidifies again and thereby locks it in its second switching position when the temperature of the switch falls below the melting temperature of the medium again.

Abstract: A resetting element for transmitting resetting force to a thermal switch. The resetting element includes a first end and an elastic element configured to transmit a force received at the first end to the reset switch of the thermal switch, wherein the elastic element is prevents damage to the thermal switch by decreasing the force transmitted to the reset switch from the first end.

Abstract: Heat dissipation system, a power converter using such a heat dissipation system, and an associated method of thermal management of the power converter are disclosed. The heat dissipation system includes a condenser, a first cooling loop, and a second cooling loop. The first cooling loop is coupled to the condenser and includes a first two-phase heat transfer device. The second cooling loop is coupled to the condenser and includes a second two-phase heat transfer device. The condenser is disposed above the first and second two-phase heat transfer devices.

Abstract: A breaker has a fixed contact, a movable piece which has an elastic portion formed in a plate shape and being elastically deformable, and a movable contact in one end portion of the elastic portion so as to press the movable contact against the fixed contact, a thermally-actuated element which is deformed in accordance with a temperature change and shifts from a conduction state in which the movable contact contacts with the fixed contact to a shut-off state in which the movable contact separates from the fixed contact, and a case which accommodates the fixed contact, the movable piece, and the thermally-actuated element. The case has a side wall extending in a long direction of the movable piece, and the side wall is provided, in an adjacent portion to the thermally-actuated element, with a convex portion protruding toward the outside of the case.

Abstract: Electrical fuse element 12 comprising a switchable load path 22 and a switchable fuse path 36, wherein the load path 22 and the fuse path 36 are short-circuited with their respective inputs 14. The load path 22 and the fuse path 36 are in mechanical connection with each other in such a way that an electrical opening of the load path 22 causes an electrical closing of the fuse path 36 and that a melting fuse 38 arranged in the fuse path 36 is triggered at the moment of closing of the fuse path 36.

Abstract: An information handling system may include a processor, a memory, and a power source; a base chassis including an outer cover surface; a variable height fan including: a main shaft including a cavity formed centrally within the main shaft; a first set of fan blades operatively coupled to the main shaft; a slide shaft placed within the cavity of the main shaft where the slide shaft is operatively coupled to the main shaft to rotate with the main shaft; a second set of fan blades operatively coupled to the slide shaft; a biasing member to bias the slide shaft to extend out of the main shaft; and a contact point prominence as a rotational point interface with the slide shaft operatively coupled to the outer cover surface.

Abstract: Disclosed herein are efficient mechanical fuse devices that are capable of functioning at high current levels. These devices comprise mechanical features configured such that the fuse devices have a non-triggered state, which allows current to flow through the device, and a triggered state, which does not allow current to flow through the device. In some embodiments, the devices are configured such that a certain pre-determined current level flowing through the device will generate a sufficient electromagnetic field to cause the mechanical elements to transition the fuse device into the triggered state and thus interrupt a connected electrical circuit, device or system. In some embodiments, these devices can also comprise hermetically sealed components. In some embodiments, the fuse devices can comprise pyrotechnic features.

Abstract: A heat dissipation structure applied to an electronic device includes a circuit board assembly, a pipe, a refrigerant fluid, and a water pump. The circuit board assembly is provided with a receiving chamber therein, an inlet, and an outlet. Each of the inlet and the outlet communicates with the receiving chamber. The pipe and the receiving chamber together form a liquid channel. The refrigerant fluid is received in the liquid channel. The water pump communicates with the pipe and is configured to circulate the refrigerant fluid in the liquid channel to remove heat from the circuit board assembly.