Abstract: A nonvolatile semiconductor memory device comprises: a plurality of first lines; a plurality of second lines; a plurality of memory cells each disposed at each of crossing-points of the first lines and the second lines and each comprising a variable resistor and a bi-directional diode; and a voltage control circuit configured to control a voltage of selected one of the first lines, unselected ones of the first lines, selected one of the second lines, and unselected ones of the second lines, respectively. The variable resistor is configured to change its resistance value depending on a polarity of a voltage applied thereto. The voltage control circuit is configured to apply a voltage pulse to the selected one of the first lines and to connect a capacitor of a certain capacitance to one end of the selected one of the second lines.

Abstract: A method for operating a memory includes applying at least one pulse to a group of analog memory cells, so as to cause the memory cells in the group to assume respective storage values. After applying the pulse, the respective storage values are read from the memory cells in the group. One or more statistical properties of the read storage values are computed. A wear level of the group of the memory cells is estimated responsively to the statistical properties.

Abstract: Partial speed and full speed programming are achieved for a non-volatile memory system. During a program operation, in a first time period, bit lines of storage elements to be inhibited are pre-charged, while bit line of storage elements to be programmed at a partial speed and bit lines of storage elements to be programmed at a full speed are fixed. In a second time period, the bit lines of storage elements to be programmed at the partial speed are driven higher, while the bit lines of storage elements to be inhibited are floated and the bit line of storage elements to be programmed remain fixed. In a third time period, the bit lines of storage elements to be inhibited are driven higher while the bit lines of the storage elements to be programmed at the partial speed or the full speed are floated so that they couple higher.

Abstract: A solid state storage system includes a memory area having a plurality of pages and is capable of storing program information about each page. The memory area stores the number of pulse counts applied to each page. A main memory controller receives the program information from the memory area and determines whether to program pages according to the program information. The main memory controller determines whether the program information for a page is at a predetermined amount and if the corresponding page should be programmed again or not.

Abstract: An over erase correction method of a flash memory apparatus is provided. The flash memory apparatus includes at least a microprocessor, a memory array, a bit line exchange unit and a column decoder. By controlling the column decoder of the flash memory during a period of the over-erase correction, the column decoder outputs control signals to the bit line exchange unit for selecting at least one of the bit lines according to a magnitude of the bit line leakage current. The drop in the charge pump voltage due to the bit line leakage current is reduced, and thus, the over-erase correction is executed effectively during the period of the over-erase correction.

Abstract: A circuit includes, in part, a multitude of magnetic random access memory cells, one or more column decoders, one or more row decoders, and a write driver circuit. The write driver circuit is responsive to data signal as well as to read/write signals. During writing of a first data to a selected magnetic random access memory cell, the write driver circuit causes the first signal line to be at a second voltage and the second signal line to be at the first voltage. The second voltage is greater than the first voltage. During writing of a second data to the selected magnetic random access memory cell, the write driver circuit cause the first signal line to be at a third voltage and the second signal line to be at the second voltage. The third voltage is smaller than the first voltage.

Abstract: A resistive memory structure, for example, phase change memory structure, includes one access device and two or more resistive memory cells. Each memory cell is coupled to a rectifying device to prevent parallel leak current from flowing through non-selected memory cells. In an array of resistive memory bit structures, resistive memory cells from different memory bit structures are stacked and share rectifying devices.

Abstract: Memory devices and methods for operating such devices are described herein. A method as described herein includes applying a reset bias arrangement to a memory cell to change the resistance state from the lower resistance state to the higher resistance state. The reset bias arrangement comprises a first voltage pulse. The method further includes applying a set bias arrangement to the memory cell to change the resistance state from the higher resistance state to the lower resistance state. The set bias arrangement comprises a second voltage pulse, the second voltage pulse having a voltage polarity different from that of the first voltage pulse.

Abstract: A method of maintaining the data state of a semiconductor dynamic random access memory cell is provided, wherein the memory cell comprises a substrate being made of a material having a first conductivity type selected from p-type conductivity type and n-type conductivity type; a first region having a second conductivity type selected from the p-type and n-type conductivity types, the second conductivity type being different from the first conductivity type; a second region having the second conductivity type, the second region being spaced apart from the first region; a buried layer in the substrate below the first and second regions, spaced apart from the first and second regions and having the second conductivity type; a body region formed between the first and second regions and the buried layer, the body region having the first conductivity type; and a gate positioned between the first and second regions and adjacent the body region.

