Abstract: A foldable display device includes a first plate member, a second plate member, a hinge assembly, and a flexible display member. The first plate member includes a first display surface and a first side. The second plate member includes a second display surface and a second side. The first side and the second side are close to each other. A first hinge member and a second hinge member of the hinge assembly are respectively connected to the first plate member and the second plate member. The flexible display member includes a first portion, a second portion, and a middle portion. The first portion contacts the first display surface. The second portion contacts the second display surface. The middle portion is between the first side and the second side. The first and second hinge members rotate relatively to have the flexible display member spread to be flat.

Abstract: Various computing devices, thermal solutions and enclosures are disclosed. In one aspect, a computing device enclosure is provided that includes a first compartment that has a first upper side and is adapted to house the computing device and a liquid cooling device. The computing device has at least one heat generating component operable to transfer heat to the liquid cooling device. A second compartment has a lower side that includes an air inlet and a second upper side that has an air outlet. The second compartment is adapted to house a head exchanger to remove hear transferred to the liquid cooling device. A hub connects the first second compartment to the first compartment in spaced apart relation so as to leave a gap between the first upper side and the lower side.

Abstract: In some embodiments, cooling devices with metal hydrides are disclosed.

Abstract: A troubleshooting compartment for a motor control center unit, provides electrical access to test control points inside the motor control center unit, without exposing the operator to electrical hazards from the main line-voltage components inside the motor control center unit. The troubleshooting compartment comprises an accessible compartment contained within a motor control center unit, which is separate from a main line-voltage compartment of the motor control center unit, the accessible compartment having an access side to enable operator access to the accessible compartment without need to open the main line-voltage compartment; an accessible compartment door covering the access side of the accessible compartment from a front side of the motor control center unit; and feed-through terminals mounted within the accessible compartment, for test points and pilot devices operating at low, control voltages.

Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction.

Abstract: A portable computing device is disclosed. The portable computing device includes a retention member that provides a force to a flexible circuit disposed in a top portion and a bottom portion of the portable computing device. The retention member limits movement of the flexible circuit when, for example, the flexible circuit receives a force in response to the top portion pivoting with respect to the bottom portion. The bottom portion of the portable computing devices includes a bottom case having multiple terraced regions. The terraced regions allow the bottom portion to receive additional internal components, such as one or more battery packs, a main logic board, and/or one or more speaker modules. The battery packs are secured to the terraced region via adhesive rings. Although the terraced regions require additional material removed from the bottom case, the internal components secured to the bottom case provide structural support.

Abstract: An electrical distribution apparatus includes a power connector for coupling to a cable. The power connector includes a first end and a second end each defining an opening arranged to receive the cable. A barrier is removably coupled to a portion of the electrical distribution apparatus and selectively adjustable between a first position and a second position, the barrier arranged to prevent insertion of the cable into the first end opening and to permit insertion of the cable into the second end opening when the barrier is in the first position, the barrier arranged to prevent insertion of the cable into the second end opening and to permit insertion of the cable into the first end opening when the barrier is in the second position.

Abstract: A chassis in a device housing includes a housing of the housing, a hard disk drive, and a fastening apparatus. The housing includes a backplane and a side plate defining an opening. The hard disk drive defining an opening is electrically coupled to the backplane. The fastening apparatus includes a connecting member and a fastening member. The connecting member includes a connecting post. The connecting post defines a mounting hole. Two locking protrusions protrude from the connecting post. A raised portion protrudes from an inside wall of the mounting hole. The fastening member includes an urging portion. The fastening apparatus is coupled between the hard disk drive and the side plate. The fastening member is mounted in the mounting hole, and the raised portion is urged by the urging portions. The connecting post undergoes elastic deformation, and the locking protrusions are locked in the openings.

Abstract: A circuit board arrangement includes a deflector configured to guide flow over an electronic component on a circuit board disposed in an air flow. A method for thermal management of a circuit board includes modifying an air flow over the circuit board to increase speed or direction the air flow over a component of the circuit board using a deflector.

Abstract: A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

Abstract: A direct-interface liquid-cooled (DL) Rack Information Handling System (RIHS) includes liquid cooled (LC) nodes each comprising a chassis received in a respective chassis-receiving bay of a rack and containing heat-generating functional components. Each LC node is configured with a system of conduits to receive direct injection of cooling liquid to regulate the ambient temperature of the node and provide cooling to the functional components inside the node by removing heat generated by the heat-generating functional components. A cooling subsystem has a liquid rail formed by more than one node-to-node, Modular Liquid Distribution (MLD) conduits, each including first and second terminal connections attached on opposite ends of a central conduit that can be rack-unit dimensioned. The MLD conduits seal to and enable fluid transfer between a port of a selected LC node and a port of an adjacent LC node.

Abstract: A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

Abstract: A device is disclosed as including a hinge disposed intermediate of a display and a keyboard. the hinge includes an at least partially cylindrical housing and a friction band, the hinge providing rotation of the display and the keyboard around a pivot axis extending longitudinally along the hinge. The friction band comprises one or more compression members configured to extend around the pivot axis and in a compressed configuration with an inner surface of the housing to create friction between the inner surface of the housing and an outer surface of the one or more compression members.

Abstract: A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow.

Abstract: Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.

Abstract: Disclosed is system, method, and rack stand portion for the advantageous cooling of computer equipment 305. The rack stand 200 includes a hollow body 210, 212 that may be formed of cartridges 2416. Gas from an airflow source 5204 is guided into the rack stand body and then into a sealed case of the computer equipment. Air flow is then guided out of the computer equipment for recirculation, exhaust, or other purpose.

Abstract: Method and apparatus for populating and operating a storage enclosure carrier with multiple hot swappable storage devices. In some embodiments, a carrier housing having length, width and thickness dimensions is adapted to accommodate at least one hard disc drive (HDD) having a selected HDD form factor and configured for engagement in a storage enclosure housing. A plurality of solid state drives (SSDs) each conforming to a selected SSD form factor are supported within the length, width and thickness dimensions of the carrier housing. Each of the SSDs is individually retractable from a front facing portion of the carrier housing without removal of the carrier housing from the storage enclosure housing.

Abstract: Disclosed is a heat dissipation apparatus and an electronic device. The heat dissipation apparatus is suitable for a processor in an electronic device. The heat dissipation apparatus includes a housing including an inlet for introducing a cooling fluid into the housing and an outlet for allowing the cooling fluid to exit from the housing. The heat dissipation apparatus includes a heat dissipating member disposed in the housing. The heat dissipation apparatus includes a buffer member disposed between the inlet and the heat dissipating member. The buffer member includes through-holes for inhibiting a flow of the cooling liquid from the inlet of the housing to the dissipating member to transfer heat across the heat dissipating member to the cooling fluid. The electronic device may include a processor and the heat dissipation apparatus.

Abstract: Provided are a composite sheet and a mobile terminal having the same, in which the composite sheet includes: a first heat insulation member having a plurality of fine pores to form air pockets for thermal insulation; and a second insulation member which is laminated on the first insulation member, and which facilitates a horizontal direction transfer of heat conducted hut suppresses a vertical direction transfer thereof.

Abstract: A cold worked stainless steel bezel for a portable electronic device. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring. The bezel is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints. the portable electronic device may include a personal media device, a mobile telephone, or any other suitable device or combination thereof.