Abstract: Various aspects of the disclosure relate to rate matching techniques for block encoding. In some aspects, a decision regarding whether to use repetition-based rate matching or puncture-based rate matching is made based on a block size of information being encoded. In some aspects, repetition-based rate matching uses a bit-reversal permutation technique.

Abstract: An integrated circuit (IC) includes first and scan latches that are enabled to load data during a first part of a clock period. A clocking circuit outputs latch clocks with one latch clock driven to an active state during a second part of the clock period dependent on a first address input. A set of storage elements have inputs coupled to the output of the first scan latch and are respectively coupled to a latch clock to load data during a time that their respective latch clock is in an active state. A selector circuit is coupled to outputs of the first set of storage elements and outputs a value from one output based on a second address input. The second scan latch then loads data from the selector's output during the first part of the input clock period.

Abstract: Methods, systems, and devices for a memory device with an error correction memory device with fast data access are described. For example, during a read operation, a memory device may be configured to output the data indicated by the read operation concurrent with performing an error correction operation. If the memory device detects an error, the memory device may indicate the error to a host device and, in some cases, output the corrected data to the host device. During a write operation, the memory device may store error detection or correction information associated with data to be stored at the memory device. The memory device may, in some cases, store error detection or correction information generated by the host device.

Abstract: Aspects present herein relate to methods and devices for wireless communication including an apparatus, e.g., a UE and/or a base station. The apparatus may encode a plurality of bits associated with QAM, the plurality of bits corresponding to a circular buffer associated with at least one RV, the plurality of bits including a plurality of systematic bits. The apparatus may also transfer the plurality of bits from the circular buffer associated with the at least one RV to a first buffer and a second buffer. Additionally, the apparatus may map the plurality of bits from the first buffer and the second buffer to a plurality of modulation symbols.

Abstract: A system includes a first integrated circuit including a first interface circuit with a first transmit pin and a first receive pin, and a first test circuit. The system also includes a second integrated circuit including a second interface circuit with a second receive pin coupled to the first transmit pin, and a second transmit pin coupled to the first receive pin. The second integrated circuit further includes a second test circuit configured to route signals from the second receive pin to the second transmit pin, such that the sent test signal is received by the second receive pin, bypasses the second test circuit, and is routed to the second transmit pin. The first test circuit is further configured to receive the routed test signal on the first receive pin via the second conductive path.

Abstract: Provided test method and apparatus of communication chip, device and medium. The test method of communication chip includes receiving end test method and transmitting end test method. The receiving end test method of the communication chip includes: an idle time slot of the receiving end of the communication chip is detected in a running process of the communication chip; a test vector is generated, and a standard result corresponding to the test vector is generated; a data frame containing the test vector is constructed, and the data frame is sent to the receiving end of the communication chip in the idle time slot to enable the receiving end of the communication chip to process the data frame; and a chip processing result uploaded by the receiving end of the communication chip is received, and the standard result is compared with the chip processing result.

Abstract: An approach is proposed to support schedule-based I/O multiplexing for scan testing of an IC. A plurality of I/Os are assigned to a plurality of blocks in the IC for scan testing based on a set of slots under a set of schedules. Each of the set of slots includes a fixed number of scan input pins/pads and scan output pins/pads of the IC. Each slot is then assigned to a specific block on the IC for the scan test until all of the slots available are utilized. The group of assigned blocks is referred to as a schedule, and all of these blocks belonging to this schedule are scan tested in parallel at the same time. The remaining blocks on the IC are also assigned to the slots until all blocks on the IC are assigned to a schedule to be scan tested.

Abstract: The present technology relates to an electronic device. According to the present technology, a memory device may include memory cells respectively connected to a plurality of word lines, a peripheral circuit configured to perform a read operation of reading data stored in selected memory cells connected to a selected word line among the memory cells, and a read operation controller configured to control the peripheral circuit to apply a pass voltage to adjacent word lines adjacent to the selected word line during the read operation, discharge the pass voltage to a target pass voltage less than the pass voltage after a predetermined time elapses, and obtain data stored in the selected memory cells through bit lines connected to the selected memory cells after a target read time elapses, after a voltage applied to the adjacent word lines is discharged to the target pass voltage.

Abstract: A transmitting apparatus and a receiving apparatus are provided. The transmitting apparatus includes: an encoder configured to generate a low density parity check (LDPC) codeword by performing LDPC encoding; an interleaver configured to interleave the LDPC codeword; and a modulator configured to modulate the interleaved LDPC codeword according to a modulation method to generate a modulation symbol. The interleaver is formed of a plurality of columns each including a plurality of rows and includes a block interleaver configured to divide each of the plurality of columns into a first part and a second part and interleave the LDPC codeword, the number of rows constituting each column divided into the first part is determined differently depending upon the modulation method, wherein the number of rows constituting each column divided into the second part is determined depending upon the number of rows constituting each column divided into the first part.

Abstract: A memory device includes a memory cell array including normal memory cells and redundant memory cells; first page buffers connected to the normal memory cells through first bit lines including a first bit line group and a second bit line group and arranged in a first area corresponding to the first bit lines in a line in a first direction; and second page buffers connected to the redundant memory cells through second bit lines including a third bit line group and a fourth bit line group and arranged in a second area corresponding to the second bit lines in a line in the first direction, wherein, when at least one normal memory cell connected to the first bit line group is determined as a defective cell, normal memory cells connected to the first bit line group are replaced with redundant memory cells connected to the third bit line group.

