Abstract: Disclosed is an interface circuit, a chip containing an interface circuit and a manufacturing method thereof. The interface circuit includes an I/O processing sub-circuit, a path selection sub-circuit, and at least two I/O ports. The I/O processing sub-circuit, the path selection sub-circuit, and the at least two I/O ports are electrically connected in sequence. The path selected by the path selection sub-circuit can enable a first and a second electrical signal to be transmitted through the I/O ports that are configured to correspond to the ports of the external device through which the first and second electrical signals are transmitted. That is, the path selection sub-circuit can customize the layout of the signal-input/output I/O ports of the interface circuit according to the layout of the ports of the external device.

Abstract: In some examples, a device includes a built-in self-test for detecting a fault on a light emitting diode (LED) or on a driver for an LED. The device includes a pair of pads that are configured to connect to the LED. The built-in self-test is configured to control the driver to turn on a respective pass switch connected to a pad of the pair of pads. The built-in self-test is configured to then determine a voltage level at each pad of the pair of pads. The built-in self-test can determine whether the fault exists on the LED, across the first anode pad and the first cathode pad, or on the driver based on the voltage level at each pad.

Abstract: A configurable processor singlet is a single die comprising monolithically integrated three-dimensional memory (3D-M) arrays and arithmetic-logic circuits (ALC's). The preferred singlet also comprises an array of configurable computing elements (CCE's). Each CCE comprises at least a 3D-M array, an ALC, and inter-storage-processor (ISP) connections.

Abstract: A configurable processor doublet comprises a pair of face-to-face bonded three-dimensional memory (3D-M) die and processing die. The 3D-M die comprises 3D-M arrays, whereas the processing die comprises arithmetic-logic circuits (ALC's). The preferred doublet also comprises an array of configurable computing elements (CCE's). Each CCE comprises at least a 3D-M array, an ALC, and inter-storage-processor (ISP) connections.

Abstract: In some examples, a device includes a built-in self-test for detecting a fault between a first light emitting diode (LED) and a second LED. The device includes a first pair of pads configured to connect to the first LED and a second pair of pads configured to connect to the second LED. The built-in self-test is configured to control a first driver and a second driver to turn on, one-by-one, respective pass switches connected to the first and second pairs of pads. The built-in self-test is configured to then determine the first and second forward voltages across the first and second LEDs. The built-in self-test can determine whether the fault exists between the first and second LEDs based on the forward voltages.

Abstract: Disclosed is a protective device of a lighting assembly, the lighting assembly comprising at least one LED, a first end lamp base and a second end lamp base, and the protective device including a first detecting module and a second detecting module and a driving module. The first detecting module and the second detecting are configured to detect a connection state of the first end lamp base to output a first detecting signal, and a connection state of the second end lamp base to output a second detecting signal. The driving module is connected to the at least one LED and configured to control the at least one LED to work based on the first detecting signal and the second detecting signal. The present disclosure also discloses a lighting assembly including the protective device and a protective method of the lighting assembly.

Abstract: The present disclosure relates to modular transceiver-based network circuitries that may include internal configurable interfaces or gaskets. The configurable gaskets may facilitate integration of the network circuitries in electronic devices by providing a transparent interface to processing circuitries coupled to the network circuitries. Moreover, the configurable gaskets may also have a floorplan layout (e.g., a chiplet layout) that may facilitate coupling of multiple network circuitries to a single processing circuitry, in a modular manner.

Abstract: A ground leakage current power supply is provided that includes a hot node coupled to a hot wire of an AC power source, and an earth ground node coupled to an earth ground, where a neutral wire is not present. The supply also has an energy storage component and a low voltage power supply. The energy storage component is coupled in series to a current limiter that is coupled to receive rectified power from the AC power source, where the current limiter enables the energy storage component to charge to a voltage value at a rate that limits ground leakage current. The low voltage power supply includes a linear voltage regulator and is coupled to the energy storage component and to a return node, the return node providing a return reference voltage, and is configured to receive the voltage value, and is configured generate a regulated output voltage that is referenced to the return reference voltage.

Abstract: An LED tube lamp comprises a glass tube, two end caps coupled to a respective end of the glass tube, an LED light strip attached to an inner circumferential surface of the glass tube, a protective layer disposed on a surface of the LED light strip, a plurality of LED light sources mounted on the LED light strip, two first soldering pads arranged at an end of the LED light strip, two notches formed at an edge of the end of the LED light strip, a power supply module configured to drive the plurality of LED light sources. The protective layer comprises two openings to expose the two first soldering pads. The power supply module comprises a printed circuit board comprising two second soldering pads and each of the two first soldering pad soldered to the respective second soldering pad by a solder. The solder is disposed on the first soldering pad, the corresponding second soldering pad and in the corresponding notch.

Abstract: A retrofit tubular lighting device (7), comprising first (p1, p2) and second connection pins (p3, p4), a first (12) and second filament emulation circuit (13) coupled to the first (p1, p2) and second connection pins (p3, p4) respectively, a lighting element (4), a driver (3) coupled to the first (12) and second filament emulation circuit (13), a battery (5) and the lighting element (4). The driver (3) provides a charge to the lighting element (4) and the battery (5). The battery (5) stores the charge provided by the driver (3) and provides charge to the lighting element (4). A communication device sends a first charging signal to another lighting device comprising a further battery and coupled to the electronic ballast, when the charge of the battery (5) is below a first threshold. The communication device receives a second charging signal from the other lighting device, wherein the second charging signal indicates that a further charge of the further battery is below a second threshold.

