Abstract: A method of producing a polymer insulator and an end processing apparatus utilized for the method. The insulator has a core, an overcoat member arranged on the core, and a fitting member for securing the core at its both ends, wherein the core and the fitting member are secured under pressure at both ends of the core by contacting a ring-shaped protrusion portion arranged at both ends of the overcoat member to an open inner end of the fitting member. The method includes the steps of: forming the overcoat member on the core; forming the ring-shaped protrusion portion integrally with the overcoat member by processing an end portion of the overcoat member, and securing the fitting member.

Abstract: A method is for forming a plastic protective package for an electronic device integrated on a semiconductor and comprising an electronic circuit to be encapsulated in the protective package. The electronic device may be at least partially activated from outside of the protective package. The method may include providing a mold having a half-mold with an insert abutting towards the inside of the mold and an end having an element that can be elastically deformed to abut in pressing contact against at least one portion of the integrated circuit. The method may also include injecting a resin into the mold so that the protective package has a hole by the at least one portion of the electronic circuit.

Abstract: A process for manufacturing a wafer carrier including injection molding a wafer support structure. The wafer support structure has a plurality of wafer support shelves extending therefrom. The process further includes molding a wafer contact portion on each of the wafer support shelves. The wafer contact portions bond with the wafer support shelves without mechanical fasteners between the wafer contact portions and the wafer support shelves. The process also includes overmolding a shell over the wafer support structure to form the wafer carrier. The shell bonds with the wafer support structure without mechanical fasteners between the shell and the wafer support structure. The wafer contact portions define a plurality of slots for holding a plurality of wafers.

Abstract: A high voltage transformer for a microwave oven includes a core, and primary and secondary coils. An insulation molding part encloses at least a part of the secondary coil and has a sensor accommodation portion formed therein. A temperature sensor is accommodated in the sensor accommodating portion for detecting temperature of the secondary coil. The sensor accommodating portion can be formed inside of the insulation molding part together with the temperature sensor, or formed outside of the insulation molding part in a pocket shape. With either configuration, the temperature sensor can be positioned at the correct sensor position, thereby improving the detecting accuracy of the temperature sensor. In addition, it is easy to repair and/or replace the temperature sensor.

Abstract: A system is proposed for encapsulating in plastics material leadframe items comprising an IC wired to a leadframe. Dust of the plastics material is removed from the encapsulation system, and in particular from those items where dust principally accumulates, such as the surfaces of the molds. To reduce the level of dust which enters the molding region, the path along which the leadframe items are conveyed to the molding region is closed at times when the leadframe items are not being transported there. Additionally, the leadframe items are conveyed to the molding region under a cover including a vacuum source, so that the dust is continually sucked away from them.

Abstract: A contoured wall and method is disclosed for creating the contour and appearance of a wall formed from individual assembled units such as stones. The wall is formed from a plurality of mating form liners each having a reciprocal contoured surface to that of the desired stone wall. The wall is formed from hardenable construction material such as concrete poured between two mold members with the form liners attached to at least one of the mold members. Each of the form liners has a lateral relief mold face adapted to provide a molded surface having the contour of a stone wall. Each lateral relief mold face of the form liners has a latticework non-linear mortar-forming interlocking portion surrounding stone-forming recessed portions. The form liners are positionable in a plurality of arrangements wherein the interlocking portions and recessed portions along the mating edge of each form liner mate along mating edge of the adjacent form liner to form a continuous lateral relief mold face.

Abstract: Methods for improved electronic substrate via and thru-hole filling, particularly through the use of drilled stand-offs formed by control-depth drilling oversized non-thru-holes and the use of inserted support pillars to prevent sagging of the substrate during filling. In particular, through the use of: (1) a via fill stand off adapted for use with a substrate comprising at least two via holes to be filled, each of the via holes having a diameter of X mils, the standoff comprising at least one recess formed by control-depth drilling of holes having a diameter at least 12X mils; and (2) a via fill standoff adapted for use with a substrate comprising at least one via hole to be filled, the standoff comprising: at least one recess; and at least one support pillar positioned within the recess wherein the support pillar is not an integral part of the standoff.