Abstract: A semiconductor memory device includes a first write bit line, a second write bit line, a write word line, a first read bit line, a read word line, and a memory cell array including a plurality of memory cells, and arranged the plurality of memory cells in a matrix fashion, wherein the memory cells including a first inverter including a first PMOS transistor and a first NMOS transistor, a second inverter including a second PMOS transistor, and a second NMOS transistor, and including an input terminal and an output terminal connected to an output terminal and an input terminal of the first inverter, respectively, a first write transfer transistor connected between a first write bit line and the output terminal of the first inverter, and including a gate connected to a write word line, a second write transfer transistor connected between a second write bit line and the output terminal of the second inverter, and including a gate connected to the write word line, a first read driver transistor including a gate c

Abstract: A nonvolatile memory has logic which performs a programming operation, that controls a series of programming bias arrangements to program at least a selected memory cell of the memory array with data. The series of programming bias arrangements include multiple sets of changing gate voltage values to the memory cells.

Abstract: An integrated circuit containing an SRAM that provides a switch to decouple the SRAM wordline voltage from the SRAM array voltage during screening and that also provides different wordline and array voltages during a portion of the SRAM bit screening test. A method for screening SRAM bits in an SRAM array in which the wordline voltage is different than the array voltage during a portion of the screening test.

Abstract: A common standard may be used for both dynamic random access memories and non-volatile memories, despite the fact that the non-volatile memory generally needs bidirectional communications to coordinate writing with a memory controller. In one embodiment, a package connector on the non-volatile memory may be used for one function that does not involve communications with the memory controller during reading and may be used for communications with the memory controller during writing. Particularly, those communications during writing may be to indicate to the memory controller when the memory is ready for writing and when the memory is busy so that a write must be deferred until the memory is ready to be written to.

Abstract: Electronic apparatus and fabrication of the electronic apparatus that includes detection of the majority of values in a plurality of data bits may be used in a variety of applications. Embodiments include application of majority bit detection to process data bits in a device for further analysis in the device based on the results of the majority bit detection. In an embodiment, such further processing in a memory device after majority bit detection may include data bit inversion prior to outputting the data from the memory device.

Abstract: For replacing SRAM with very high speed FRAM, new memory architecture is realized such that plurality of FRAM cells is connected to a local bit line pair, a local sense amp is connected to the local bit line pair, a global sense amp is connected to the local sense amp through a global bit line pair, and a locking signal generator is connected to the global sense amp for generating a locking signal which disables the local sense amp after reading for quick write-back operation. With short bit line architecture, bit lines are multi-divided for reducing parasitic capacitance of the local bit line, which realizes to reduce the ferroelectric capacitor proportionally. The FRAM cell includes an access transistor pair, a ferroelectric capacitor pair for storing positive data and negative data, and a reset transistor pair for resetting storage nodes. And various circuits for implementing the memory are described.

Abstract: Memory devices, and methods of writing data to memory devices, utilizing analog voltage levels indicative of threshold voltages and desired threshold voltages of memory cells.

Abstract: A method of generating a voltage as well as an integrated circuit device (e.g., a logic device or a memory device) having a memory cell array which includes (i) a plurality of memory cells, wherein each memory cell array including (i) a plurality of memory cells, arranged in a matrix of rows and columns, and (ii) a plurality of bit lines, wherein each bit line includes a plurality of memory cells. The integrated circuit further includes voltage generation circuitry, coupled to a plurality of the bit lines, to (i) apply a first voltage to a first group of associated bit lines, and (ii) apply a second voltage to a second group of associated bit lines, and (iii) generate a third voltage by connecting the first group of associated bit lines and the second group of associated bit lines, and (iv) output the third voltage. Also, disclosed is a method of operation and/or control of such an integrated circuit device as well as such voltage generation circuitry.

Abstract: A non-volatile magnetic memory element includes a number of layers one of which is a free layer which is graded. The graded free layer may include various elements with each element having a different anisotropy or it may include nonmagnetic compounds and magnetic regions with the non-magnetic compounds forming graded contents forming a unique shape such as cone shaped, diamond shaped or other shapes and whose thickness is based on the reactivity of the magnetic compound.

Abstract: A semiconductor device in accordance with one embodiment of the invention can include a first data storage region including a non-volatile main data storage region. Additionally, the semiconductor device can include a second data storage region including a non-volatile reference region wherein an erasing operation and a writing operation are performed on both the first data storage region and the second data storage region. Moreover, the semiconductor device can also include a control unit coupled to the first and second data storage regions which determines a stress condition corresponding to the first data storage region based on a stress information related to the second data storage region.

Abstract: Embodiments of the invention relate to a state-monitoring memory element. The state-monitoring memory element may have a reduced ability to retain a logic state than other regular memory elements on an IC. Thus, if the state-monitoring memory elements fails or loses state during testing, it may be a good indicator that the IC's state retention may be in jeopardy, possibly requiring the IC to be reset. The state-monitoring memory element may be implemented by degrading an input voltage supply to the state-monitoring memory element across a diode and/or a transistor. One or more current sources may be used to stress the state-monitoring memory element. A logic analyzer may be used to analyze the integrity of the state-monitoring memory element and trigger appropriate actions in the IC, e.g., reset, halt, remove power, interrupt, responsive to detecting a failure in the state-monitoring memory element.