Abstract: Provided is a duty cycle corrector including a low frequency detector detecting whether an input clock signal frequency is less than or greater than a predetermined frequency. If less than, a common mode control circuit controlling a common mode of a duty cycle correction amplifier amplifying the input clock signal is disabled. The duty cycle corrector may include a column address strobe (CAS) latency determination unit that determines whether a CAS latency is greater than or less than a predetermined value instead of the low frequency detector.

Abstract: A programming method of a flash memory device having memory cells, and a flash memory device to perform the method, including programming selected memory cells according to loaded data, sensing states of the programmed memory cells and firstly latching the sensed states, and determining whether a program-inhibited memory cell among the selected memory cells has been programmed, with reference to the loaded data and the latched states, before determining whether the selected memory cells have been properly programmed.

Abstract: Circuit and method for recovering clock data in highly integrated semiconductor memory apparatus includes a plurality of signal receiving units configured to receive signals through a plurality of input/output pads and transfer the signals according to a receiving reference clock, the signal receiving units being divided into groups, a plurality of phase detection units configured to detect phases of signals output from the groups of the signal receiving units, a plurality of phase detection control units configured to control the phase detection units so that the phase detection units sequentially detect the phases of the signals output from each of the groups of the signal receiving units and a notification unit configured to output signals output from the phase detection units.

Abstract: Nonvolatile memory devices may be fabricated to include a switching device on a substrate and/or a storage node electrically connected to the switching device. A storage node may include a lower metal layer electrically connected to the switching device, a first insulating layer, a middle metal layer, a second insulating layer, an upper metal layer, a carbon nanotube layer, and/or a passivation layer stacked on the lower metal layer.

Abstract: Nano-scale and multi-scale computational architectures using spin waves as a physical mechanism for device interconnection are provided. Solid-state spin-wave computing devices using nano-scale and multi-scale computational architectures comprised of a plurality of inputs and a plurality of outputs are described where such devices are configured to simultaneously transmit data elements from the inputs to the outputs by using spin-waves of differing frequencies. These devices include but are not limited to a spin-wave crossbar, a spin-wave reconfigurable mesh, a spin-wave fully-interconnected cluster, a hierarchical multi-scale spin-wave crossbar, a hierarchical multi-scale spin-wave reconfigurable mesh and a hierarchical multi-scale spin-wave fully-interconnected cluster.

Abstract: A resistance change memory includes two memory cell arrays each including a plurality of memory cells, the memory cells including variable resistive elements, two reference cell arrays provided to correspond to the two memory cell arrays, respectively, and each including a plurality of reference cells, the reference cells having a reference value, and a sense amplifier shared by the two memory cell arrays and detecting data in an accessed memory cell by use of a reference cell array corresponding to a second memory cell array different from a first memory cell array including the accessed memory cell. In reading the data, a particular reference cell in one reference cell array is always activated for an address space based on one memory cell array as a unit.

Abstract: An object is to suppress reading error even in the case where writing and erasing are repeatedly performed. Further, another object is to reduce writing voltage and erasing voltage while increase in the area of a memory transistor is suppressed. A floating gate and a control gate are provided with an insulating film interposed therebetween over a first semiconductor layer for writing operation and erasing operation and a second semiconductor layer for reading operation which are provided over a substrate; injection and release of electrons to and from the floating gate are performed using the first semiconductor layer; and reading is performed using the second semiconductor layer.

Abstract: A multi-port SRAM cell includes cross-coupled inverters each including a pull-up transistor and at least a pair of pull down transistors. The SRAM cell includes first and second access ports coupled to first and second word line conductors, each access port including a first pass gate transistor coupled to the data storage node and a second pass gate transistor coupled to the data bar storage node, each pass gate transistor being coupled to a respective bit line conductor, wherein the pull down transistors of the first inverter are formed in a first active region, the pull down transistors of the second inverter are formed in a second active region, the pass gate transistors coupled to the data storage node are formed in a third active region and the pass gate transistors coupled to the data bar storage node are formed in a fourth active region.

Abstract: Electronic fuse (e-fuse) systems with multiple reprogrammability are provided. In one aspect, a reprogrammable e-fuse system is provided that includes a first e-fuse string; a second e-fuse string; a selector connected to both the first e-fuse string and the second e-fuse string configured to alternately select an e-fuse from the first e-fuse string or the second e-fuse string to be programmed; and a comparator connected to both the first e-fuse string and the second e-fuse string configured to compare a voltage across the first e-fuse string to a voltage across the second e-fuse string to determine a programming state of the e-fuse system.

Abstract: A phase change memory may include an ovonic threshold switch formed over an ovonic memory. In one embodiment, the switch includes a chalcogenide layer that overlaps an underlying electrode. Then, edge damage, due to etching the chalcogenide layer, may be isolated to reduce leakage current.