Abstract: In one embodiment, a device comprises: a first die having disposed thereon a first plurality of latches wherein ones of the first plurality of latches are operatively connected to an adjacent one of the first plurality of latches; and a second die having disposed thereon a second plurality of latches wherein ones of the second plurality of latches are operatively connected to an adjacent one of the second plurality of latches. Each latch of the first plurality of latches on said first die corresponds to a latch in the second plurality of latches on said second die. Each set of corresponding latches are operatively connected. A scan path comprises a closed loop comprising each of said first and second plurality of latches. One of the second plurality of latches is operatively connected to another one of the second plurality of latches via an inverter.

Abstract: An optical transmitter includes a first encoder, a first interleaver, a second encoder, a mapper, a second interleaver, and a frame generator. The first encoder is configured to encode data using a staircase code to generate first codewords. The first interleaver is configured to interleave the first codewords using convolutional interleaving to spread a transmission order of the first codewords. The second encoder is configured to encode the interleaved first codewords using a second code to generate second codewords. The mapper is configured to map the second codewords to transmit symbols. The second interleaver is configured to interleave the transmit symbols to distribute the transmit symbols between pilot symbols. The frame generator is configured to generate a transmit frame including the interleaved transmit symbols and the pilot symbols.

Abstract: A method for detecting perturbations in a logic circuit including a plurality of datapaths coordinated by a clock signal and at least one test circuit having a programmable length datapath for varying a test propagation delay. The test circuit further including inputs, an output and an error generator for providing an error in case that the output is different than an expected output for the inputs. The test circuit having a calibration mode including determining a critical propagation delay by varying the programmable length datapath until the error generator outputs an error, adjusting the programmable length datapath to include therein a tolerance delay, and switching into a detection mode configured to detect a perturbation in the logic circuit along the programmable length datapath in case the error generator outputs an error.

Abstract: Embodiments of the present disclosure provide a test method and apparatus for a control chip, and an electronic device, which relate to the field of semiconductor device test technologies. The control chip includes a built-in self-test BIST circuit. The method is performed by the BIST circuit. The method includes: reading first test vectors stored in a first target memory chip; sending the first test vectors to the control chip; receiving first output information returned by the control chip in response to the first test vectors; and acquiring a first test result of the control chip based on the first output information and the first test vectors corresponding to the first output information. By means of the technical solutions provided in the embodiments of the present disclosure, so that a storage space for test vectors can be enlarged, and the test efficiency can be increased.

Abstract: Codewords of an error correcting code can be received. The codewords can be separated into multiple segments. The segments of the codewords can be distributed in an error correcting layout across a plurality of dies where at least a portion of the error correcting (EC) layout constitutes a first layout in the form of a Latin Square.

Abstract: An automated test equipment (ATE) apparatus comprising a tester processor operable to generate commands and data for coordinating testing of a plurality of devices under test (DUTs). The ATE further comprises a field programmable gate array (FPGA) communicatively coupled to the tester processor, wherein the FPGA comprises routing logic operable to route signals associated with the commands and data in the FPGA based on a type of the device under test (DUT). Further, the ATE comprises a connector module communicatively coupled to the FPGA comprising a socket to which the DUT connects and further comprising circuitry for routing the signals to a set of pins on the DUT, wherein the set of pins are associated with a first type of DUT. The circuitry can support multiple different DUT types having a common form factor but different pinout assignments.

Abstract: A memory module is operable in a computer system to communicate data with a system memory controller via a system memory bus. The memory module comprises a plurality of memory devices mounted on a circuit board, a data module mounted on the circuit board and coupled between the plurality of memory devices and the system memory bus, and a control circuit mounted on the circuit board and coupled to the data module, the plurality of memory devices, and the system memory bus. The data module includes a plurality of data handlers in a plurality of integrated circuits. The memory module is operable in any of a plurality of modes, including a first mode and a second mode. The plurality of memory devices in the first mode is accessed by the system memory controller for normal memory read or write operations.

Abstract: Systems and methods are provided for testing a Device Under Test (DUT) in its working environment. A control computer is coupled to an air compressor and generates a temperature control signal that is provided to the air compressor to generate an amount of hot air or cold air to set the temperature of the DUT's working environment to a desired test temperature. The control computer also generates at least one test signal that is sent to a hardware test element for testing at least one memory component of the DUT at the desired test temperature and obtaining test results. The control computer analyzes the test results to determine a parameter adjustment for the at least one memory element so that it operates in a stable manner at the test temperature.

Abstract: Example embodiments relate to low-overhead, bidirectional error checking for a serial peripheral interface. An example device includes an integrated circuit. The device also includes a serial peripheral interface (SPI) with a Master In Slave Out (MISO) channel and a Master Out Slave In (MOSI) channel. The MOSI channel is configured to receive a write address, payload data, and a forward error-checking code usable to identify data corruption within the write address or the payload data. The integrated circuit is configured to calculate and provide a reverse error-checking code usable to identify data corruption within the write address or the payload data. Additionally, the integrated circuit is configured to compare the forward error-checking code to the reverse error-checking code. Further, the integrated circuit is configured to write, to the write address if the forward error-checking code matches the reverse error-checking code, the payload data.

Abstract: A temperature-accelerated solid-state storage testing method includes writing data to a storage system and subjecting the storage system to a first temperature range for a first time period that is equivalent to operation at a lower/second temperature for a greater/second time period. Subsequently, the data from the storage system is read within a third time period at a third temperature range to generate first test data. The storage system is then subjected to the first temperature range for a fourth time period that was reduced relative to the first time period based on the reading of the data to generate the first test data causing the operation of storage system to be equivalent to operating at the second temperature range for a fifth time period. Subsequently the data from the storage system is read within the third time period at the third temperature range to generate second test data.