Abstract: A backlight, a control method of the backlight, and a display device are provided. The backlight includes a plurality of light-emitting modules arranged in an array. Each of the light-emitting modules includes a light-emitting unit and a control circuit. The control circuit includes n branches, a controller, and a current module. Each branch of the n branches is connected in series with the light-emitting unit and the current module. Each branch is provided with a switch, and the controller is separately connected to the switch on each branch.

Abstract: The present invention provides a disposal with sensor and light system where a sensor detects a presence of a user in one area near the disposal and a light illuminates another area near the disposal.

Abstract: A system for testing wireless communication equipment which includes a beamforming antenna, the system comprising: a probe for coupling an antenna element of the beamforming antenna of the wireless communication equipment to be tested to a test and measurement unit; and a lid configured to cover the beamforming antenna, wherein the lid is provided with a port for receiving the probe, such that the probe couples to the antenna element.

Abstract: Technologies for providing a scalable architecture to efficiently perform compute operations in memory include a memory having media access circuitry coupled to a memory media. The media access circuitry is to access data from the memory media to perform a requested operation, perform, with each of multiple compute logic units included in the media access circuitry, the requested operation concurrently on the accessed data, and write, to the memory media, resultant data produced from execution of the requested operation.

Abstract: An LED tube lamp comprises an LED module for emitting light; and a ballast interface circuit coupled to the LED module and comprising a thyristor device configured to determine whether an input external driving signal is a high frequency or high voltage signal. When the external driving signal is determined to be a high frequency or high voltage signal, the ballast interface circuit causes current conduction in the LED module for emitting light, and specifically the thyristor device is configured to conduct current upon the external driving signal being input. The ballast interface circuit further comprises a transistor, an inductor, and a resistor connected to each other; and the inductor is coupled between a terminal of the thyristor device and the LED module. Upon the thyristor device being turned on a current flowing through the inductor and the transistor maintains the conduction state of the thyristor device.

Abstract: A lighting unit which includes a driver, a light source and a buffer capacitor of an auxiliary circuit (such as an independent active electronic circuit). The charging current allowed to flow to the buffer capacitor is controlled based on sensed currents flowing to the light source thereby to control the charging current of the buffer capacitor. In this way, large inrush currents caused by the use of a large buffer capacitor at the output of the driver can be avoided and the triggering of a fault detection mode within the driver can be prevented. Furthermore this circuit ensures that the driver is operated within the specification limits during start-up.

Abstract: The present invention relates to a wire embedding head for forming an antenna cable comprising multiple wires and, more particularly, to a wire embedding head for forming an antenna cable comprising multiple wires, which: allows wires to be embedded in a substrate while being connected in a parallel pattern by means of an ultrasonic wave generating part and multiple wire embedding horns so as to form an antenna cable; and enables an arrangement of the antenna cable embedded in the substrate and connected in a parallel pattern to be formed very densely by using a distinguishing coupling relation between the substrate and the multiple wires embedded in the substrate.

Abstract: According to the embodiments, the controller includes a first receiving unit and a second receiving unit, and is capable of controlling a device to be controlled. The controller is in a first mode when in a first action state prior to the first receiving unit receiving a first operation, and the controller transitions to a second mode when the first receiving unit receives the first operation. The second receiving unit is in the first optical state in the first action state. The second receiving unit is in a second optical state in a second action state prior to the second receiving unit receiving a second operation in the second mode. The second receiving unit is in a third optical state in a third action state in which the second receiving unit has received the second operation in the second mode. The second optical state differs from the second optical state. The third optical state differs from the first optical state and differs from the third optical state.

Abstract: Systems, methods and devices are descried. A method of controlling a segmented flash having a plurality of flash segments each arranged to illuminate a portion of the scene includes determining an amount of light for illuminating each portion of the scene, measuring forward voltages of each of the flash segments, and adjusting a brightness of each of the flash segments to the determined amount of light for illuminating each portion of the scene. The adjusting is performed by at least one of adjusting a magnitude of a drive current to each of the flash segments, adjusting a duty cycle of the drive current to each of the flash segments, or scheduling a dummy flash, based at least in part on the measured forward voltages.

Abstract: A retrofit Light Emitting Diode, LED, lighting device for connection to a ballast, wherein said ballast is arranged to provide for a ballast current, said retrofit LED lighting device comprising at least one LED for emitting light, a rectifier arranged for rectifying said ballast current and for providing a lamp current to said at least one LED, a shunt switch for shunting said at least one LED thereby preventing said lamp current to flow through said at least one LED, a control unit for controlling said shunt switch, wherein said control unit is arranged to detect a particular amplitude offset current level in one of said ballast current and said lamp current, said particular amplitude offset current level being a particular non-zero value of said ballast current or said lamp current and to activate said shunt switch triggered by said detection.