Abstract: There is provided a semiconductor device that enables high-speed data read and reduces the area of a drive circuit for activating a word line. By signal transmission through a common word line having a low resistance and coupled at a plurality of points to a word line, it is possible to read data at high speed. Further, since the common word line is provided common to a plurality of memory blocks, a word line driver can be provided common to the memory blocks. Further, by disposing a latch circuit, corresponding to a sub-digit line, for holding the active state of the common word line, it is possible to transmit a row selection signal during data write through the common word line and thereby reduce a metal wiring layer.

Abstract: A semiconductor memory device includes a plurality of banks, a first bank selection driving control signal generation unit configured to generate a plurality of first bank selection driving control signals corresponding to the plurality of banks in response to an active command signal and an address signal, a second bank selection driving control signal generation unit configured to generate a plurality of second bank selection driving control signals corresponding to the plurality of banks in response to one of a read command signal and a write command signal and in response to the address signal, and an internal voltage driver configured to selectively drive a plurality of internal voltage terminals corresponding to the plurality of banks in response to the plurality of first bank selection driving control signals and the plurality of second bank selection driving control signals.

Abstract: A non-volatile current-switching magnetic memory element includes a bottom electrode, a pinning layer formed on top of the bottom electrode, and a fixed layer formed on top of the pinning layer. The memory element further includes a tunnel layer formed on top of the pinning layer, a first free layer formed on top of the tunnel layer, a granular film layer formed on top of the first free layer, a second free layer formed on top of the granular film layer, a cap layer formed on top of the second free layer, and a top electrode formed on top of the cap layer.

Abstract: A charge pump circuit, whose output is connected to a first node, starts a boosting operation after start of a test period. A load current application circuit supplies a load current to the first node during the test period. A voltage of the first node is a write voltage. A memory circuit stops application of the write voltage to a memory cell during the test period, and applies the write voltage to the memory cell after end of the test period. A high voltage detection unit compares the write voltage and a predetermined voltage to determine whether or not the write voltage is increased to the predetermined voltage. If the write voltage is less than the predetermined voltage at the end of the test period, the high voltage detection unit activates a disable signal. If the disable signal is activated, the charge pump circuit stops the boosting operation.

Abstract: In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively.

Abstract: A method of operating a nonvolatile memory device, including a memory cell array, which further includes a drain select transistor, a memory cell string, and a source select transistor coupled between a bit line and a source line, where the method includes precharging the bit line, setting the memory cell string in a ground voltage state, coupling the memory cell string and the bit line together and supplying a read voltage or a verification voltage to a selected memory cell of the memory cell string, and coupling the memory cell string and the source line together in order to change a voltage level of the bit line in response to a threshold voltage of the selected memory cell.

Abstract: A non-volatile semiconductor memory device includes a NAND cell unit including a plurality of electrically rewritable non-volatile memory cells serially connected. The NAND cell unit has one end connected to a bit line via a first selection gate transistor and the other end connected to a source line via a second selection gate transistor. The non-volatile semiconductor memory device also includes a first dummy cell interposed next to the first selection gate transistor in the NAND cell unit. The non-volatile semiconductor memory device additionally includes a second dummy cell interposed next to the second selection gate transistor in the NAND cell unit. In a data write mode, a first voltage applied to a gate of the first dummy cell is higher than or equal to a second voltage applied to a gate of the second dummy cell.

Abstract: An embodiment of the invention provides a memory array including a plurality of bit lines, a plurality of memory cells and a device. Each of the plurality of memory cells has a first node, a second node and a third node, wherein the third node is coupled to one of the plurality of bit lines. The device couples the plurality of bit lines together to form a common node for one of the plurality of memory cells.

Abstract: A data sensing method for sensing data stored in first and second memory cells includes the steps of: setting a first voltage according to a bit-line voltage corresponding to the first memory cell in response to an enabled level of a first clock signal; providing the first voltage as a sensing voltage in response to a disabled level of the first clock signal; comparing the sensing voltage with a reference voltage to generate a first output voltage; setting a second voltage according to a bit-line voltage corresponding to the second memory cell in response to an enabled level of a second clock signal, a phase difference between the first and second clock signals being 180 degrees; providing the second voltage as the sensing voltage in response to a disabled level of the second clock signal; and comparing the sensing voltage with the reference voltage to generate a second output voltage.

Abstract: A memory includes a first and a second bit lines (BL); a first and a second sense nodes (SN); a first transfer gate between the 1st-BL and the 1st-SN; a second transfer gate (TG) between the 2nd-BL and the 2nd-SN; a latch circuit latching data to the 1st and 2nd-SN; a first data line (DQ) from the 1st-SN to outside; and a 2nd-DQ from the 2nd-SN to outside, wherein write data is transmitted from the 1st and 2nd-DQ to the 1st and 2nd-SN corresponding to selected cells before the 1st and 2nd-TG are set to be a conductive state, when writing data into the selected cells to be written out of the cells, and write data in the 1st and 2nd-SN corresponding to the selected cells are started to be written into the selected cells, when the 1st and 2nd-TG are set to be a conductive state.