Abstract: Shape memory alloy and elastically self-expanding endoluminal stents which are at least partially encapsulated in a substantially monolithic expanded polytetrafluorethylene (“ePTFE”) covering. An endoluminal stent, which has a reduced diametric dimension for endoluminal delivery and a larger in vivo final diametric diameter is encapsulated in an ePTFE covering which circumferentially covers both the luminal and abluminal walls along at least a portion of the longitudinal extent of the endoluminal stent. The endoluminal stent is fabricated from a shape memory alloy which exhibits either shape memory or pseudoelastic properties or from an elastic material having an inherent spring tension.

Abstract: A filling system includes a pressurized source of fill material and a pressure fill head wherein the fill head also includes a heating element positioned so as to transfer heat to fill material passing through the fill head. A method of filling holes using a fill material passing through a pressure fill head includes the steps of causing fill material to enter the fill head, modifying the viscosity of the fill material while it is within the fill head, and causing the modified viscosity fill material to exit the fill head and enter at least one hole.

Abstract: A method for treating workpieces (307, 801, 802, 803) to be injection moulded in a production process comprises a step for forming a workpiece (307, 801, 802, 803) by injection moulding so that during the injection moulding, the workpiece is fastened to a given elongated transport arrangement (301, 302, 304, 305, 306). The workpiece (307, 801, 802, 803) is moved forwards in the production process by means of the elongated transport arrangement (301, 302). Subsequently the fastening (311) of the workpiece (307, 801, 802, 803) is partly detached from the elongated transport arrangement (305, 306) and the workpiece (307, 801, 802, 803) is fastened, supported by the fastening remaining between itself and the transport arrangement, into a position where it is substantially outside a plane (800) defined by the transport arrangement.

Abstract: The present invention is a process for producing an injection-molded thermoplastic workpiece having a thermoset coating bonded thereto, comprising the steps of introducing in three stages into a closed mold a thermoplastic material, such as a polyolefin, heated to a temperature above its melting point and molding said material to form a workpiece; cooling the workpiece to a temperature less than its melt temperature introducing a thermoset coating composition into the closed mold to cover at least a portion of a surface of the workpiece. The mold is then opened and the workpiece is removed after the coating composition has at least partially cured. The invention is also directed to a molded article made by the described process.

Abstract: A system comprising a scavenging blade, a printed wiring board receiving portion, and a movement mechanism adapted to move the scavenging blade and printed wiring board receiving portion relative to each other, and to a method of removing excess fill material comprising providing a printed wiring board having filled holes and at least some excess fill material on a surface of the printed wiring board, providing a system comprising a scavenging blade, positioning the printed wiring board in the system, and causing the scavenging blade to traverse at least a portion of the printed wiring board in a manner that causes the scavenging blade to remove at least a portion of the excess fill material from the printed wiring board.

Abstract: The invention relates to a method for linking a first plastic component (6) with a second plastic component (9). According to the inventive method, the first component (6) is introduced into an injection mold with at least one connecting section (12) at which the link with the second component (9) is to be established. The second component (9) is formed by injection-molding plastic material onto the connecting section. A surface of the connecting section (12) is at least partially covered by the plastic material of the second component (9). At least one of the components may consist of a plastic material that requires only a relatively narrow temperature range to be moldable in the molten state. At least one binder body is formed at the surface intended to be covered by the injection-molded plastic material which binder is firmly linked with the surface. Said binder melts when contacted with the heat energy of the injection-molded plastic material and fuses with the injection-molded plastic.

Abstract: An illuminated cover and a method of making such a cover. An electroluminescent foil overlies a thin, rigid support base, and an insulating foil overlies the electroluminescent foil. A first opening allows insertion of an electrical connector for the electroluminescent foil. A second opening allows insertion of a control key of a device covered by the decorative cover. The covered electronic device further includes a printed circuit board having electronic components mounted on it, including the control key. A connector extends into the first opening to connect the electroluminescent foil to circuitry on the printed circuit board so as to provide electrical power to the electroluminescent foil. A graphic can be included between the electroluminescent foil and the insulating foil. The cover is made by a molding method.

Abstract: A method of molding a layer of a thermoset or thermoplastic material around a golf ball component within a mold, in which the component is positioned within a mold cavity defined by opposing mold portions of the mold, to leave a cavity space between the component and the mold portions. A reaction mixture comprising at least two reactants is injected under a hydraulic pressure into the cavity space. The pressurized reaction mixture pushes the mold portions apart from each other to a partially open position with an opening therebetween. The reaction mixture is allowed to react partially within the cavity space, and then the mold portions are compressed toward each other to the closed position. The reaction mixture further reacts to form the layer of the thermoset or thermoplastic material immediately about the component.

Abstract: A resin tape substrate with a semiconductor chip mounted thereon is put to an attachment area surface of a cavity bottom surface, and a plurality of suction holes connected to a suction system are disposed in the attachment area surface, wherein the attachment area surface of the cavity is formed in a semiconductor resin mold, so that the molten resin given into the cavity does not flow into the back surface of the resin tape substrate which is sucked on the attachment area surface in the mold.

Abstract: Sleeve molding apparatus and methods for making multi-layer injection molded plastic articles in successive mold cavities. In a first molding step, an inner sleeve is molded on a core in a first mold cavity, which may comprise a full body length sleeve or only a partial sleeve, such as an upper neck finish portion. The sleeve and core are withdrawn from the first mold cavity while the sleeve is still warm, and transferred without substantial delay to a second mold cavity for injection molding an outer layer which bonds to the inner sleeve. By transferring the sleeve at an elevated temperature into the second mold cavity, an improved bond is formed between the inner sleeve and outer layer which resists separation during a later reheat stretch blow molding step, and/or in use of the resulting article. In a preferred embodiment, a pasteurizable beer container is provided having a finish-only sleeve of a PEN polymer.

Abstract: A process for producing a composite molded article is described. The composite molded article includes: (i) at least one base body (1) having a contoured surface; (ii) at least one first thermoplastic part (4, 5, 6); and (iii) at least one second thermoplastic part (2, 3), each of the first and second thermoplastic parts being joined to the base body. The process includes, (a) providing a multicomponent injection molding tool (20) having at least two separate melt flow-way systems and at least two cavities in which each of the first and second thermoplastic parts are separately formed, each of the cavities are in separate communication with each of the separate melt flow-way systems. The base body is placed into the molding tool in a second step (b). The cavities of the mold are separated from each other by a combination of the contoured surface of the base body and sealing edges of the molding tool that abut the contoured surface of the base body.

Abstract: A slush-moulding method combined with cross-linking, including the filling of a tank with a suitable quantity of ground polymer blend and the coupling of said tank with a heated mold is provided. The closed system thus obtained is moved in order to transfer the powder onto the mold, so as to carry out on the latter a layer of completely or partially melted powder. Before and after a stage of stripping of the leather off the mold, said leather is cross-linked by means of radiations.

Abstract: Pore-free rubber articles are prepared by dip-molding in a dipping medium that includes a vulcanizing agent, then by immersing the dip former in a heated liquid bath that is chemically inert. A particularly effective liquid bath is molten inorganic salt. In addition, the tensile properties of an article of vulcanized rubber can be improved to an unusually effective degree by immersing the already vulcanized article in a solution of a vulcanizing agent to cause the rubber of the article to absorb or imbibe the vulcanizing agent from the solution, and then immersing the rubber and the imbibed vulcanizing agent in a heated liquid bath to increase the degree of vulcanization.